AA3021LVBS-D KINGBRIGHT | Alldatasheet

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Technical content

Features

z 3.0mm x 2.0mm, 1.3mm high, only minimum space required. z Suitable for compact optoelectronic applications. z Low power consumption. z Package : 2000pcs / reel. z Moisture sensitivity level : level 3. z Low current IF=2mA operating. z RoHS compliant. Descriptions z The Blue source color devices are made with InGaN Light Emitting Diode. z Electrostatic discharge and power surge could damage the LEDs. z It is recommended to use a wrist band or anti- electrostatic glove when handling the LEDs. z All devices, equipments and machineries must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications.

SPEC NO: DSAN8366 REV NO: V.2B DATE: MAR/09/2015 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008901 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.

SPEC NO: DSAN8366 REV NO: V.2B DATE: MAR/09/2015 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008901 Selection Guide Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. 3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Part No. Dice Lens Type Viewing Angle [1] Min. Typ. 2 θ1/2 AA3021LVBS/D Blue (InGaN) Water Clear 20 50 125° Iv (mcd) [2] @ 2mA Absolute Maximum Ratings at TA=25°C Electrical / Optical Characteristics at TA=25°C Notes: 1.Wavelength: +/-1nm. 2.Forward Voltage: +/-0.1V. 3.Wavelength value is traceable to the CIE127-2007 compliant national standards. 4.Excess driving current and/or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Symbol Parameter Device Typ. Max. Units Test Conditions λpeak Peak Wavelength Blue 465 nm IF=2mA λD [1] Dominant Wavelength Blue 470 nm IF=2mA Δλ1/2 Spectral Line Half-width Blue 22 nm IF=2mA C Capacitance Blue 100 pF VF=0V;f=1MHz VF [2] Forward Voltage Blue 2.65 3 V IF=2mA IR Reverse Current Blue 50 uA VR=5V Min. 2.2 Parameter Blue Units Power dissipation 90 mW DC Forward Current 30 mA Peak Forward Current [1] 100 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C

SPEC NO: DSAN8366 REV NO: V.2B DATE: MAR/09/2015 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008901 Blue AA3021LVBS/D

SPEC NO: DSAN8366 REV NO: V.2B DATE: MAR/09/2015 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008901 AA3021LVBS/D Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Dimensions (Units : mm)

SPEC NO: DSAN8366 REV NO: V.2B DATE: MAR/09/2015 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201008901 PACKING & LABEL SPECIFICATIONS AA3021LVBS/D Terms and conditions for the usage of this document 1. The information included in this docum ent reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applicati ons. If customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes