AA3021F3S-100MAV KINGBRIGHT | Alldatasheet
Document overview
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Technical content
Features
z 3.0mm x 2.0mm, 1.4mm high, only minimum space required. z Mechanically and spectrally matched to the phototransistor. z Moisture sensitivity level : level 3. z Package : 2000pcs / reel. z RoHS compliant. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAL0850 REV NO: V.4A DATE: JUN/06/2016 PAGE: 2 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: W.Q.Zhong ERP: 1201006845 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAL0850 REV NO: V.4A DATE: JUN/06/2016 PAGE: 3 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: W.Q.Zhong ERP: 1201006845 Selection Guide Absolute Maximum Ratings at TA=25°C Electrical / Optical Characteristics at TA=25°C Part No. Emitting Color (Material) Lens Type Po (mW/sr) [2] @ 100mA Viewing Angle [1] Min. Typ. 2 θ1/2 AA3021F3S-100MAV Infrared(GaAs) Water Clear 12 25 *4 *7 125° Parameter P/N Symbol Typ. Max. Units Test Conditions Forward Voltage [1] F3 V F 1.4 2 V I F=100mA Reverse Current F3 I R 10 uA V R = 5V Capacitance F3 C 90 pF V F=0V;f=1MHz Peak Spectral Wavelength F3 λP 940 nm I F=100mA Spectral Bandwidth F3 Δλ1/2 50 nm I F=100mA Parameter Symbol Values Units Power dissipation P D 200 mW DC Forward Current I F 100 mA Peak Forward Current [1] i FS 1.2 A Reverse Voltage V R 5 V Operating Temperature T A -40 To +85 °C Storage Temperature T STG -40 To +85 °C Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Radiant Intensity/ luminous flux: +/-15%. * Radiant intensity value is traceable to CIE127-2007 standards. Notes: 1. Forward Voltage: +/-0.1V. 2. Wavelength value is traceable to CIE127-2007 standards. 3. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.
SPEC NO: DSAL0850 REV NO: V.4A DATE: JUN/06/2016 PAGE: 4 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: W.Q.Zhong ERP: 1201006845 AA3021F3S-100MAV
SPEC NO: DSAL0850 REV NO: V.4A DATE: JUN/06/2016 PAGE: 5 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: W.Q.Zhong ERP: 1201006845 AA3021F3S-100MAV Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Reel Dimension Tape Specifications (Units : mm)
SPEC NO: DSAL0850 REV NO: V.4A DATE: JUN/06/2016 PAGE: 6 OF 6 APPROVED: Wynec CHECKED: Allen Liu DRAWN: W.Q.Zhong ERP: 1201006845 PACKING & LABEL SPECIFICATIONS AA3021F3S-100MAV Terms and conditions for the usage of this document 1. The information included in this docum ent reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the dat asheet. If customer usage exceeds the spec ified limits, Kingbright will not be respon sible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applicati ons. If customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes