TPCM7000 LSTD | Alldatasheet
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Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2020 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. PRODUCT DESCRIPTION Tpcm™ 7000 is newest in Laird’s line of high-performance TIM product offerings. With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm. Coupled with superior wetting of the mating surfaces and displacing air, Tpcm™ 7000 provides industry leading lowest thermal resistance. Tpcm™ 7000 reliability has been demonstrated though exposure to 2000 hours of various aging tests resulting in proven dependability at an operating temperature of 150°C. The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive greases and other phase change materials. Tpcm™ 7000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application. FEATURES & BENEFITS
- 7.5 W/mK bulk thermal conductivity
- Non silicone formulation that provides naturally tacky surface
- Fully characterized long term reliability
- No pump out
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
- Easy rework MARKETS
- Graphics Card
- Desktops
- Servers
- IGBTs
- Automotive
- Memory Modules
- Game Consoles AVAILABILITY
- Four thickness: 0.125mm, 0.2 mm, 0.25mm, 0.4mm (Tpcm 7125, Tpcm 7200, Tpcm 7250, Tpcm 7400 respectively)
- Sheets and Die Cuts, Die cut on strips w/tabs, Die cut on rolls w/tabs
- Designed for use with the TIM Print, Refer to “TIM Print Application Guide” STORAGE CONDITIONS Shelf life: 1 year from date of shipment in sealed bag Storage conditions: 0 to 40C in sealed bag. No humidity requirements. See A18223-00 “Instruction for Use” for more details TYPICAL PROPERTIES PROPERTY VALUE TEST METHOD Construction Free Standing, Filled, Non- Silicone Thermoplastic N/A Color Grey Visual Thickness 0.13mm, 0.20mm, 0.25mm, 0.40mm Density 2.5 g/cc Helium Pycnometer Bulk Thermal Conductivity 7.5 W/m-K Hot Disk Thermal Resistance 10 psi & 70°C 50 psi & 70°C 0.10°C-cm2/W 0.06°C-cm2/W ASTM D5470 Operating Temperature Range -40°C to 125°C Laird Test Method Softening Temperature Range 50°C to 70°C Laird Test Method Minimum Bondline Thickness 35µm Laird Test Method Dielectric Constant 31.54 @1MHz ASTM D150 Volume Resistivity 5.4x1015 Ω-cm ASTM D991 UL Recognition V-0 pending UL94 USA: +1.866.928.8181 Europe: +49.8031.24600 Asia: +86.755.2714.1166 www.laird.com