AA031P1-A2 ALPHA | Alldatasheet
Document overview
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Technical content
Features
I 16 dBm Typical P1 dB Output Power I Single Voltage Operation I 100% RF and DC Testing AA031P1-A2 Patent Pending
Description
The AA031P1-A2 is a broadband millimeterwave driver amplifier in a rugged surface mount package which is compatible with high volume solder installation. The amplifier is designed for use in millimeterwave communication and sensor systems as a gain stage in the receiver, transmitter, or LO chain when high gain and linearity are required. The robust ceramic surface mount package provides excellent electrical performance and a high degree of environmental protection for long-term reliability. A single supply voltage simplifies bias requirements. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. Amplifier is targeted for high volume millimeterwave applications such as satellite and wireless point-to-point and point-to-multipoint systems. Parameter Symbol Min. Typ. Max. Unit Bandwidth BW 28 32 GHz Small Signal Gain G1 4 1 7 d B Output Power at 1 dB Gain Compression P 1 dB 13 16 dBm Input Return Loss RLI 9d B Output Return Loss RLO 12 dB Temperature Coefficient of Gain dG/dT -0.03 dB/C Drain Current ID 145 200 mA Electrical Specifications at 25°C (VD = 5.5 V) Pin Out AA031P1-A2 YYWW LO In RF Out Orientation Indicated by Missing Castellations VDN/C N/C N/C N/C N/C
28–32 GHz Surface Mount Driver Amplifier AA031P1-A2 2 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 3/01A Characteristic Value Operating Temperature (TC) -55°C to +90°C Storage Temperature (TST) -65°C to +150°C Bias Voltage (VD)7 V DC Power In (PIN) 13 dBm Absolute Maximum Ratings Frequency (GHz) Gain vs. Frequency Gain (dB) 20 22 24 26 28 30 32 34 -55˚C +85˚C +25˚C Input Power @ 28 GHz (dBm) Power Sweep Output Power (dBm), Gain (dB)10 -10 -8 -6 -4 -2 0 2 4 Gain P1 dB = 16.5 dBm Output Power @ 28 GHz Frequency (GHz) Return Loss vs. Frequency Return Loss (dB) -20 -15 -10 20 22 24 26 28 30 32 34 S11 S22 Typical Performance Data (VD = 5.5 V) Outline 0.241 (6.12 mm) 0.040 (1.02 mm)0.016 (0.41 mm)0.194 (4.93 mm) 0.056 (1.42 mm) 0.204 (5.18 mm) 0.251 (6.38 mm) 2X 0.044 (1.12 mm) 8X 0.020 (0.51 mm) 2X 0.129 (3.28 mm) CL 2X 0.064 (1.63 mm) 2X 0.043 (1.09 mm) 2X 0.085 (2.16 mm) CL
28–32 GHz Surface Mount Driver Amplifier AA031P1-A2 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com 3 Specifications subject to change without notice. 3/01A Typical S-Parameters at 25°C (VD = 5.5 V) Frequency S11 S21 S12 S22
28–32 GHz Surface Mount Driver Amplifier AA031P1-A2 4 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email sales@alphaind.com • www.alphaind.com Specifications subject to change without notice. 3/01A “Alpha Two” Surface Mount Package Handling and Mounting Millimeterwave components require careful mounting design to maintain optimal performance. The Alpha Two surface mount package (patent pending) provides a rugged and repeatable electrical connection using standard solder techniques. Handling The Alpha Two surface mount package is very rugged. However, due to ceramic ’s brittle nature, one should exercise care when handling with metal tools. Do not apply heavy pressure to the lid. Vacuum tools may be used to pick and place this part. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. Package Construction The Alpha Two surface mount package consists of a base and a lid.The package base is ceramic with filled vias and plated castellations.The package lid is unplated alumina. The lid seal is epoxy. Mounting Design The Alpha Two surface mount package is installed on top of a printed circuit board on a specially designed footprint. Mounting footprint geometry will be supplied by Alpha Industries in electronic formats or paper drawing. Mounting the Package The Alpha Two surface mount package is compatible with high-volume surface mount installation using solder. RF and DC connections are accomplished with metallized edge castellations that hold solder fillets. Ground connections are accomplished by both metallized edge castellations and filled vias to the bottom of the package. Care should be taken to ensure that there are no voids or gaps in the solder so that a good RF , DC, and ground contact is maintained. Alpha Two Surface Mount Package Installation Printed Circuit Board Rogers 4003 0.008" (0.20 mm) Thick Electrically & Thermally Conductive Ground Plane RF In RF Out DC Lines Solder Fillets Footprint Geometry for Alpha Two Surface Mount Package RF In RF Out DC Connections DC Connections