AABS110-HF COMCHIP | Alldatasheet

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Technical content

Features

  • Glass passivated chip. - Ideal for automatic placement. - High surge forward current capability. - Reliable low cost construction utilizing molded plastic technique. - Lead tin plated copper. - AEC-Q101 Qualified. Mechanical data - Polarity: Symbol molded on body. - Mounting position: Any. - Case: ABS, molded plastic. Parameter Symbol UnitAABS110-HF Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current @TA=40°C (Note 1) Peak forward surge current, 8.3ms single half sine-wave, superimposed on rated load (JEDEC Method) Peak forward voltage per diode at 1.0A DC Maximum DC reverse current at rated @TJ=25°C DC Blocking Voltage per diode @TJ=125°C Operating junction temperature range Storage temperature range Notes: 1. Mounted on P.C. board. VRRM VRMS VDC IO IFSM VF IR RθJA TJ TSTG 1000 700 1000 V V V 1.05 100 3.7 -55 to +150 -55 to +150 A A V μA Maximum Rating and Electrical CharacteristicsRating at TA=25°C, unless otherwise noted. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Typical thermal resistance junction to ambient 80 °C/W I²t rating for fusing (t<8.3ms) I²t A²s REV:A Page 1AQW-JBR01

Rating and Characteristic Curves (AABS110-HF) SMD Glass Passivated Bridge Rectifiers Fig.1 - Forward Current Derating Curve 0.2 0.4 0.6 0.8 1.2 Fig.3 - Typical Reverse Characteristics 0.1 1000 Average Forward Current, (A) Instantaneous Reverse Current, (µA) 1501209060300 Ambient temperature, (°C) 20 40 60 80 100 Percent of Rated Peak Reverse Voltage, (%) 1.0 100 TJ=25°C TJ=75°C TJ=100°C TJ=125°C Fig.2 - Maximum Non-Repetitive Surge Current Peak Forward Surge Current, (A) Fig.4 - Typical Forward Characteristics 0.1 instantaneous Forward Current, (A) 1 10 100 Number of Cycles at 60Hz Instantaneous Forward Voltage, (V) 8.3mS single half-sine-wave (JEDEC Method) TJ=100°C TJ=125°C 1.20.4 Pulse width 300µs 2% duty cycle TJ=75°C TJ=25°C Comchip Technology CO., LTD. REV:A Page 2AQW-JBR01

(mm) (inch) 1.969 (min) 5.31 ± 0.10 0.209 ± 0.004 6.68 ± 0.10 0.263 ± 0.004 1.59 ± 0.20 0.063 ± 0.008 CA SYMBOL (mm) E F P P0 P1 W W1 1.75 ± 0.10 0.069 ± 0.004 5.50 ± 0.05 0.217 ± 0.002 ABS 0.30 0.012 T o 120 D1 D2 D Reel Taping Specification Trailer Device Leader 200mm (min)160mm (min) Direction of Feed SMD Glass Passivated Bridge Rectifiers T C Index hole d E F B W P A ABS110 C Comchip Technology CO., LTD. REV:A Page 3AQW-JBR01

SMD Glass Passivated Bridge Rectifiers ABS110 C C = Comchip logo Standard Packaging Case Type ABS 5,000 REEL (pcs) Reel Size (inch) REEL PACK Suggested P.C.B. PAD Layout SIZE (inch)

0.031 Min

(mm)

0.80 Min

4.00 REF

0.60 Min

0.157 REF

0.024 Min

6.40 Max 0.252 Max A B C D C B D A Comchip Technology CO., LTD. REV:A Page 4AQW-JBR01