AA2214SYSK-AMT

AA2214SYSK-AMT KINGBRIGHT | Alldatasheet

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© 2017 Kingbright. All Rights Reserved. Spec No: DSAL3992 / 1201006675 Rev No: V.4B Date: 10/09/2017 Page 1 / 5 DESCRIPTIONS z The Super Bright Yellow device is made with AlGaInP (on GaAs substrate) light emitting diode chip z Electrostatic discharge and power surge could damage the LEDs z It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs z All devices, equipments and machineries must be electrically grounded

FEATURES

z 2.2 mm x 1.4 mm, 1.3 mm high z Low power consumption z Available on tape and reel z Package: 2000 pcs / reel z Moisture sensitivity level: 3 z RoHS compliant

APPLICATIONS

z Backlighting (illuminated advertising , general lighting) z Interior and exterior automotive lighting z Substitution of micro incandescent lamps z Reading lamps z Signal and symbol luminaire for orientation z Marker lights (e.g. Steps, exit ways, etc) z Decorative and entertainment lighting z Indoor and outdoor commercial and residential architectural lighting ATTENTION Observe precautions for handling electrostatic discharge sensitive devices PACKAGE DIMENSIONS SELECTION GUIDE AA2214SYSK-AMT 2.2 x 1.4 mm Surface Mount LED Lamp RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Part Number Emitting Color (Material) Lens Type Iv (mcd) @ 20mA [2] Viewing Angle [1] Code. Min. Max. 2θ1/2 AA2214SYSK-AMT ■ Super Bright Yellow (AlGaInP) Water Clear N 120 200 120° P 200 300 Q 300 400 Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAL3992 / 1201006675 Rev No: V.4B Date: 10/09/2017 Page 2 / 5 ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C AA2214SYSK-AMT Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Parameter Symbol Emitting Color Value Unit Code. Min. Typ. Max. Wavelength at Peak Emission IF = 20mA λpeak Super Bright Yellow - - 590 - nm Dominant Wavelength IF = 20mA λdom [1] Super Bright Yellow 3 586 - 588 nm 4 588 - 590 5 590 - 592 6 592 - 594 Spectral Bandwidth at 50% Φ REL MAX IF = 20mA Δλ Super Bright Yellow - - 20 - nm Capacitance C Super Bright Yellow - - 20 - pF Forward Voltage IF = 20mA VF [2] Super Bright Yellow - - 2.0 2.5 V Reverse Current (VR = 5V) IR Super Bright Yellow - - - 10 uA Temperature Coefficient of λpeak IF = 20mA, -10°C ≤ T ≤ 100°C TCλpeak Super Bright Yellow - - 0.12 - nm/°C Temperature Coefficient of λdom IF = 20mA, -10°C ≤ T ≤ 100°C TCλdom Super Bright Yellow - - 0.07 - nm/°C Temperature Coefficient of VF IF = 20mA, -10°C ≤ T ≤ 100°C TCV Super Bright Yellow - - -1.9 - mV/°C ABSOLUTE MAXIMUM RATINGS at TA=25°C Parameter Symbol Unit Power Dissipation PD 75 mW Reverse Voltage VR 5 V Junction Temperature Tj 115 °C Operating Temperature Top -40 to +100 °C Storage Temperature Tstg -40 to +115 °C DC Forward Current IF 30 mA Peak Forward Current IFM [1] 175 mA Thermal Resistance (Junction / Ambient) Rth JA [2] 330 °C/W Thermal Resistance (Junction / Solder point) Rth JS [2] 205 °C/W Value Electrostatic Discharge Threshold (HBM) - 3000 V Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Rth JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAL3992 / 1201006675 Rev No: V.4B Date: 10/09/2017 Page 3 / 5 0.1 100 Ta = 25 °C Forward voltage (V) Forward current (mA) 0.01 0.1 11 0 1 0 0 Ta = 25 °C Forward current (mA) Luminous intensity normalised at 20 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 T a = 25 °C Yellow Wavelength (nm) Relative Intensity (a. u.) TECHNICAL DATA RELATIVE INTENSITY vs. WAVELENGTH SUPER BRIGHT YELLOW TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS 15° 30° 45° 60° 90° 75° 0.5 1.0 0.0 Ta = 25 °C SPATIAL DISTRIBUTION AA2214SYSK-AMT Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAL3992 / 1201006675 Rev No: V.4B Date: 10/09/2017 Page 4 / 5 PACKING & LABEL SPECIFICATIONS AA2214SYSK-AMT PACKING & LABEL SPECIFICATIONS HANDLING PRECAUTIONS Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H 2S might corrode silver plating of lead frame. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAL3992 / 1201006675 Rev No: V.4B Date: 10/09/2017 Page 5 / 5 AA2214SYSK-AMT Items Symbols Conditions Failure Criteria luminous Intensity lV IF = 20mA Testing Min. Value < Spec. Min. Value x 0.5 Forward Voltage VF IF = 20mA Testing Max. Value ≥ Spec. Max. Value x 1.2 Reverse Current IR VR = Maximum Rated Reverse Voltage Testing Max. Value ≥ Spec. Max. Value x 2.5 High temp. storage test - - Occurrence of notable decoloration, deformation and cracking RELIABILITY TEST ITEMS AND CONDITIONS The reliability of products shall be satisfied with items listed below LOT TOLERANCE PERCENT DEFECTIVE (LTPD) : 10% No. Test Item Standards Test Condition Test Times / Cycles Number of Damaged

1 Continuous operating test - Ta = 25°C, IF = maximum rated current * 1,000 h 0 / 22

2 High Temp. operating test EIAJ ED-4701/100(101) Ta = 100°C, IF = derated current at 100°C 1,000 h 0 / 22 3 Low Temp. operating test - Ta = -40°C, IF = maximum rated current * 1,000 h 0 / 22 4 High temp. storage test EIAJ ED-4701/100(201) Ta = maximum rated storage temperature 1,000 h 0 / 22 5 Low temp. storage test EIAJ ED-4701/100(202) Ta = -40°C 1,000 h 0 / 22 6 High temp. & humidity storage test - Ta = 60°C, RH = 90% 500 h 0 / 22 7 High temp. & humidity operating test - Ta = 60°C, RH = 90% IF = derated current at 60°C 500 h 0 / 22

8 Soldering reliability test EIAJ ED-4701/100(301)

Moisture soak: 30°C, 70% RH, 72h Preheat: 150~180°C (120s max.) Soldering temp: 260°C(10s) 2 times 0 / 18

9 Thermal shock operating test - Ta = -40°C(15min) ~ 100°C(15min)

IF = derated current at 100°C 1,000 cycles 0 / 22

10 Thermal shock test - Ta = -40°C(15min) ~ 100°C(15min) 1,000 cycles 0 / 22

11 Electric Static Discharge (ESD) EIAJ ED-4701/100(304) C = 100pF, R2 = 1.5KΩ V = 3000V Once each Polarity 0 / 22

12 Vibration test - a = 196m/s², f = 100~2KHz, t = 48min for all xyz axes 4 times 0 / 22

• : Refer to forward current vs. derating curve diagram PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application ha s special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes CRITERIA FOR JUDGING DAMAGE