AAT2554IRN-CAP-T1

AAT2554 ANALOGICTECH | Alldatasheet

Document overview

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Technical content

Features

• Battery Charger: — Input Voltage Range: 4V to 6.5V — Programmable Charging Current up to 500mA — Highly Integrated Battery Charger
• Charging Device
• Reverse Blocking Diode
• Step-Down Converter: — Input Voltage Range: 2.7V to 5.5V — Output Voltage Range: 0.6V to V IN — 250mA Output Current — Up to 96% Efficiency — 30µA Quiescent Current — 1.5MHz Switching Frequency — 100µs Start-Up Time
• Linear Regulator: — 300mA Output Current — Low Dropout: 400mV at 300mA — Fast Line and Load Transient Response — High Accuracy: ±1.5% — 70µA Quiescent Current
• Short-Circuit, Over-Temperature, and Current Limit Protection
• TDFN34-16 Package
• -40°C to +85°C Temperature Range

Applications

• Bluetooth ® Headsets
• Cellular Phones
• Handheld Instruments
• MP3 and Portable Music Players
• PDAs and Handheld Computers
• Portable Media Players AAT2554 Total Power Solution for Portable Applications Typical Application BATT- ADP GND BAT ISET VINB VINA ENB ENA BATT+AAT2554 Adapter/USB Input STAT EN_BATEnable RSET C Battery Pack OUT System L= 3.0µH FB LX RFB2 RFB1 COUTB VOUTB OUTA COUTA VOUTA 2554.2007.01.1.2 1 SystemPower™

(Top View) ENB VINA OUTA FB GND EN_BAT ISET BAT GND ENA GND VINB LX ADP GND STAT Pin # Symbol Function 1 FB Feedback input. This pin must be connected directly to an external resistor divider. Nominal voltage is 0.6V. 2, 10, 12, 14 GND Ground. 3 ENB Enable pin for the step-down converter. When connected to logic low, the step-down converter is disabled and consumes less than 1µA of current. When connected to logic high, the converter resumes normal operation. 4 VINA Linear regulator input voltage. Connect a 1µF or greater capacitor from this pin to ground. 5 OUTA Linear regulator output. Connect a 2.2µF capacitor from this pin to ground. 6 EN_BAT Enable pin for the battery charger. When connected to logic low, the battery charger is disabled and consumes less than 1µA of current. When connected to logic high, the charger resumes normal operation. 7 ISET Charge current set point. Connect a resistor from this pin to ground. Refer to typical characteristics curves for resistor selection. 8 BAT Battery charging and sensing. 9 STAT Charge status input. Open drain status output. 11 ADP Input for USB/adapter charger. 13 ENA Enable pin for the linear regulator. When connected to logic low, the regulator is dis- abled and consumes less than 1µA of current. When connected to logic high, it resumes normal operation. 15 LX Output of the step-down converter. Connect the inductor to this pin. Internally, it is connected to the drain of both high- and low-side MOSFETs. 16 VINB Input voltage for the step-down converter. EP Exposed paddle (bottom): connect to ground directly beneath the package. AAT2554 Total Power Solution for Portable Applications 2 2554.2007.01.1.2

Symbol Description Value Units PD Maximum Power Dissipation 2.0 W θJA Thermal Resistance2 50 °C/W Symbol Description Value Units VINA, VINB Input Voltage to GND 6.0 V VADP Adapter Voltage to GND -0.3 to 7.5 V VLX LX to GND -0.3 to V IN + 0.3 V VFB FB to GND -0.3 to V IN + 0.3 V VEN ENA, ENB, EN_BAT to GND -0.3 to 6.0 V VX BAT, ISET, STAT -0.3 to V ADP + 0.3 V TJ Operating Junction Temperature Range -40 to 150 °C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 300 °C AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 3 1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at condi- tions other than the operating conditions specified is not implied. Only one Absolute Maximum Rating should be applied at any one time. 2. Mounted on an FR4 board.

Electrical Characteristics1 VINB = 3.6V; TA = -40°C to +85°C, unless otherwise noted. Typical values are T A = 25°C. Symbol Description Conditions Min Typ Max Units Step-Down Converter VIN Input Voltage 2.7 5.5 V VINB Rising 2.7 V VUVLO UVLO Threshold Hysteresis 200 mV VINB Falling 1.8 V VOUT Output Voltage Tolerance2 IOUTB = 0 to 250mA, -3.0 3.0 % VINB = 2.7V to 5.5V VOUT Output Voltage Range 0.6 V INB V IQ Quiescent Current No Load 30 µA ISHDN Shutdown Current ENB = GND 1.0 µA ILIM P-Channel Current Limit 600 mA RDS(ON)H High-Side Switch On Resistance 0.59 Ω RDS(ON)L Low-Side Switch On Resistance 0.42 Ω ILXLEAK LX Leakage Current V INB = 5.5V, VLX = 0 to VINB 1.0 µA ΔVLinereg/ΔVIN Line Regulation V INB = 2.7V to 5.5V 0.2 %/V VFB Feedback Threshold Voltage Accuracy V INB = 3.6V 0.591 0.6 0.609 V IFB FB Leakage Current V OUTB = 1.0V 0.2 µA FOSC Oscillator Frequency 1.5 MHz TS Startup Time From Enable to Output 100 µsRegulation TSD Over-Temperature Shutdown Threshold 140 °C THYS Over-Temperature Shutdown Hysteresis 15 °C VEN(L) Enable Threshold Low 0.6 V VEN(H) Enable Threshold High 1.4 V IEN Input Low Current V INB = VENB = 5.5V -1.0 1.0 µA AAT2554 Total Power Solution for Portable Applications 4 2554.2007.01.1.2 1. The AAT2554 is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range and is assu red by design, characterization, and correlation with statistical process controls. 2. Output voltage tolerance is independent of feedback resistor network accuracy.

Electrical Characteristics1 VINA = VOUT(NOM) + 1V for VOUT options greater than 1.5V. IOUT = 1mA, COUT = 2.2µF, CIN = 1µF, TA = -40°C to +85°C, unless otherwise noted. Typical values are TA = 25°C. Symbol Description Conditions Min Typ Max Units Linear Regulator VOUT Output Voltage Tolerance IOUTA = 1mA T A = 25°C -1.5 1.5 %to 300mA T A = -40°C to +85°C -2.5 2.5 VIN Input Voltage VOUT + 5.5 VVDO VDO Dropout Voltage3 IOUTA = 300mA 400 600 mV ΔVOUT/ Line Regulation V INA = VOUTA + 1 to 5.0V 0.09 %/VVOUT*ΔVIN ΔVOUT(Line) Dynamic Line Regulation IOUTA = 300mA, VINA = VOUTA + 1 2.5 mVto VOUTA + 2, TR/TF = 2µs ΔVOUT(Load) Dynamic Load Regulation I OUTA = 1mA to 300mA, TR <5µs 60 mV IOUT Output Current V OUTA > 1.2V 300 mA ISC Short-Circuit Current V OUTA < 0.4V 600 mA IQ Quiescent Current V INA = 5V; ENA = VIN 70 125 µA ISHDN Shutdown Current V INA = 5V; ENA = 0V 1.0 µA 1kHz 65 PSRR Power Supply Rejection IOUTA =10mA 10kHz 45 dBRatio 1MHz 43 TSD Over-Temperature 145 °CShutdown Threshold THYS Over-Temperature 12 °CShutdown Hysteresis eN Output Noise 250 µV RMS TC Output Voltage 22 ppm/°CTemperature Coefficient TEN_DLY Enable Time Delay 15 µs VEN(L) Enable Threshold Low 0.6 V VEN(H) Enable Threshold High 1.5 V IEN Enable Input Current V ENA = 5.5V 1.0 µA AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 5 1. The AAT2554 is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range and is assu red by design, characterization, and correlation with statistical process controls. 2. VDO is defined as VIN - VOUT when VOUT is 98% of nominal. 3. For VOUT <2.3V, VDO = 2.5V - VOUT.

Total Power Solution for Portable Applications 6 2554.2007.01.1.2 Electrical Characteristics1 VADP = 5V; TA = -40°C to +85°C, unless otherwise noted. Typical values are T A = 25°C. Symbol Description Conditions Min Typ Max Units Battery Charger Operation VADP Adapter Voltage Range 4.0 6.5 V VUVLO Under-Voltage Lockout (UVLO) Rising Edge 3 4 V UVLO Hysteresis 150 mV IOP Operating Current Charge Current = 200mA 0.5 1 mA ISHUTDOWN Shutdown Current V BAT = 4.25V, EN_BAT = GND 0.3 1 µA ILEAKAGE Reverse Leakage Current from BAT Pin VBAT = 4V, ADP Pin Open 0.4 2 µA Voltage Regulation VBAT_EOC End of Charge Accuracy 4.158 4.20 4.242 V ΔVCH/VCH Output Charge Voltage Tolerance 0.5 % VMIN Preconditioning Voltage Threshold 2.85 3.0 3.15 V VRCH Battery Recharge Voltage Threshold Measured from V BAT_EOC -0.1 V Current Regulation ICH Charge Current Programmable Range 15 500 mA ΔICH/ICH Charge Current Regulation Tolerance 10 % VSET ISET Pin Voltage 2 V KI_A Current Set Factor: ICH/ISET 800 Charging Devices RDS(ON) Charging Transistor On Resistance V ADP = 5.5V 0.9 1.1 Ω Logic Control/Protection VEN(H) Enable Threshold High 1.6 V VEN(L) Enable Threshold Low 0.4 V VSTAT Output Low Voltage STAT Pin Sinks 4mA 0.4 V ISTAT STAT Pin Current Sink Capability 8 mA VOVP Over-Voltage Protection Threshold 4.4 V ITK/ICHG Pre-Charge Current I CH = 100mA 10 % ITERM/ICHG Charge Termination Threshold Current 10 % 1. The AAT2554 is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range and is assu red by design, characterization, and correlation with statistical process controls.

Typical Characteristics – Step-Down Converter Line Regulation (VOUT = 1.8V) Input Voltage (V) Accuracy (%) -0.3 -0.2 -0.1 0.0 0.1 0.2 0.30.40.50.6 IOUT = 250mA IOUT = 10mA IOUT = 0mA IOUT = 50mA IOUT = 150mA Soft Start (VIN = 3.6V; VOUT = 1.8V; IOUT = 250mA; CFF = 100pF) Enable and Output Voltage (top) (V) Inductor Current (bottom) (A) Time (100µs/div) -5.0 -4.0 -3.0 -2.0 -1.0 0.0 1.02.03.0 4.0 5.0 -0.2 -0.4 0.0 0.2 0.4 0.6 0.81.01.2 1.4 1.6 VEN VO IL DC Load Regulation (VOUT = 1.2V; L = 1.5µH) Output Current (mA) Output Error (%) -1.0 -0.5 0.0 0.5 1.0 0.1 1 10 100 1000 VIN = 5.0V VIN = 5.5V VIN = 2.7V VIN = 4.2V VIN = 3.6V Efficiency vs. Load (VOUT = 1.2V; L = 1.5µH) Output Current (mA) Efficiency (%) 100 0.1 1 10 100 1000 VIN = 3.6V VIN = 2.7V VIN = 5.5V VIN = 4.2V VIN = 5.0V DC Load Regulation (VOUT = 1.8V; L = 3.3µH) Output Current (mA) Output Error (%) -1.0 -0.5 0.00.51.0 0.1 1 10 100 1000 VIN = 4.2V VIN = 3.6V VIN = 2.7V VIN = 5.5V VIN = 5.0V Efficiency vs. Load (VOUT = 1.8V; L = 3.3µH) Output Current (mA) Efficiency (%) 7080 100 0.1 1 10 100 1000 VIN = 3.6V VIN = 2.7V VIN = 4.2V VIN = 5.0V VIN = 5.5V AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 7

Total Power Solution for Portable Applications 8 2554.2007.01.1.2 Typical Characteristics – Step-Down Converter N-Channel RDS(ON) vs. Input Voltage Input Voltage (V) RDS(ON)L (mΩΩ) 300 350 400 450 500 550 600650 700750 120°C 100°C 85°C 25°C P-Channel RDS(ON) vs. Input Voltage Input Voltage (V) RDS(ON)H (mΩΩ) 300 400500 600 700 800 900 1000 120°C 100°C 85°C 25°C No Load Quiescent Current vs. Input Voltage Input Voltage (V) Supply Current (µA) 85°C 25°C -40°C Frequency Variation vs. Input Voltage (VOUT = 1.8V) Input Voltage (V) Frequency Variation (%) -4.0 -3.0-2.0 -1.0 0.0 1.02.0 Switching Frequency Variation vs. Temperature (VIN = 3.6V; VOUT = 1.8V) Temperature (°°C) Variation (%) -10.0 -8.0 -6.0 -4.0 -2.0 0.0 2.0 4.0 6.08.0 10.0 -40 -20 0 20 40 60 80 100 Output Voltage Error vs. Temperature (VINB = 3.6V; VOUT = 1.8V; IOUT = 250mA) Temperature (°°C) Output Error (%) -3.0 -2.0 -1.0 0.0 1.0 2.03.0 -40 -20 0 20 40 60 80 100

Typical Characteristics – Step-Down Converter Output Ripple (VIN = 3.6V; VOUT = 1.8V; IOUT = 250mA) Output Voltage (AC Coupled) (top) (V) Inductor Current (bottom) (A) Time (200ns/div) -120 -100 -80 -60 -40 -20 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VO IL Output Ripple (VIN = 3.6V; VOUT = 1.8V; IOUT = 1mA) Output Voltage (AC Coupled) (top) (mV) Inductor Current (bottom) (A) Time (2µs/div) -120 -100 -80 -60 -40 -20 -0.01 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 VO IL Line Response (VOUT = 1.8V @ 250mA; CFF = 100pF) Output Voltage (top) (V) Input Voltage (bottom) (V) Time (25µs/div) 1.50 1.55 1.60 1.65 1.70 1.75 1.80 1.85 1.90 3.0 3.5 4.0 4.5 5.0 5.56.0 6.5 7.0 VO VIN Load Transient Response (10mA to 250mA; VIN = 3.6V; VOUT = 1.8V; COUT = 4.7µF) Output Voltage (top) (V) Load and Inductor Current (bottom) (200mA/div) Time (25µs/div) 1.2 1.3 1.4 1.5 1.6 1.71.8 1.9 2.0 -0.2 0.0 0.2 0.40.6 0.8 1.0 1.2 1.4 VO ILX IO Load Transient Response (10mA to 250mA; VIN = 3.6V; VOUT = 1.8V; COUT = 4.7µF; CFF = 100pF) Output Voltage (top) (V) Load and Inductor Current (bottom) (200mA/div) Time (25µs/div) 1.2 1.3 1.4 1.5 1.6 1.71.8 1.9 2.0 VO ILX IO AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 9

Total Power Solution for Portable Applications 10 2554.2007.01.1.2 Typical Characteristics – Battery Charger Constant Charging Current vs. Temperature (RSET = 8.06kΩΩ) Temperature (°C) ICH (mA) 190 193 195 198 200 203205 208 210 -50 -25 0 25 50 75 100 Constant Charging Current vs. Supply Voltage (RSET = 8.06kΩΩ) VADP (V) ICH (mA) 170 180 190 200 210220 6.5 VBAT = 3.6V VBAT = 4V VBAT = 3.3V End of Charge Voltage Regulation vs. Temperature (RSET = 8.06kΩΩ) Temperature (°C) VBAT_EOC (V) 4.17 4.18 4.19 4.20 4.21 4.224.23 -50 -25 0 25 50 75 100 End of Charge Battery Voltage vs. Supply Voltage VADP (V) VBAT_EOC (V) 4.194 4.196 4.198 4.200 4.202 4.2044.206 RSET = 8.06kΩ RSET = 31.6kΩ Charging Current vs. Battery Voltage (VADP = 5V) VBAT (V) ICH (mA) 100 200300400 500 600 RSET = 8.06kΩ RSET = 5.36kΩ RSET = 3.24kΩ RSET = 16.2kΩ RSET = 31.6kΩ RSET (kΩΩ) ICH (mA) Constant Charging Current vs. Set Resistor Values 100 1000 1 10 100 1000

Typical Characteristics – Battery Charger Sleep Mode Current vs. Supply Voltage (RSET = 8.06kΩΩ) VADP (V) ISLEEP (nA) 100 200 300 400 500 600 700 800 85°C 25°C -40°C Recharging Threshold Voltage vs. Temperature (RSET = 8.06kΩΩ) Temperature (°C) VRCH (V) 4.02 4.04 4.06 4.08 4.10 4.12 4.14 4.16 4.18 -50 -25 0 25 50 75 100 Preconditioning Charge Current vs. Supply Voltage VADP (V) ITRICKLE (mA) 1020 5060 RSET = 8.06kΩ RSET = 5.36kΩ RSET = 3.24kΩ RSET = 16.2kΩ RSET = 31.6kΩ Preconditioning Charge Current vs. Temperature (RSET = 8.06kΩΩ) Temperature (°C) ITRICKLE (mA) 19.2 19.4 19.6 19.8 20.0 20.2 20.4 20.6 20.8 -50 -25 0 25 50 75 100 Preconditioning Threshold Voltage vs. Temperature (RSET = 8.06kΩΩ) Temperature (°C) VMIN (V) 2.97 2.98 2.99 3.01 3.02 3.03 -50 -25 0 25 50 75 100 Operating Current vs. Temperature (RSET = 8.06kΩΩ) Temperature (°C) IOP (µA) 300 350400 450 500 550 -50 -25 0 25 50 75 100 AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 11

Total Power Solution for Portable Applications 12 2554.2007.01.1.2 Typical Characteristics – Battery Charger VEN(L) vs. Supply Voltage (RSET = 8.06kΩΩ) VADP (V) VEN(L) (V) 0.6 0.7 0.8 0.9 1.1 -40°C 25°C 85°C VEN(H) vs. Supply Voltage (RSET = 8.06kΩΩ) VADP (V) VEN(H) (V) 0.7 0.8 0.9 1.1 1.2 -40°C 25°C 85°C

Typical Characteristics – LDO Regulator Output Voltage vs. Temperature 1.196 1.197 1.198 1.199 1.200 1.201 1.202 1.203 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 Temperature (°C) Output Voltage (V) Quiescent Current vs. Temperature 3040 8090 100 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature (°C) Quiescent Current (μA) Ground Current vs. Input Voltage 3040 6070 2 2.5 3 3.5 4.5 45 Input Voltage (V) Ground Current (µA) IOUT = 0mA IOUT = 10mA IOUT = 50mA IOUT = 150mA IOUT = 300mA Dropout Voltage vs. Output Current 100 150 200 250 300 350 400 450500 0 50 100 150 200 250 300Output Current (mA) Dropout Voltage (mV) 85°C 25°C -40°C Dropout Characteristics 2.0 2.2 2.4 2.62.8 3.0 3.2 IOUT = 300mA IOUT = 150mA IOUT = 100mA IOUT = 50mAIOUT = 10mA IOUT = 0mA Input Voltage (V) Output Voltage (V) Dropout Voltage vs. Temperature 120 180 240 300 360 420 480 540 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 Temperature (°C) Dropout Voltage (mV) IL = 300mA IL = 150mA IL = 100mA IL = 50mA AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 13

Total Power Solution for Portable Applications 14 2554.2007.01.1.2 Typical Characteristics – LDO Regulator Load Transient Response 300mA 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 Time (10µs/div) -100 100 200 300 400 500600 700 800 VOUT IOUT Output Voltage (V) Output Current (mA) Load Transient Response 2.60 2.65 2.702.75 2.80 2.852.90 Time (100µs/div) Output Voltage (V) -100 100 200 300 400500 Output Current (mA) VOUT IOUT Line Transient Response 2.98 2.99 3.00 3.01 3.023.033.04 Time (100µs/div) Input Voltage (V) 456 Output Voltage (V) VIN VOUT Turn-Off Response Time (I = 100mA) Time (50µs/div) VEN (5V/div) VOUT (1V/div) LDO Turn-On Time from Enable (VIN Present) Time (5µs/div) Enable Voltage (top) (V) Output Voltage (bottom) (V) LDO Initial Power-Up Response Time Time (50µs/div) Input Voltage (top) (V) Output Voltage (bottom) (V) 1234567 123456

Typical Characteristics – LDO Regulator VEN(L) and VEN(H) vs. VIN 1.050 1.075 1.100 1.125 1.150 1.175 1.200 1.2251.250 Enable Threshold Voltage (V) VEN(H) VEN(L) Over-Current Protection (EN = GND; ENLDO = VIN) Time (50ms/div) Output Current (mA) -200 200 400 600800 10001200 AAT2554 Total Power Solution for Portable Applications 2554.2007.01.1.2 15

Total Power Solution for Portable Applications Functional Block Diagram Reverse Blocking VREF Constant Current Over- Temperature Protection Charge Control BAT UVLO Over- Current Protection STAT GND ISET ADP EN_BAT VINB LXLogic DH DL - FB ENB Err. Amp. OUTA VINA ENA VREF VREF Functional Description The AAT2554 is a high performance power man- agement IC comprised of a lithium-ion/polymer battery charger, a step-down converter, and a lin- ear regulator. The linear regulator is designed for high-speed turn-on and fast transient response, and good power supply ripple rejection. The step- down converter operates in both fixed and variable frequency modes for high efficiency performance. The switching frequency is 1.5MHz, minimizing the size of the inductor. In light load conditions, the device enters power-saving mode; the switch- ing frequency is reduced and the converter con- sumes 30µA of current, making it ideal for battery- operated applications. Battery Charger The battery charger is designed for single-cell lithi- um-ion/polymer batteries using a constant current and constant voltage algorithm. The battery charg- er operates from the adapter/USB input voltage range from 4V to 6.5V. The adapter/USB charging current level can be programmed up to 500mA for rapid charging applications. A status monitor out- put pin is provided to indicate the battery charge state by directly driving one external LED. Internal device temperature and charging state are fully monitored for fault conditions. In the event of an over-voltage or over-temperature failure, the device will automatically shut down, protecting the charging device, control system, and the battery under charge. Other features include an integrat- ed reverse blocking diode and sense resistor.

Total Power Solution for Portable Applications 2554.2007.01.1.2 17 Switch-Mode Step-Down Converter The step-down converter operates with an input voltage of 2.7V to 5.5V. The switching frequency is 1.5MHz, minimizing the size of the inductor. Under light load conditions, the device enters power-sav- ing mode; the switching frequency is reduced, and the converter consumes 30µA of current, making it ideal for battery-operated applications. The output voltage is programmable from V IN to as low as 0.6V. Power devices are sized for 250mA current capability while maintaining over 90% efficiency at full load. Light load efficiency is maintained at greater than 80% down to 1mA of load current. A high-DC gain error amplifier with internal compen- sation controls the output. It provides excellent transient response and load/line regulation. Linear Regulator The advanced circuit design of the linear regulator has been specifically optimized for very fast start- up. This proprietary CMOS LDO has also been tai- lored for superior transient response characteris- tics. These traits are particularly important for appli- cations that require fast power supply timing. The high-speed turn-on capability is enabled through implementation of a fast-start control cir- cuit which accelerates the power-up behavior of fundamental control and feedback circuits within the LDO regulator. The LDO regulator output has been specifically optimized to function with low- cost, low-ESR ceramic capacitors; however, the design will allow for operation over a wide range of capacitor types. The regulator comes with complete short-circuit and thermal protection. The combination of these two internal protection circuits gives a comprehen- sive safety system to guard against extreme adverse operating conditions. The regulator features an enable/disable function. This pin (ENA) is active high and is compatible with CMOS logic. To assure the LDO regulator will switch on, the ENA turn-on control level must be greater than 1.5V. The LDO regulator will go into the disable shutdown mode when the voltage on the ENA pin falls below 0.6V. If the enable function is not needed in a specific application, it may be tied to VINA to keep the LDO regulator in a continuously on state. Under-Voltage Lockout The AAT2554 has internal circuits for UVLO and power on reset features. If the ADP supply voltage drops below the UVLO threshold, the battery charger will suspend charging and shut down. When power is reapplied to the ADP pin or the UVLO condition recovers, the system charge con- trol will automatically resume charging in the appropriate mode for the condition of the battery. If the input voltage of the step-down converter drops below UVLO, the internal circuit will shut down. Protection Circuitry Over-Voltage Protection An over-voltage protection event is defined as a condition where the voltage on the BAT pin exceeds the over-voltage protection threshold OVP). If this over-voltage condition occurs, the charger control circuitry will shut down the device. The charger will resume normal charging operation after the over-voltage condition is removed. Current Limit, Over-Temperature Protection For overload conditions, the peak input current is lim- ited at the step-down converter. As load impedance decreases and the output voltage falls closer to zero, more power is dissipated internally, which causes the internal die temperature to rise. In this case, the ther- mal protection circuit completely disables switching, which protects the device from damage. The battery charger has a thermal protection circuit which will shut down charging functions when the internal die temperature exceeds the preset ther- mal limit threshold. Once the internal die tempera- ture falls below the thermal limit, normal charging operation will resume. Control Loop The AAT2554 contains a compact, current mode step-down DC/DC controller. The current through the P-channel MOSFET (high side) is sensed for current loop control, as well as short-circuit and overload protection. A fixed slope compensation signal is added to the sensed current to maintain stability for duty cycles greater than 50%. The peak current mode loop appears as a voltage-pro- grammed current source in parallel with the output capacitor. The output of the voltage error amplifier

Total Power Solution for Portable Applications 18 2554.2007.01.1.2 programs the current mode loop for the necessary peak switch current to force a constant output volt- age for all load and line conditions. Internal loop compensation terminates the transconductance voltage error amplifier output. The error amplifier reference is fixed at 0.6V. Battery Charging Operation Battery charging commences only after checking several conditions in order to maintain a safe charg- ing environment. The input supply (ADP) must be above the minimum operating voltage (UVLO) and the enable pin must be high (internally pulled down). When the battery is connected to the BAT pin, the charger checks the condition of the battery and determines which charging mode to apply. If the bat- tery voltage is below V MIN, the charger begins bat- tery pre-conditioning by charging at 10% of the pro- grammed constant current; e.g., if the programmed current is 150mA, then the pre-conditioning current (trickle charge) is 15mA. Pre-conditioning is purely a safety precaution for a deeply discharged cell and will also reduce the power dissipation in the internal series pass MOSFET when the input-output voltage differential is at its highest. Pre-conditioning continues until the battery voltage reaches V MIN (see Figure 1). At this point, the charger begins constant-current charging. The cur- rent level for this mode is programmed using a sin- gle resistor from the ISET pin to ground. Programmed current can be set from a minimum 15mA up to a maximum of 500mA. Constant cur- rent charging will continue until the battery voltage reaches the voltage regulation point, V BAT. When the battery voltage reaches VBAT, the battery charg- er begins constant voltage mode. The regulation voltage is factory programmed to a nominal 4.2V (±0.5%) and will continue charging until the charg- ing current has reduced to 10% of the programmed current. After the charge cycle is complete, the pass device turns off and the device automatically goes into a power-saving sleep mode. During this time, the series pass device will block current in both direc- tions, preventing the battery from discharging through the IC. The battery charger will remain in sleep mode, even if the charger source is disconnected, until one of the following events occurs: the battery ter- minal voltage drops below the V RCH threshold; the charger EN pin is recycled; or the charging source is reconnected. In all cases, the charger will mon- itor all parameters and resume charging in the most appropriate mode. Figure 1: Current vs. Voltage Profile During Charging Phases. Constant Current Charge Phase Constant Voltage Charge Phase Preconditioning Trickle Charge Phase Charge Complete Voltage Constant Current Mode Voltage Threshold Regulated Current Trickle Charge and Termination Threshold I = CC / 10 I = Max CC

Total Power Solution for Portable Applications 2554.2007.01.1.2 19 Battery Charging System Operation Flow Chart Power On Reset Power Input Voltage VADP > VUVLO Fault Conditions Monitoring OV, OT Preconditioning Test VMIN > VBAT Current Phase Test VADP > VBAT Voltage Phase Test IBAT > ITERM No No Yes No Preconditioning (Trickle Charge) Constant Current Charge Mode Constant Voltage Charge Mode Yes Yes Yes Charge Completed Charge Control No Recharge Test VRCH > VBAT Yes No Shut Down Yes Enable YesNo

Total Power Solution for Portable Applications 20 2554.2007.01.1.2

Application Information

The EN_BAT pin is internally pulled down. When pulled to a logic high level, the battery charger is enabled. When left open or pulled to a logic low level, the battery charger is shut down and forced into the sleep state. Charging will be halted regardless of the battery voltage or charging state. When it is re- enabled, the charge control circuit will automatically reset and resume charging functions with the appro- priate charging mode based on the battery charge state and measured cell voltage from the BAT pin. Separate ENA and ENB inputs are provided to independently enable and disable the LDO and step-down converter, respectively. This allows sequencing of the LDO and step-down outputs dur- ing startup. The LDO is enabled when the ENA pin is pulled high. The control and feedback circuits have been optimized for high-speed, monotonic turn-on char- acteristics. The step-down converter is enabled when the ENB pin is pulled high. Soft start increases the inductor current limit point in discrete steps when the input voltage or ENB input is applied. It limits the current surge seen at the input and eliminates output voltage overshoot. When pulled low, the ENB input forces the AAT2554 into a low-power, non-switching state. The total input current during shutdown is less than 1µA. Adapter or USB Power Input Constant current charge levels up to 500mA may be programmed by the user when powered from a sufficient input power source. The battery charger will operate from the adapter input over a 4.0V to 6.5V range. The constant current fast charge cur- rent for the adapter input is set by the R SET resistor connected between ISET and ground. Refer to Table 1 for recommended RSET values for a desired constant current charge level. Programming Charge Current The fast charge constant current charge level is user programmed with a set resistor placed between the ISET pin and ground. The accuracy of the fast charge, as well as the preconditioning trick- le charge current, is dominated by the tolerance of the set resistor used. For this reason, a 1% toler- ance metal film resistor is recommended for the set resistor function. Fast charge constant current lev- els from 15mA to 500mA may be set by selecting the appropriate resistor value from Table 1. Table 1: R SET Values. Figure 2: Constant Charging Current vs. Set Resistor Values. Charge Status Output The AAT2554 provides battery charge status via a status pin. This pin is internally connected to an N- channel open drain MOSFET, which can be used to drive an external LED. The status pin can indicate several conditions, as shown in Table 2. RSET (kΩΩ) ICH (mA) 100 1000 1 10 100 1000 Normal Set Resistor ICHARGE (mA) Value R1 (k ΩΩ) 500 3.24 400 4.12 300 5.36 250 6.49 200 8.06 150 10.7 100 16.2 50 31.6 40 38.3 30 53.6 20 78.7 15 105

Total Power Solution for Portable Applications 22 2554.2007.01.1.2 By substitution, we can derive the maximum charge current before reaching the thermal limit condition (thermal cycling). The maximum charge current is the key factor when designing battery charger applications. In general, the worst condition is the greatest volt- age drop across the IC, when battery voltage is charged up to the preconditioning voltage thresh- old. Figure 4 shows the maximum charge current in different ambient temperatures. Figure 4: Maximum Charging Current Before Thermal Cycling Becomes Active. There are three types of losses associated with the step-down converter: switching losses, conduction losses, and quiescent current losses. Conduction losses are associated with the R DS(ON) characteris- tics of the power output switching devices. Switching losses are dominated by the gate charge of the power output switching devices. At full load, assuming continuous conduction mode (CCM), a simplified form of the losses is given by: I Q is the step-down converter quiescent current. The term tsw is used to estimate the full load step- down converter switching losses. For the condition where the step-down converter is in dropout at 100% duty cycle, the total device dis- sipation reduces to: Since R DS(ON), quiescent current, and switching losses all vary with input voltage, the total losses should be investigated over the complete input voltage range. Given the total losses, the maximum junction tem- perature can be derived from the θJA for the TDFN34-16 package which is 50°C/W. Capacitor Selection Linear Regulator Input Capacitor (C7) An input capacitor greater than 1µF will offer supe- rior input line transient response and maximize power supply ripple rejection. Ceramic, tantalum, or aluminum electrolytic capacitors may be select- ed for C IN. There is no specific capacitor ESR requirement for CIN. However, for 300mA LDO reg- ulator output operation, ceramic capacitors are rec- ommended for C IN due to their inherent capability over tantalum capacitors to withstand input current surges from low impedance sources such as bat- teries in portable devices. Battery Charger Input Capacitor (C3) In general, it is good design practice to place a decoupling capacitor between the ADP pin and GND. An input capacitor in the range of 1µF to 22µF is recommended. If the source supply is unregulated, it may be necessary to increase the capacitance to keep the input voltage above the under-voltage lockout threshold during device enable and when battery charging is initiated. If the adapter input is to be used in a system with an external power supply source, such as a typical AC-to-DC wall adapter, then a C IN capacitor in the range of 10µF should be used. A larger input TJ(MAX) = PTOTAL · ΘJA + TAMB PTOTAL = IO 2 · RDSON(H) + IQ · VIN PTOTAL IO 2 · (RDSON(H) · VO + RDSON(L) · [VIN - VO]) VIN + (tsw · FS · IO + IQ) · VIN VIN (V) ICC(MAX) (mA) 100 200 300 400 500 TA = 85°C TA = 60°C (TJ(MAX) - TA) θJA VIN - VBAT ICH(MAX) = - VIN · IOP (PD(MAX) - VIN · IOP) VIN - VBAT ICH(MAX) =

Total Power Solution for Portable Applications 2554.2007.01.1.2 23 capacitor in this application will minimize switching or power transient effects when the power supply is "hot plugged" in. Step-Down Converter Input Capacitor (C1) Select a 4.7µF to 10µF X7R or X5R ceramic capac- itor for the input. To estimate the required input capacitor size, determine the acceptable input rip- ple level (V PP) and solve for C IN. The calculated value varies with input voltage and is a maximum when VIN is double the output voltage. Always examine the ceramic capacitor DC voltage coefficient characteristics when selecting the prop- er value. For example, the capacitance of a 10µF, 6.3V, X5R ceramic capacitor with 5.0V DC applied is actually about 6µF. The maximum input capacitor RMS current is: The input capacitor RMS ripple current varies with the input and output voltage and will always be less than or equal to half of the total DC load current. for V IN = 2 · VO The term appears in both the input voltage ripple and input capacitor RMS current equations and is a maximum when V O is twice VIN. This is why the input voltage ripple and the input capacitor RMS current ripple are a maximum at 50% duty cycle. The input capacitor provides a low impedance loop for the edges of pulsed current drawn by the step- down converter. Low ESR/ESL X7R and X5R ceramic capacitors are ideal for this function. To minimize stray inductance, the capacitor should be placed as closely as possible to the IC. This keeps the high frequency content of the input current localized, minimizing EMI and input voltage ripple. The proper placement of the input capacitor (C1) can be seen in the evaluation board layout in Figure 6. A laboratory test set-up typically consists of two long wires running from the bench power supply to the evaluation board input voltage pins. The induc- tance of these wires, along with the low-ESR ceramic input capacitor, can create a high Q net- work that may affect converter performance. This problem often becomes apparent in the form of excessive ringing in the output voltage during load transients. Errors in the loop phase and gain meas- urements can also result. Since the inductance of a short PCB trace feeding the input voltage is significantly lower than the power leads from the bench power supply, most applications do not exhibit this problem. In applications where the input power source lead inductance cannot be reduced to a level that does not affect the converter performance, a high ESR tantalum or aluminum electrolytic capacitor should be placed in parallel with the low ESR, ESL bypass ceramic capacitor. This dampens the high Q net- work and stabilizes the system. Linear Regulator Output Capacitor (C6) For proper load voltage regulation and operational stability, a capacitor is required between OUT and GND. The C OUT capacitor connection to the LDO VO VIN VO VIN IO RMS(MAX)I 2= VO VIN VO VIN VO VIN VO VIN CIN(MIN) = 1 VPP IO VO VIN VO VIN VO VIN CIN = VO VIN VPP IO

Total Power Solution for Portable Applications 24 2554.2007.01.1.2 regulator ground pin should be made as directly as practically possible for maximum device perform- ance. Since the regulator has been designed to function with very low ESR capacitors, ceramic capacitors in the 1.0µF to 10µF range are recom- mended for best performance. Applications utilizing the exceptionally low output noise and optimum power supply ripple rejection should use 2.2µF or greater for C OUT. In low output current applications, where output load is less than 10mA, the minimum value for COUT can be as low as 0.47µF. Battery Charger Output Capacitor (C5) The AAT2554 only requires a 1µF ceramic capaci- tor on the BAT pin to maintain circuit stability. This value should be increased to 10µF or more if the battery connection is made any distance from the charger output. If the AAT2554 is to be used in applications where the battery can be removed from the charger, such as with desktop charging cradles, an output capacitor greater than 10µF may be required to prevent the device from cycling on and off when no battery is present. Step-Down Converter Output Capacitor (C4) The output capacitor limits the output ripple and provides holdup during large load transitions. A 4.7µF to 10µF X5R or X7R ceramic capacitor typi- cally provides sufficient bulk capacitance to stabi- lize the output during large load transitions and has the ESR and ESL characteristics necessary for low output ripple. For enhanced transient response and low temperature operation applications, a 10µF (X5R, X7R) ceramic capacitor is recommended to stabilize extreme pulsed load conditions. The output voltage droop due to a load transient is dominated by the capacitance of the ceramic out- put capacitor. During a step increase in load cur- rent, the ceramic output capacitor alone supplies the load current until the loop responds. Within two or three switching cycles, the loop responds and the inductor current increases to match the load current demand. The relationship of the output volt- age droop during the three switching cycles to the output capacitance can be estimated by: Once the average inductor current increases to the DC load level, the output voltage recovers. The above equation establishes a limit on the minimum value for the output capacitor with respect to load transients. The internal voltage loop compensation also limits the minimum output capacitor value to 4.7µF. This is due to its effect on the loop crossover frequency (bandwidth), phase margin, and gain margin. Increased output capacitance will reduce the crossover frequency with greater phase margin. The maximum output capacitor RMS ripple current is given by: Dissipation due to the RMS current in the ceram- ic output capacitor ESR is typically minimal, resulting in less than a few degrees rise in hot- spot temperature. Inductor Selection The step-down converter uses peak current mode control with slope compensation to maintain stabil- ity for duty cycles greater than 50%. The output inductor value must be selected so the inductor current down slope meets the internal slope com- pensation requirements. The internal slope com- pensation for the AAT2554 is 0.45A/µsec. This equates to a slope compensation that is 75% of the inductor current down slope for a 1.8V output and 3.0µH inductor. 0.75 ⋅ VO L = = ≈ 1.67 ⋅ VOm 0.75 ⋅ VO 0.45A µsec AA µsec 0.75 ⋅ VO m = = = 0.45 L 0.75 ⋅ 1.8V 3.0µH A µsec VOUT · (VIN(MAX) - VOUT) RMS(MAX)I L · FS · VIN(MAX) COUT = 3 · ΔILOAD VDROOP · FS

Total Power Solution for Portable Applications 2554.2007.01.1.2 25 For most designs, the step-down converter operates with inductor values from 1µH to 4.7µH. Table 3 dis- plays inductor values for the AAT2554 for various output voltages. Manufacturer's specifications list both the inductor DC current rating, which is a thermal limitation, and the peak current rating, which is determined by the saturation characteristics. The inductor should not show any appreciable saturation under normal load conditions. Some inductors may meet the peak and average current ratings yet result in excessive loss- es due to a high DCR. Always consider the losses associated with the DCR and its effect on the total converter efficiency when selecting an inductor. The 3.0µH CDRH2D09 series inductor selected from Sumida has a 150mΩ DCR and a 470mA DC current rating. At full load, the inductor DC loss is 9.375mW which gives a 2.08% loss in efficiency for a 250mA, 1.8V output. Table 3: Step-Down Converter Inductor Values. Adjustable Output Resistor Selection Resistors R2 and R3 of Figure 5 program the out- put to regulate at a voltage higher than 0.6V. To limit the bias current required for the external feed- back resistor string while maintaining good noise immunity, the suggested value for R3 is 59k Ω. Decreased resistor values are necessary to main- tain noise immunity on the FB pin, resulting in increased quiescent current. Table 4 summarizes the resistor values for various output voltages. With enhanced transient response for extreme pulsed load application, an external feed-forward capacitor (C8 in Figure 5) can be added. Table 4: Adjustable Resistor Values For Step-Down Converter. R3 = 59kΩΩ R3 = 221kΩΩ VOUT (V) R2 (k ΩΩ) R2 (k ΩΩ) 0.8 19.6 75 0.9 29.4 113 1.0 39.2 150 1.1 49.9 187 1.2 59.0 221 1.3 68.1 261 1.4 78.7 301 1.5 88.7 332 1.8 118 442 1.85 124 464 2.0 137 523 2.5 187 715 3.3 267 1000 VOUT VREF 3.3V 0.6V Output Voltage (V) L1 (µH) 1.0 1.5 1.2 2.2 1.5 2.7 1.8 3.0/3.3 2.5 3.9/4.2 3.0 4.7 3.3 5.6

Total Power Solution for Portable Applications 26 2554.2007.01.1.2 Figure 5: AAT2554 Evaluation Board Schematic. JP2 ENA ADP JP1 EN_BAT VINB VOUTB VBAT VOUTA GND JP3 ENB 2.2µF 4.7µF 4.7µF VOUTA VOUTB FB ENB EN_BAT ADP VINA ADP 100K 100K 100K 59K 118K 8.06K 100pF 4.7µF 2.2µF 2.2µF GND LX VINB BAT STAT OUTA FB GND ADP VINA ENB ENA EN_BAT ISET GND GND AAT2554 VINB VINB ENA C8 optional for enhanced step-down converter transientresponse Printed Circuit Board Layout Considerations For the best results, it is recommended to physi- cally place the battery pack as close as possible to the AAT2554 BAT pin. To minimize voltage drops on the PCB, keep the high current carrying traces adequately wide. Refer to the AAT2554 evaluation board for a good layout example (see Figures 6 and 7). The following guidelines should be used to help ensure a proper layout. 1. The input capacitors (C1, C3, C7) should con- nect as closely as possible to ADP (Pin 11), VINA (Pin 4), and VINB (Pin 16). 2. C4 and L1 should be connected as closely as possible. The connection of L1 to the LX pin should be as short as possible. Do not make the node small by using narrow trace. The trace should be kept wide, direct, and short. 3. The feedback pin (Pin 1) should be separate from any power trace and connect as closely as possible to the load point. Sensing along a high- current load trace will degrade DC load regula- tion. Feedback resistors should be placed as closely as possible to the FB pin (Pin 1) to mini- mize the length of the high impedance feedback trace. If possible, they should also be placed away from the LX (switching node) and inductor to improve noise immunity. 4. The resistance of the trace from the load return GND (Pins 2, 10, 12, and 14) should be kept to a minimum. This will help to minimize any error in DC regulation due to differences in the poten- tial of the internal signal ground and the power ground. 5. A high density, small footprint layout can be achieved using an inexpensive, miniature, non- shielded, high DCR inductor.

Total Power Solution for Portable Applications 2554.2007.01.1.2 27 Figure 6: AAT2554 Evaluation Board Figure 7: AAT2554 Evaluation Board Top Side Layout. Bottom Side Layout. Table 5: AAT2554 Evaluation Board Component Listing. Component Part Number Description Manufacturer U1 AAT2554IRN-T1 Total Power Solution for Portable Applications AnalogicTech C1, C3, C4 GRM188R60J475KE19 CER 4.7µF 6.3V X5R 0603 Murata C5, C6, C7 GRM188R61A225KE34 CER 2.2µF 10V X5R 0603 Murata C8 GRM1886R1H101JZ01J CER 100pF 50V 5% R2H 0603 Murata L1 CDRH2D09-3R0 Shielded SMD, 3.0µH, 150m Ω, 3x3x1mm Sumida R4 Chip Resistor 1k Ω, 5%, 1/4W; 0603 Vishay R1 Chip Resistor 8.06k Ω, 1%, 1/4W; 0603 Vishay R2 Chip Resistor 118k Ω, 1%, 1/4W; 0603 Vishay R3 Chip Resistor 59k Ω, 1%, 1/4W; 0603 Vishay R5, R6, R7 Chip Resistor 100k Ω, 5%, 1/8W; 0402 Vishay JP1, JP2, JP3 PRPN401PAEN Connecting Header, 2mm zip Sullins Electronics D1 CMD15-21SRC/TR8 Red LED; 1206 Chicago Miniature Lamp

Total Power Solution for Portable Applications 28 2554.2007.01.1.2 Step-Down Converter Design Example Specifications VO = 1.8V @ 250mA, Pulsed Load ΔILOAD = 200mA VIN = 2.7V to 4.2V (3.6V nominal) FS = 1.5MHz TAMB = 85°C 1.8V Output Inductor (use 3.0µH; see Table 3) For Sumida inductor CDRH2D09-3R0, 3.0µH, DCR = 150m Ω. 1.8V Output Capacitor VDROOP = 0.1V 3.0µH · 1.5MHz · 4.2V 23 RMSI L1 · FS · VIN(MAX) = · 3 · ΔILOAD VDROOP · FS 3 · 0.2A 0.1V · 1.5MHz COUT = = = 4µF (use 4.7µF)

• = 66mArms (VO) · (VIN(MAX) - VO) = Pesr = esr · IRMS 2 = 5mΩ · (66mA)2 = 21.8µW IPKL1 = IO + ΔIL1 = 250mA + 114mA = 364mA2 PL1 = IO 2 ⋅ DCR = 250mA2 ⋅ 150mΩ = 9.375mW L1 = 1.67 ⋅ VO2 = 1.67 ⋅ 1.8V = 3µHµsec A µsec A

Total Power Solution for Portable Applications 2554.2007.01.1.2 29 Input Capacitor Input Ripple VPP = 25mV AAT2554 Losses TJ(MAX) = TAMB + ΘJA · PLOSS = 85°C + (50°C/W) · 26.14mW = 86.3°C PTOTAL + (tsw · FS · IO + IQ) · VIN IO 2 · (RDSON(H) · VO + RDSON(L) · [VIN -VO]) VIN 4.2V IO RMSI P = esr · IRMS 2= = 0.1Arms CIN = = = 1.38µF (use 4.7µF )1 VPP IO 25mV 0.2A

Total Power Solution for Portable Applications 30 2554.2007.01.1.2 Table 6: Step-Down Converter Component Values. Table 7: Suggested Inductors and Suppliers. Inductance Max DC DCR Size (mm) Manufacturer Part Number (µH) Current (mA) (m ΩΩ) LxWxH Type Sumida CDRH2D09-1R5 1.5 730 110 3.0x3.0x1.0 Shielded Sumida CDRH2D09-2R2 2.2 600 144 3.0x3.0x1.0 Shielded Sumida CDRH2D09-2R5 2.5 530 150 3.0x3.0x1.0 Shielded Sumida CDRH2D09-3R0 3.0 470 194 3.0x3.0x1.0 Shielded Sumida CDRH2D09-3R9 3.9 450 225 3.0x3.0x1.0 Shielded Sumida CDRH2D09-4R7 4.7 410 287 3.0x3.0x1.0 Shielded Sumida CDRH2D09-5R6 5.6 370 325 3.0x3.0x1.0 Shielded Sumida CDRH2D11-1R5 1.5 900 68 3.2x3.2x1.2 Shielded Sumida CDRH2D11-2R2 2.2 780 98 3.2x3.2x1.2 Shielded Sumida CDRH2D11-3R3 3.3 600 123 3.2x3.2x1.2 Shielded Sumida CDRH2D11-4R7 4.7 500 170 3.2x3.2x1.2 Shielded Taiyo Yuden NR3010T1R5N 1.5 1200 80 3.0x3.0x1.0 Shielded Taiyo Yuden NR3010T2R2M 2.2 1100 95 3.0x3.0x1.0 Shielded Taiyo Yuden NR3010T3R3M 3.3 870 140 3.0x3.0x1.0 Shielded Taiyo Yuden NR3010T4R7M 4.7 750 190 3.0x3.0x1.0 Shielded FDK MIPWT3226D-1R5 1.5 1200 90 3.2x2.6x0.8 Chip shielded FDK MIPWT3226D-2R2 2.2 1100 100 3.2x2.6x0.8 Chip shielded FDK MIPWT3226D-3R0 3.0 1000 120 3.2x2.6x0.8 Chip shielded FDK MIPWT3226D-4R2 4.2 900 140 3.2x2.6x0.8 Chip shielded Output Voltage R3 = 59k ΩΩ R3 = 221kΩΩ1 VOUT (V) R2 (k ΩΩ) R2 (k ΩΩ) L1 (µH) 0.6 0 0 1.5 0.8 19.6 75 1.5 0.9 29.4 113 1.5 1.0 39.2 150 1.5 1.1 49.9 187 1.5 1.2 59.0 221 1.5 1.3 68.1 261 1.5 1.4 78.7 301 2.2 1.5 88.7 332 2.7 1.8 118 442 3.0/3.3 1.85 124 464 3.0/3.3 2.0 137 523 3.0/3.3 2.5 187 715 3.9/4.2 3.3 267 1000 5.6 1. For reduced quiescent current, R3 = 221k Ω.

Total Power Solution for Portable Applications 2554.2007.01.1.2 31 Table 8: Surface Mount Capacitors. Value Voltage Temp. Case Manufacturer Part Number (µF) Rating Co. Size Murata GRM21BR61A106KE19 10 10 X5R 0805 Murata GRM188R60J475KE19 4.7 6.3 X5R 0603 Murata GRM188R61A225KE34 2.2 10 X5R 0603 Murata GRM188R60J225KE19 2.2 6.3 X5R 0603 Murata GRM188R61A105KA61 1.0 10 X5R 0603 Murata GRM185R60J105KE26 1.0 6.3 X5R 0603

Total Power Solution for Portable Applications 32 2554.2007.01.1.2

Ordering Information

All AnalogicTech products are offered in Pb-free packaging. The term “Pb-free” means Package Marking 1 Part Number (Tape and Reel)2 TDFN34-16 RZXYY AAT2554IRN-CAP-T1 TDFN34-16 VHXYY AAT2554IRN-CAQ-T1 TDFN34-16 SAXYY AAT2554IRN-CAT-T1 TDFN34-16 TOXYY AAT2554IRN-CAW-T1 1. XYY = assembly and date code. 2. Sample stock is generally held on part numbers listed in BOLD. Legend Voltage Code Adjustable A(0.6V) 0.9 B 1.2 E 1.5 G 1.8 I 1.9 Y 2.5 N 2.6 O 2.7 P 2.8 Q 2.85 R 2.9 S 3.0 T 3.3 W 4.2 C

Total Power Solution for Portable Applications 2554.2007.01.1.2 33 Advanced Analogic Technologies, Inc. 830 E. Arques Avenue, Sunnyvale, CA 94085 Phone (408) 737-4600 Fax (408) 737-4611 Package Information1 TDFN34-16 All dimensions in millimeters. 3.00 ± 0.05 0.05 ± 0.05 0.229 ± 0.051 (4x)

0.85 MAX

4.00 ± 0.05 Index Area Detail "A" Top View Bottom View Side View 0.35 ± 0.10 Detail "A" Pin 1 Indicator (optional) © Advanced Analogic Technologies, Inc. AnalogicTech cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AnalogicTech product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. AnalogicTech reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold sub- ject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. AnalogicTech warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with AnalogicTech’s standard warranty. Testing and other quality con- trol techniques are utilized to the extent AnalogicTech deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. AnalogicTech and the AnalogicTech logo are trademarks of Advanced Analogic Technologies Incorporated. All other brand and produ ct names appearing in this document are regis- tered trademarks or trademarks of their respective holders. 1. The leadless package family, which includes QFN, TQFN, DFN, TDFN and STDFN, has exposed copper (unplated) at the end of the lead terminals due to the manufacturing process. A solder fillet at the exposed copper edge cannot be guaranteed and is not re quired to ensure a proper bottom solder connection.