A2U12M12W2-F1C STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 14

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 1.1 Inverter switch
  • 1.2 DC link capacitor (CGA9Q1C0G2J104J280KC)
  • 1.3 NTC (B57451V5103G362)
  • 1.4 Package
  • 2 Electrical characteristics (curves)
  • 3 Topology and pin description
  • 4 Package information
  • 4.1 ACEPACK 2, 3-level press fit package information

Features

  • ACEPACK 2 power module – 13 mΩ of typical R DS(on) each switch (2 dice in parallel per switch) – 2.5 kVrms insulation voltage – Integrated NTC temperature sensor – DC link capacitors between DC BUS and neutral – AIN DBC improved thermal performance – Press fit contact pins

Applications

  • High frequency converters

Description

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal performance substrate, which results in exceptional low on-resistance per unit area and excellent switching performance almost independent of temperature. A negative temperature sensor and three DC link capacitors are also included to optimize switching behavior. Product status link A2U12M12W2-F1C Product summary Order code A2U12M12W2-F1C Marking A2U12M12W2-F1C Package ACEPACK 2 Leads type Press fit Packing Tray ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET A2U12M12W2-F1C Datasheet DS13800 - Rev 1 - September 2021 For further information contact your local STMicroelectronics sales office.

1 Electrical ratings

1.1 Inverter switch

25 °C unless otherwise specified). Table 1. Absolute maximum ratings

  1. Pulse width is limited by safe operating area.

Table 2. Thermal data Table 3. Electrical characteristics

Table 4. Switching energy

  1. Values are referred to the discrete device SCTW70N120G2V.

Table 5. Source-drain antiparallel diode

  1. Values are referred to the discrete device SCTW70N120G2V.

1.2 DC link capacitor (CGA9Q1C0G2J104J280KC)

Table 6. Absolute maximum rating for capacitor Table 7. Electrical characteristics – capacitor

1.3 NTC (B57451V5103G362)

Table 8. Absolute maximum ratings for NTC temperature sensor, considered as stand-alone

1.4 Package

Table 9. Absolute maximum ratings for ACEPACK 2 package

2 Electrical characteristics (curves)

Every switch is made by two SiC MOSFET in parallel and their gates are shorted during every single test. Figure 3. Typical output characteristics (TJ = -40 °C) Figure 4. Typical output characteristics (TJ = 25 °C) Figure 5. Typical output characteristics (TJ = 150 °C) Figure 6. Typical transfer characteristics Figure 7. Typical diode foward charcteristics (terminal) Figure 8. Maximum transient thermal impedance

3 Topology and pin description

Figure 9. Electrical topology and pin description Figure 10. Package top view with pinout

4 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

4.1 ACEPACK 2, 3-level press fit package information

Figure 11. ACEPACK 2, 3-level press fit package outline (dimensions are in mm)

Package information

Table 10. ACEPACK 2, 3-level press fit mechanical data

Figure 12. ACEPACK 2, 3-level press fit recommended PCB holes layout (dimensions are in mm)

Revision history

Table 11. Document revision history 06-Sep-2021 1 First release.