A1P25S12M3 STMICROELECTRONICS | Alldatasheet

Document overview

  • Manufacturer or author: STMICROELECTRONICS
  • PDF pages: 15

Technical content

Datasheet sections

  • 1 Electrical ratings
  • 1.1 IGBT
  • 1.2 Diode
  • 1.3 NTC
  • 1.4 Package
  • 2 Electrical characteristics (curves)
  • 3 Test circuits
  • 4 Topology and pin description
  • 5 Package information
  • 5.1 ACEPACK™ 1 sixpack solder pins package information

Features

  • ACEPACK™ 1 power module – DBC Cu Al 2O3 Cu
  • Sixpack topology – 1200 V, 25 A IGBTs and diodes – Soft and fast recovery diode
  • Integrated NTC

Applications

  • Inverters
  • Industrial
  • Motor drives

Description

This power module is a sixpack topology in an ACEPACK™ 1 package with NTC, integrating the advanced trench gate field-stop technologies from STMicroelectronics. This new IGBT technology represents the best compromise between conduction and switching loss, to maximize the efficiency of any converter system up to 20 kHz. Product status A1P25S12M3 Product summary Order code A1P25S12M3 Marking A1P25S12M3 Package ACEPACK™ 1 Leads type Solder contact pins ACEPACK™ 1 sixpack topology, 1200 V, 25 A, trench gate field‑stop M series IGBT with soft diode and NTC A1P25S12M3 Datasheet DS12281 - Rev 4 - November 2018 For further information contact your local STMicroelectronics sales office.

1 Electrical ratings

1.1 IGBT

Limiting values at TJ = 25 °C, unless otherwise specified. Table 1. Absolute maximum ratings of the IGBT

  1. Pulse width limited by maximum junction temperature.

Table 2. Electrical characteristics of the IGBT

  1. Including the reverse recovery of the diode.
  2. Including the tail of the collector current.

1.2 Diode

Limiting values at TJ = 25 °C, unless otherwise specified. Table 3. Absolute maximum ratings of the diode

  1. Pulse width limited by maximum junction temperature.

Table 4. Electrical characteristics of the diode

1.3 NTC

Table 5. NTC temperature sensor, considered as stand-alone Figure 1. NTC resistance vs temperature Figure 2. NTC resistance vs temperature, zoom

1.4 Package

Table 6. ACEPACK™ 1 package

2 Electrical characteristics (curves)

Figure 3. IGBT output characteristics Figure 4. IGBT output characteristics Figure 5. IGBT transfer characteristics Figure 6. IGBT collector current vs case temperature Figure 7. Switching energy vs gate resistance Figure 8. Switching energy vs collector current

Figure 15. IGBT thermal impedance

3 Test circuits

Figure 16. Test circuit for inductive load switching Figure 17. Gate charge test circuit Figure 18. Switching waveform Figure 19. Diode reverse recovery waveform

4 Topology and pin description

Figure 20. Electrical topology and pin description Figure 21. Package top view with sixpack pinout

5 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. A1P25S12M3

Package information

DS12281 - Rev 4 page 11/15

5.1 ACEPACK™ 1 sixpack solder pins package information

Figure 22. ACEPACK™ 1 sixpack solder pins package outline (dimensions are in mm)

3.2 BSC

36.8 REF

2.3 REF

3.5 REF x45°

  • The lead size includes the thickness of the lead plating material.
  • Dimensions do not include mold protrusion.
  • Package dimensions do not include any eventual metal burrs. A1P25S12M3 ACEPACK™ 1 sixpack solder pins package information DS12281 - Rev 4 page 12/15

Revision history

Table 7. Document revision history 01-Sep-2017 1 Initial release. Document status promoted from preliminary data to production data. Updated features and removed maturity status indication from cover page. Added Figure 6. IGBT collector current vs case temperature.