AAMD-EG33-WX002 BROADCOM | Alldatasheet

Document overview

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Technical content

Features

 Smaller package size  Available in red and amber  Typical viewing angle: 32°  Tinted and diffused appearance  MSL 3

Applications

 Full-color variable message signs  Solar-powered signs  Monocolor signs CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. The LED must be kept in a moisture barrier bag with < 5% relative humidity (RH) when not in use because prolonged exposure to the environment might cause the leads to tarnish or rust, which might cause difficulties in soldering. AAMD-EG33-WX002, AAMD-EL33-VWx02 Mini High Brightness SMT Round Lamps

Broadcom AAMD-Ex33-xxx02-DS100 AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Figure 1: Package Drawing NOTE: 1. All dimensions are in millimeters (mm). 2. Tolerance is ±0.50 mm unless otherwise specified. Lead Configuration Pin 1 Anode Pin 2 Cathode Pin 3 Anode

Broadcom AAMD-Ex33-xxx02-DS100 AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Device Selection Guide (TJ = 25°C, IF = 20 mA) Absolute Maximum Ratings Part Number Color Luminous Intensity, IV (mcd)a, b a. The luminous intensity, IV, is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. Tolerance is ± 15%. Dominant Wavelength, d (nm)c c. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. Min. Max. Min. Max. AAMD-EG33-WX002 Red 5500 9300 618.0 630.0 AAMD-EL33-VW002 Amber 4200 7200 584.5 594.5 AAMD-EL33-VWK02 Amber 4200 7200 587.0 592.0 AAMD-EL33-VWL02 Amber 4200 7200 589.5 594.5 Parameters Red/Amber Units DC Forward Currenta a. Derate linearly as shown in Figure 9. 50 mA Peak Forward Currentb b. Duty factor = 10%, frequency = 1 kHz, TA = 25°C. 100 mA Power Dissipation 120 mW Reverse Voltage Not recommended for reverse bias operation LED Junction Temperature 110 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +100 °C

Broadcom AAMD-Ex33-xxx02-DS100 AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Optical and Electrical Characteristics (TJ = 25°C) Parameters Min. Typ. Max. Units Test Condition Viewing Angle, 2θ½ a a. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. — 32 — ° IF = 20 mA Dominant Wavelength, d b b. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. nm I F = 20 mA Red 618.0 621.0 630.0 Amber 584.5 590.0 594.5 Peak Wavelength, p nm I F = 20 mA Red — 630 — Amber — 594 — Forward Voltage, VF c c. The forward voltage tolerance is ± 0.1V. 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage, VR d d. Indicates product final test condition. Long term reverse bias is not recommended. V IR = 100 µA Red 5 — — Amber 5 — — Thermal Resistance, RθJ-P e e. Thermal resistance from LED junction to pin. °C/W LED junction to pin Red — 270 — Amber — 270 —

Broadcom AAMD-Ex33-xxx02-DS100 AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Part Numbering System Part Number Example AAMD – EL33 – VWL02 A A M D – E x 1 3 3 – x 2 x3 x4 x5 x6 Code Description Option x1 Color G Red L Amber x2 Minimum intensity bin Refer to selection guide x3 Maximum intensity bin Refer to selection guide x4 Color bin option 0 Full distribution K Color bins 2 and 4 L Color bins 4 and 6 x5, x6 Packaging option 02 Test current = 20 mA x1 : L – Amber color x2 : V – Minimum intensity bin V x3 : W – Maximum intensity bin W x4 : L – Color bins 4 and 6 x5, x6 : 02 – Tested at 20 mA

AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Broadcom AAMD-Ex33-xxx02-DS100 Bin Information Intensity Bin Limits (CAT) Tolerance = ± 15%. Color Bin Limits (BIN) Tolerance = ± 1.0 nm Forward Voltage Bin Limits (VF) Tolerance = ± 0.1V. Example of bin information on reel and packaging label: Bin ID Luminous Intensity, IV (mcd) Min. Max. V 4200 5500 W 5500 7200 X 7200 9300 Bin ID Dominant Wavelength, d (nm) Min. Max. Red — 618.0 630.0 Amber 1 584.5 587.0 2 587.0 589.5 4 589.5 592.0 6 592.0 594.5 Bin ID Forward Voltage, VF (V) Min. Max. VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 CAT : V – Intensity bin V BIN : 2 – Color bin 2 VF : VA – Forward voltage bin VA

AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Broadcom AAMD-Ex33-xxx02-DS100 Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures.  Before use: – An unopened moisture barrier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the Humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. – Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, the MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life.  Control after opening the MBB: – Read the HIC immediately upon opening the MBB. – Keep the LEDs at <30°C/60% RH at all times, and complete all high temperature-related processes, including soldering, curing, and rework within 168 hours.  Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at <5% RH.  Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours.  Baking is required if the following conditions exist: – The HIC indicates a change in color for 10% and 5%, as stated on the HIC. – The LEDs are exposed to conditions of >30°C/60% RH at any time. – The LED's floor life exceeded 168 hours. The recommended baking condition is: 60°C ± 5ºC for 20 hours. Baking can only be done once.  Storage: The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed in an ambient environment for too long, the silver plating might become oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in a desiccator at <5% RH. Application Precautions  The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.  Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved.  The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (such as intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations.  Avoid rapid changes in ambient temperatures, especially in high-humidity environments, because they cause condensation on the LED.  The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED.  Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED.  If the LED is intended to be used in a harsh or an outdoor environment, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on.

AAMD-EG33-WX002, AAMD-EL33-VWx02 Data Sheet Mini High Brightness SMT Round Lamps Broadcom AAMD-Ex33-xxx02-DS100 Thermal Management The optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction temperature (TJ) of the LED below the allowable limit at all times. TJ can be calculated as follows: TJ = TA + RθJ-A × IF × VFmax where: TA = Ambient temperature (°C) RθJ-A = Thermal resistance from LED junction to ambient (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RθJ-A. Actual TA is sometimes subjective and hard to determine. RθJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using the solder point temperature, TS, as follows: TJ = TS + RθJ-S × IF × VFmax where: TS = LED solder point temperature as shown in the following figure (°C) RθJ-S = Thermal resistance from junction to solder point (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) Figure 15: Solder Point Temperature on PCB TS can be easily measured by mounting a thermocouple on the soldering joint as shown in Figure 15, while RθJ-S is provided in the data sheet. Verify the TS of the LED in the final product to ensure that the LEDs are operating within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. TS Point

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