A2C25S12M3 STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 18

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 1.1 Inverter stage
  • 1.1.1 IGBTs
  • 1.1.2 Diode
  • 1.2 Brake stage
  • 1.2.1 IGBT
  • 1.2.2 Diode
  • 1.3 Converter stage
  • 1.4 NTC
  • 1.5 Package
  • 2 Electrical characteristics (curves)
  • 3 Test circuits
  • 4 Topology and pin description
  • 5 Package information
  • 5.1 ACEPACK 2 CIB solder pins package information

Features

  • ACEPACK 2 power module – DBC Cu Al 2O3 Cu
  • Converter inverter brake topology – 1600 V, very low drop rectifiers for converter – 1200 V, 25 A IGBTs and diodes – Soft and fast recovery diode
  • Integrated NTC
  • UL recognition: UL 1557, file E81734
  • Isolation rating of 2500 V rms/min
  • RoHS compliant

Applications

  • Inverters
  • Motor drives

Description

This power module is a converter-inverter brake (CIB) topology in an ACEPACK 2 package with NTC, integrating the advanced trench gate field-stop technology from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz. Product status A2C25S12M3 Product summary Order code A2C25S12M3 Marking A2C25S12M3 Package ACEPACK 2 Leads type Solder contact pins ACEPACK 2 converter inverter brake, 1200 V, 25 A, trench gate field‑stop M series IGBT with soft diode and NTC A2C25S12M3 Datasheet DS12320 - Rev 4 - April 2019 For further information contact your local STMicroelectronics sales office.

1 Electrical ratings

1.1 Inverter stage

Limiting values at TJ = 25 °C, unless otherwise specified.

1.1.1 IGBTs

Table 1. Absolute maximum ratings of the IGBTs, inverter stage

  1. Pulse width limited by maximum junction temperature.

Table 2. Electrical characteristics of the IGBTs, inverter stage

  1. Including the reverse recovery of the diode.
  2. Including the tail of the collector current.

1.1.2 Diode

Limiting values at TJ = 25 °C, unless otherwise specified. Table 3. Absolute maximum ratings of the diode, inverter stage

  1. Pulse width limited by maximum junction temperature.

Table 4. Electrical characteristics of the diode, inverter stage

1.2 Brake stage

Limiting values at TJ = 25 °C, unless otherwise specified.

1.2.1 IGBT

Table 5. Absolute maximum ratings of the IGBT, brake stage

  1. Pulse width limited by maximum junction temperature.

Table 6. Electrical characteristics of the IGBT, brake stage

  1. Including the reverse recovery of the diode.
  2. Including the tail of the collector current.

1.2.2 Diode

Table 7. Absolute maximum ratings of the diode, brake stage

  1. Pulse width limited by maximum junction temperature.

Table 8. Electrical characteristics of the diode, brake stage

1.3 Converter stage

Limiting values at TJ = 25 °C, unless otherwise specified. Table 9. Absolute maximum ratings of the bridge rectifiers Table 10. Electrical characteristics of the bridge rectifiers

1.4 NTC

Table 11. NTC temperature sensor, considered as stand-alone Figure 1. NTC resistance vs temperature Figure 2. NTC resistance vs temperature, zoom

1.5 Package

Table 12. ACEPACK™ 2 package

2 Electrical characteristics (curves)

Figure 3. IGBT output characteristics Figure 4. IGBT output characteristics Figure 5. IGBT transfer characteristics Figure 6. IGBT collector current vs case temperature

3 Test circuits

Figure 17. Test circuit for inductive load switching Figure 18. Gate charge test circuit Figure 19. Switching waveform Figure 20. Diode reverse recovery waveform

4 Topology and pin description

Figure 21. Electrical topology and pin description Figure 22. Package top view with CIB pinout

5 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. A2C25S12M3

Package information

DS12320 - Rev 4 page 14/18

5.1 ACEPACK 2 CIB solder pins package information

Figure 23. ACEPACK 2 CIB solder pins package outline (dimensions are in mm)

3.2 BSC

52.7 REF

37 REF

3.5 REF x45°

2.3 REF

  • The lead size includes the thickness of the lead plating material.
  • Dimensions do not include mold protrusion.
  • Package dimensions do not include any eventual metal burrs. A2C25S12M3 ACEPACK 2 CIB solder pins package information DS12320 - Rev 4 page 15/18

Revision history

Table 13. Document revision history 02-Oct-2017 1 Initial release. Modified features on cover page. thermal impedance and Figure 15. Inverter diode thermal impedance. Added Figure 6. IGBT collector current vs case temperature.