AA2214CGSK KINGBRIGHT | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
z 2.2mm x 1.4mm, 1.3mm high. z Low power consumption. z Available on tape and reel. z Package : 2000pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant.
Description
The Green source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAK2212 REV NO: V.5B DATE: APR/25/2015 PAGE: 2 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.Chen ERP: 1201005730 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly Orangeuces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAK2212 REV NO: V.5B DATE: APR/25/2015 PAGE: 3 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.Chen ERP: 1201005730 Selection Guide Absolute Maximum Ratings at TA=25°C Electrical / Optical Characteristics at TA=25°C Note: 1. 1 / 10 Duty Cycle, 0.1ms Pulse Width. Part No. Dice Lens Type Viewing Angle [1] Min. Typ. 2 θ1/2 AA2214CGSK Green (AlGaInP) Water Clear 40 70 120° Iv (mcd) [2] @ 20mA Symbol Parameter Device Typ. Max. Units Test Conditions λpeak Peak Wavelength Green 574 nm I F=20mA λD [1] Dominant Wavelength Green 570 nm I F=20mA Δλ1/2 Spectral Line Half-width Green 20 nm I F=20mA C Capacitance Green 15 pF V F=0V;f=1MHz VF [2] Forward Voltage Green 2.1 2.5 V I F=20mA IR Reverse Current Green 10 uA V R=5V Parameter Green Units Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Notes: 1. θ1 / 2 is the angle from optical centerline where the luminous intensity is 1 / 2 of the optical peak value. 2. Luminous intensity / luminous Flux: + / -15%. 3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards. Notes: 1. Wavelength: + / -1nm. 2. Forward Voltage: + / -0.1V. 3. Wavelength value is traceable to the CIE127-2007 compliant national standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.
SPEC NO: DSAK2212 REV NO: V.5B DATE: APR/25/2015 PAGE: 4 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.Chen ERP: 1201005730 Green AA2214CGSK
SPEC NO: DSAK2212 REV NO: V.5B DATE: APR/25/2015 PAGE: 5 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.Chen ERP: 1201005730 AA2214CGSK Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Reel Dimension Tape Dimensions (Units : mm)
SPEC NO: DSAK2212 REV NO: V.5B DATE: APR/25/2015 PAGE: 6 OF 6 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: Q.M.Chen ERP: 1201005730 PACKING & LABEL SPECIFICATIONS AA2214CGSK Terms and conditions for the usage of this document 1. The information included in this docum ent reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the dat asheet. If customer usage exceeds the spec ified limits, Kingbright will not be respon sible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applicati ons. If customer's application ha s special reliability requirements or have life-threatening liabilitie s, such as automotive or m edical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes