AAAF5051-02 KINGBRIGHT | Alldatasheet

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Technical content

Features

z CHIPS CAN BE CONTROLLED SEPARATELY. z SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. z AVAILABLE ON TAPE AND REEL. z WHITE SMD PACKAGE, SILICONE RESIN. z PACKAGE: 500PCS / REEL. z MOISTURE SENSITIVITY LEVEL : LEVEL 3. z RoHS COMPLIANT. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.15[±0.006]unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES

Description

The Blue source color devices are made with InGaAlN Verti- cal Light Emitting Diode. This devices are made with AlGaInP. The Green source color devices are made with InGaAlN Vertical Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded.

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 2 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production.

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 3 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Selection Guide Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity/ luminous Flux: +/-15%. Electrical / Optical Characteristics at TA=25°C Part No. Dice Lens Type Iv (mcd) [2] @ 120mA Viewing Angle [1] Min. Typ. Min. Typ. 2θ1/2 AAAF5051-02 Blue (InGaAlN) WATER CLEAR 1200 1450 5000 6300 120° Reddish-Orange (AlGaInP) 2500 3100 8000 9000 Green (InGaAlN) 3800 4900 12500 17000 Φv (mlm) [2] @ 120mA Parameter Symbol Device Value Unit Power dissipation Pt Blue 0.432 W Reddish-Orange 0.336 Green 0.444 Junction temperature TJ Blue 110 °C Reddish-Orange 110 Green 110 Operating Temperature Top Blue -40 To +85 °C Reddish-Orange Green Storage Temperature Tstg Blue -40 To +85 °C Reddish-Orange Green DC Forward Current [1] IF Blue 120 mA Reddish-Orange 120 Green 120 Peak Forward Current [2] IFM Blue 300 mA Reddish-Orange 300 Green 300 Thermal resistance Rth j-a Blue 220 °C/W Reddish-Orange 270 Green 200 Electrostatic Discharge Threshold (HBM) Blue V Reddish-Orange Green 8000 Notes: 1. Results from mounting on PC board FR4(pad size ≥ 100mm2 ),mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width.

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 4 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Electrical / Optical Characteristics at TA=25°C Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. Parameter Symbol Device Value Unit Min. Typ. Max. Wavelength at peak emission IF=120mA λ peak Blue 450 nm Reddish-Orange 633 Green 515 Dominant Wavelength IF=120mA λ dom [1] Blue 457 nm Reddish-Orange 624 Green 525 Spectral Line Half-width IF=120mA Δλ1/2 Blue 20 nm Reddish-Orange 30 Green 30 Forward Voltage IF=120mA VF [2] Blue 2.6 3.1 3.6 V Reddish-Orange 1.8 2.3 2.8 Green 2.6 3.2 3.7 Temperature coefficient of λ peak IF=120mA, -10 ° C≤ T≤100 ° C TC λ peak Blue 0.12 nm/° C Reddish-Orange 0.09 Green 0.13 Temperature coefficient of λ dom IF=120mA, -10 ° C≤ T≤100 ° C TC λ dom Blue 0.1 nm/° C Reddish-Orange 0.03 Green 0.11 Temperature coefficient of VF IF=120mA, -10 ° C≤ T≤100 ° C TCV Blue -2.3 mV/° C Reddish-Orange -2.7 Green -3.9

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 5 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 AAAF5051-02 Blue

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 6 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Reddish-Orange

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 7 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 Green

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 8 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 AAAF5051-02 Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Tape Specifications (Units : mm)

SPEC NO: DSAH9800 REV NO: V.1 DATE: DEC/18/2007 PAGE: 9 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.Chen ERP: 1201003347 PACKING & LABEL SPECIFICATIONS AAAF5051-02