A827

OPA827 BURR-BROWN | Alldatasheet

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Technical content

FEATURES

/C0068OFFSET: 250µV (max) /C0068DRIFT: 1µV/°C /C0068LOW NOISE: 4.5nV//C0047Hz at 1kHz /C0068BANDWIDTH: 18MHz /C0068SLEW RATE: 22V/ µs /C0068BIAS CURRENT: 3pA /C0068QUIESCENT CURRENT: 4.5mA/Ch /C0068WIDE SUPPLY RANGE: /C00434V to /C004318V /C0068SINGLE PACKAGES: MSOP-8, SO-8 /C0068DUAL PACKAGES: TSSOP-8, SO-8

APPLICATIONS

/C0068PRECISION /C004310V INPUT FRONT-ENDS /C0068TRANSIMPEDANCE AMPLIFIERS /C0068INTEGRATORS /C0068ACTIVE FILTERS /C0068A/D CONVERTER DRIVERS /C0068DAC OUTPUT BUFFERS /C0068HIGH-PERFORMANCE AUDIO /C0068PROCESS CONTROL /C0068TEST EQUIPMENT /C0068MEDICAL EQUIPMENT

DESCRIPTION

The OPA827 series of JFET operational amplifiers combines outstanding dc precision with excellent ac performance. It offers 100µV of offset, very low drift (1µV/°C) over temperature, low bias currents, and very low flicker noise of 400nV PP (0.1Hz to 10Hz). It operates over a very wide supply voltage range of ±4V to ±18V on a low 4.5mA supply current. A dual version is also available for the OPA827 family. Excellent ac characteristics, such as 18MHz gain bandwidth (GBW) and 22V/µs slew rate, and precision dc characteristics make the OPA827 series well-suited for a wide range of applications such as 16- to 18-bit data acquisition systems, transimpedance (I/V−conversion) amplifiers, filters, precision ±10V front-ends, and professional audio applications. The single version (OPA827) is available in both MSOP-8 and standard SO-8 surface-mount packages. The dual version (OPA2827) is available in the small TSSOP-8 and in the standard SO-8 packages. All versions are specified from −40°C to +125°C. VIN AGND1 REF CAP ADS8505 AGND2 DGND 500Ω 200Ω 33.2kΩ −15V 2.2µF 100nF 2.2µF 100pF OPA827100pF 500Ω +15V 2.2µF 100nF VIN 2.2µF PRODUCT PREVIEW OPA827 OPA2827 SBOS376A − NOVEMBER 2006 Low-Noise, High-Precision, JFET-Input, OPERATIONAL AMPLIFIER www.ti.com Copyright  2006, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. /C0080/C0082/C0079/C0068/C0085/C0067/C0084 /C0080/C0082/C0069/C0086/C0073/C0069/C0087 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0099/C0111/C0110/C0099/C0101/C0114/C0110/C0115 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0105/C0110 /C0116/C0104/C0101 /C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0118/C0101 /C0111/C0114 /C0100/C0101/C0115/C0105/C0103/C0110 /C0112/C0104/C0097/C0115/C0101 /C0111/C0102 /C0100/C0101/C0118/C0101/C0108/C0111/C0112/C0109/C0101/C0110/C0116/C0046 /C0067/C0104/C0097/C0114/C0097/C0099/C0116/C0101/C0114/C0105/C0115/C0116/C0105/C0099 /C0100/C0097/C0116/C0097 /C0097/C0110/C0100 /C0111/C0116/C0104/C0101/C0114 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0097/C0114/C0101 /C0100/C0101/C0115/C0105/C0103/C0110 /C0103/C0111/C0097/C0108/C0115/C0046 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0114/C0101/C0115/C0101/C0114/C0118/C0101/C0115 /C0116/C0104/C0101 /C0114/C0105/C0103/C0104/C0116 /C0116/C0111 /C0099/C0104/C0097/C0110/C0103/C0101 /C0111/C0114 /C0100/C0105/C0115/C0099/C0111/C0110/C0116/C0105/C0110/C0117/C0101 /C0116/C0104/C0101/C0115/C0101 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0119/C0105/C0116/C0104/C0111/C0117/C0116 /C0110/C0111/C0116/C0105/C0099/C0101/C0046

/C0079/C0080/C0065/C0056/C0050/C0055 SBOS376A − NOVEMBER 2006 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2)Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.7V beyond the supply rails should be current-limited to 10mA or less. (3)Short-circuit to ground, one amplifier per package. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING Low Grade OPA827A SO-8 D OPA827A OPA827A MSOP-8 DGK TBD OPA2827A SO-8 D OPA2827A OPA2827A TSSOP-8 PW TBD High Grade OPA827I SO-8 D OPA827 OPA827I MSOP-8 DGK TBD OPA2827I SO-8 D OPA2827 OPA2827I TSSOP-8 PW TBD (1)For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. PIN CONFIGURATIONS OUT B +IN B OUT A +IN A OPA2827 TSSOP−8, SO−8 A B NC (1) OUT NC (1) NC (1) +IN OPA827 SO−8, MSOP− 8 (1) NC denotes no internal connection. −IN −IN B −IN A V−V− TOP VIEW PRODUCT PREVIEW

/C0079/C0080/C0065/C0056/C0050/C0055 SBOS376A − NOVEMBER 2006 www.ti.com ELECTRICAL CHARACTERISTICS: V S = /C00434V to /C004318V BOLDFACE limits apply over the specified temperature range, TA = −40/C0053C to +125/C0053C. At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted. OPA827A, OPA2827A OPA827I, OPA2827I PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX UNIT OFFSET VOLTAGE Input Offset Voltage VOS VCM = 0V, VS = ±15V TBD 250 TBD TBD µV Drift dVOS /dT 1 3.5 TBD TBD µV//C0053C vs Power Supply PSRR V S = ±4V to ±18V , VCM = 0V TBD 10 TBD TBD µV/V Over Temperature VS = /C00434V to /C004318V , VCM = 0V 30 TBD µV/V Channel Separation, dc TBD TBD µV/V INPUT BIAS CURRENT Input Bias Current IB ±3 TBD * TBD pA Over Temperature TBD TBD TBD TBD pA Input Offset Current IOS ±3 TBD * TBD pA NOISE Input Voltage Noise f=0.1 to 10Hz en VS = ±18V , VCM = 0V 0.4 * µVPP Input Voltage Noise Density f = 1kHz e n VS = ±18V , VCM = 0V 4.5 * nV/√Hz f = 10kHz en VS = ±18V , VCM = 0V 4.5 * nV/√Hz Input Current Noise Density f = 1kHz in VS = ±18V , VCM = 0V TBD * fA/√Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range VCM (V−)+2.5 (V+)−2.5 * * V Common-Mode Rejection Ratio CMRR (V−)+2.5V < VCM < (V+)−2.5V 108 TBD dB Over Temperature TBD TBD dB INPUT IMPEDANCE Differential 1013 || TBD * Ω || pF Common-Mode 1013 ||7 * Ω || pF OPEN-LOOP GAIN Open-Loop Voltage Gain AOL R L = 1kΩ, (V−)+2.75V<VO <(V+)−2.1V 114 120 TBD TBD dB Over Temperature R L = 1k/C0087, (V−)+2.75V<VO <(V+)−2.1V

108 TBD TBD TBD dB

FREQUENCY RESPONSE CL = 100pF Gain-Bandwidth Product GBW 18 * MHz Slew Rate SR G = +1 22 * V/µs Settling Time, 0.1% tS 4V Step, G = +1 TBD * ns 0.01% (16-bit) 4V Step, G = +1 TBD * ns Overload Recovery Time VIN • Gain > VS TBD * µs Total Harmonic Distortion + Noise THD+N G = +1, f = 1kHz TBD * % OUTPUT Voltage Output Swing from Rail R L = 1kΩ, AOL > 114dB (V−)+2.75 (V+)−2.1 * * V Over Temperature R L = 1k/C0087, AOL > 108dB (V−)+2.75 (V+)−2.1 * * V Output Current IOUT |VS − VOUT | < 1.5V 30 * mA Short-Circuit Current ISC ±40 * mA Capacitive Load Drive C LOAD TBD TBD pF NOTE : * indicates same specifications as for low-grade version of device. PRODUCT PREVIEW

/C0079/C0080/C0065/C0056/C0050/C0055 SBOS376A − NOVEMBER 2006 www.ti.com ELECTRICAL CHARACTERISTICS: V S = /C00434V to /C004318V (continued) BOLDFACE limits apply over the specified temperature range, TA = −40/C0053C to +125/C0053C. At TA = +25°C, RL = 10kΩ connected to VS/2, and VOUT = VS/2, unless otherwise noted. OPA827I, OPA2827IOPA827A, OPA2827A PARAMETER UNITMAXTYPMINMAXTYPMINCONDITIONS POWER SUPPLY Specified Voltage VS ±4 ±18 * * V Quiescent Current (per amp.) IQ IO = 0 4.5 TBD * * mA Over Temperature TBD * mA TEMPERATURE RANGE Specified Range −40 +125 * * °C Operating Range −55 +125 * * °C Thermal Resistance /C0113JA SO-8, MSOP-8, TSSOP-8 150 * °C/W NOTE : * indicates same specifications as for low-grade version of device. PRODUCT PREVIEW

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) OPA827AID PREVIEW SOIC D 8 75 TBD Call TI Call TI POPA827AID PREVIEW SOIC D 8 1500 TBD Call TI Call TI (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 22-Nov-2006 Addendum-Page 1

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