A75240

SN65220 TI | Alldatasheet

Document overview

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Technical content

/C0083/C0078/C0054/C0053/C0050/C0050/C0048 /C0083/C0078/C0054/C0053/C0050/C0052/C0048 /C0083/C0078/C0055/C0053/C0050/C0052/C0048 SLLS266F − FEBRUARY 1997 − REVISED JULY 2004 /C0085/C0083/C0066 /C0080/C0079/C0082/C0084 /C0084/C0082/C0065/C0078/C0083/C0073/C0069/C0078/C0084 /C0083/C0085/C0080/C0080/C0082/C0069/C0083/C0083/C0079/C0082/C0083 /C0089/C0090/C0066/C0045/C0052 /C0068/C0066/C0086/C0045/C0054/C0080/C0087/C0045/C0056 /C0080/C0045/C0056

FEATURES

/C0068Design to Protect Submicron 3-V or 5-V Circuits from Noise Transients /C0068Port ESD Protection Capability Exceeds: − 15-kV Human Body Model − 2-kV Machine Model /C0068Available in a WCSP Chip-Scale Package /C0068Stand-Off Voltage...6.0 V Min /C0068Low Current Leakage...1 µA Max at 6 V /C0068Low Capacitance ...35 pF Typ

DESCRIPTION

The SN65220 is a single transient voltage suppressor and the SN65240 and SN75240 are dual transient voltage suppressors designed to provide electrical noise transient protection to Universal Serial Bus (USB) 1.1 ports. Note that the input capacitance of the device makes it unsuitable for high-speed USB 2.0 applications. Any cabled I/O can be subjected to electrical noise transients from various sources. These noise transients can cause damage to the USB transceiver and/or the USB ASIC if they are of sufficient magnitude and duration. USB ports are typically implemented in 3-V or 5-V digital CMOS with very limited ESD protection. The SN65220, SN65240, and SN75240 can significantly increase the port ESD protection level and reduce the risk of damage to the circuits of the USB port. The IEC1000-4-2 ESD performance of the SN65220, SN65240, and SN75240 is measured at the system level. Therefore, system design impacts the results of these tests. A high compliance level may be attained with proper board design and layout.

APPLICATIONS

/C0068USB 1.1 Host, Hub, or Peripheral Ports /C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. www.ti.com Copyright  1997 − 2003, Texas Instruments Incorporated A1 A2 B2B1 A GND GND B SN65220YZB (Size: 925 /C0109m x 925 /C0109m /C00436 /C0109m ) (TOP VIEW) (TOP VIEW)† 1NC GND NC A B SN65220DBV GND5 NC − No internal connection GND C GND D A GND B GND SN65240P , SN65240PW SN75240P , SN75240PW (TOP VIEW) SADI †When read horizontally, Pin 1 is the bottom left pin. NOTE A: Typical current versus voltage curve was derived using the IEC 1.2/50-µs surge waveform. CURRENT vs VOLTAGE −2.5 −7.5 −10 −5 0 2.5 5 10 15 Voltage − V Current − A −10 7.5 A or C GND B or D (One Suppressor Shown) NOTE : All GND terminals should be connected to ground. EQUIVALENT SCHEMATIC DIAGRAM

/C0083/C0078/C0054/C0053/C0050/C0050/C0048 /C0083/C0078/C0054/C0053/C0050/C0052/C0048 /C0083/C0078/C0055/C0053/C0050/C0052/C0048 SLLS266F − FEBRUARY 1997 − REVISED JULY 2004 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. IEC1000-4-2 COMPLIANCE LEVEL IEC1000-4-2 MAXIMUM TEST VOLTAGE IEC1000-4-2 COMPLIANCE LEVEL CONTACT DISCHARGE (kV) AIR DISCHARGE (kV) 1 2 2 2 4 4 3 6 8 4 8 15 PACKAGE/ORDERING INFORMATION PRODUCT SUPRESSORS TA PACKAGE PACKAGE DESIGNATOR MARKED AS ORDER NUMBER WCSP−4 YZB NWP or SN65220YZBR (Reel) SN65220 1 −40°C to 85°C WCSP−4 YZB NWP or

65220 SN65220YZBT (Mini Reel)

SN65220 1 −40°C to 85°C SOT23−6 DBV SADI SN65220DBVR (Mini Reel) SOT23−6 DBV SADI SN65220DBVT (Mini Reel) DIP−8 P SN65240P (Rail) SN65240 2 −40°C to 85°C TSSOP−8 PW A65240 SN65240PW (Rail)SN65240 2 −40 C to 85C TSSOP−8 PW A65240 SN65240PWR (Reel) DIP−8 P SN75240P (Rail) SN75240 2 0°C to 70°C TSSOP−8 PW A75240 SN75240PW (Rail)SN75240 2 0 C to 70C TSSOP−8 PW A75240 SN75240PWR (Reel) ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) UNIT Continuous power dissipation See Dissipation Rating Table Electrostatic discharge 15 kV(2), 2 kV(3) Peak power dissipation, PD(peak) 60 W Peak forward surge current, IFSM 3 A Peak reverse surge current, IRSM −9 A Storage temperature range, Tstg −65°C to 150°C (1)Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2)Human Body Model − Tested in accordance with JEDEC Standard 22, Test Method A114−A. (3)Charged Device Model − Tested in accordance with JEDEC Standard 22, Test Method C101.

/C0083/C0078/C0054/C0053/C0050/C0050/C0048 /C0083/C0078/C0054/C0053/C0050/C0052/C0048 /C0083/C0078/C0055/C0053/C0050/C0052/C0048 SLLS266F − FEBRUARY 1997 − REVISED JULY 2004 www.ti.com DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR ABOVE T A = 25°C ‡ TA = 70°C POWER RATING TA = 85°C POWER RATING DBV 385 mW 3.1 mW/°C 246 mW 200 mW P 1150 mW 9.2 mW/°C 736 mW 598 mW PW 520 mW 4.2 mW/°C 331 mW 268 mW ‡ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. recommended operating conditions MIN MAX UNIT Operating free-air temperature, TA SN75240 0 70 °COperating free-air temperature, TA SN65220, SN65240 −40 85 °C electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Ilkg Leakage current VI = 6 V at A, B, C, or D terminals 1 µA V(BR) Breakdown voltage VI = 1 mA at A, B, C, or D terminals6.5 7 8 V C IN Input capacitance to ground VI = 0.4 sin (4E6πt) + 0.5 V 35 pF

APPLICATION INFORMATION

GND15 kΩ 15 kΩ 27 Ω 27 Ω GND SN75220 or 1/2 SNx5240 A B Full-Speed or Low-Speed USB Host-or-Hub Port Transceiver 1.5 kΩ (Low Speed Only) 27 Ω 27 Ω SN75220 or 1/2 SNx5240 A B Full-Speed or Low-Speed USB Down Stream Transceiver 1.5 kΩ (Full Speed Only)

Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) SN65220DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65220DBVT ACTIVE SOT-23 DBV 6 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65220YZBR ACTIVE DSBGA YZB 4 3000 None Call TI Level-1-260C-UNLIM SN65220YZBT ACTIVE DSBGA YZB 4 250 None Call TI Level-1-260C-UNLIM SN65240P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN65240PW ACTIVE TSSOP PW 8 150 None CU NIPDAU Level-1-220C-UNLIM SN65240PWR ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-220C-UNLIM SN75240P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN75240PW ACTIVE TSSOP PW 8 150 None CU NIPDAU Level-1-220C-UNLIM SN75240PWLE OBSOLETE TSSOP PW 8 None Call TI Call TI SN75240PWR ACTIVE TSSOP PW 8 2000 None CU NIPDAU Level-1-220C-UNLIM SN75240PWRG4 PREVIEW TSSOP PW 8 2000 None Call TI Call TI (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - May not be currently available - please checkhttp://www.ti.com/productcontentfor the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 1-Mar-2005 Addendum-Page 1

MPDI001A – JANUARY 1995 – REVISED JUNE 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 P (R-PDIP-T8) PLASTIC DUAL-IN-LINE 0.015 (0,38) Gage Plane 0.325 (8,26) 0.300 (7,62) 0.010 (0,25) NOM MAX 0.430 (10,92) 4040082/D 05/98 0.200 (5,08) MAX 0.125 (3,18) MIN 0.355 (9,02) 0.020 (0,51) MIN 0.070 (1,78) MAX 0.240 (6,10) 0.260 (6,60) 0.400 (10,60) 0.015 (0,38) 0.021 (0,53) Seating Plane M0.010 (0,25) 0.100 (2,54) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153

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