AA3021LZGSK KINGBRIGHT | Alldatasheet

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Features

z 3.0mm x 2.0mm, 1.3mm high, only minimum space required. z Suitable for compact optoelectronic applications. z Low power consumption. z Package : 2000pcs / reel. z Moisture sensitivity level : level 3. z Low current IF=2mA operating. z RoHS compliant. Descriptions z The Green source color devices are made with InGaN on Sapphire Light Emitting Diode. z Electrostatic discharge and power surge could damage the LEDs. z It is recommended to use a wrist band or anti- electrostatic glove when handling the LEDs. z All devices, equipments and machineries must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO: DSAN8368 REV NO: V.2B DATE: MAR/09/2015 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008903 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.

SPEC NO: DSAN8368 REV NO: V.2B DATE: MAR/09/2015 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008903 Selection Guide Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. 3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Absolute Maximum Ratings at TA=25°C Electrical / Optical Characteristics at TA=25°C Notes: 1.Wavelength: +/-1nm. 2.Forward Voltage: +/-0.1V. 3.Wavelength value is traceable to the CIE127-2007 compliant national standards. 4.Excess driving current and/or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Part No. Dice Lens Type Viewing Angle [1] Min. Typ. 2 θ1/2 AA3021LZGSK Green (InGaN) Water Clear 80 180 125° Iv (mcd) [2] @ 2mA Symbol Parameter Device Typ. Max. Units Test Conditions λpeak Peak Wavelength Green 515 nm I F=2mA λD [1] Dominant Wavelength Green 525 nm I F=2mA Δλ1/2 Spectral Line Half-width Green 35 nm I F=2mA C Capacitance Green 45 pF V F=0V;f=1MHz VF [2] Forward Voltage Green 2.65 3 V I F=2mA IR Reverse Current Green 50 uA V R=5V Min 2.2 Parameter Green Units Power dissipation 75 mW DC Forward Current 25 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C

SPEC NO: DSAN8368 REV NO: V.2B DATE: MAR/09/2015 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008903 Green AA3021LZGSK

SPEC NO: DSAN8368 REV NO: V.2B DATE: MAR/09/2015 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008903 AA3021LZGSK Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Dimensions (Units : mm)

SPEC NO: DSAN8368 REV NO: V.2B DATE: MAR/09/2015 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008903 PACKING & LABEL SPECIFICATIONS AA3021LZGSK Terms and conditions for the usage of this document 1. The information included in this docum ent reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applicati ons. If customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes