MIC-770-V3 ADVANTECH | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 3
Technical content
Features
Intel® 12th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipset Wide operating temperature (-20 ~ 60 °C) VGA and HDMI output 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1) 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional) 1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2 9 ~ 36 VDC input power range IP40 dust proof for deployment in harsh environment Supports FlexIO and iDoor technology, flexible configure additional HDMI, DP , DVI, COM port, DIO, Remote switch IO Supports Advantech i-Modules Supports Advantech SUSIAPI and embedded software APIs Supports Intel® vPro™/AMT and TPM technologies Supports Advantech iBMC 1.2 remote out-of-band power management solution on DeviceOn Specifications 12th Generation Processor (TDP 35W) CPU i9-12900TE i7-12700TE i5-12500TE i3-12100TE Pentium G7400TE Celeron G6900TE Core/Thread number 16/24 12/20 6/12 4/8 2/4 2/2 Max Tirbo Frequency 4.80 GHz 4.60 GHz 4.30 GHz 4.00 GHz L3 Cache 30 MB 16 MB 12 MB 6 MB 2.5MB 2.5MB Temperature -20 ~ 60 °C (w/ industrial wide-temp SSD, 0.7m/s air flow) Chipset R680E/H610E BIOS AMI 256Mb/128Mb SPI Flash 12th Generation Processor (TDP 65W) CPU i9-12900(E) i7-12700(E) i5-12500(E) i3-12100(E) G7400E (46W) G6900E (46W) Core/Thread number 16/24 12/20 6/12 4/8 2/4 2/2 Max Tirbo Frequency 5.00 GHz 4.80 GHz 4.50 GHz 4.20 GHz L3 Cache 30 MB 25 MB 18 MB 5 MB 2.5 MB 2.5 MB Temperature -20 ~ 50 °C (w/ industrial wide-temp SSD, 0.7m/s air flow) Chipset R680E/H610E BIOS AMI 256Mb/128Mb SPI Flash Memory Technology Dual-channel DDR5 4800 MHz (R680E SKU supports ECC) Socket 2 x 262-pin DDR5 SODIMM (up to 32GB per socket) Maximum Capacity 64GB Display Chipset Core i: Intel® UHD Graphics 770 Pentium/Celeron: Intel® HD Graphics 710 VGA 1 x DB15, up to 1920 x 1200 maximum resolution HDMI 1 x HDMI, up to 4096 x 2160@30Hz Multiple Display R680E: 4 x independent displays (third and fourth display output via optional cable) H610E: 3 x independent displays (third display output via optional cable) Ethernet Controller R680E LAN1: Intel® I219LM, LAN2: Intel® i210IT H610E LAN1: Intel® I219V, LAN2: Intel® i210IT Interface 2 x RJ45 Storage HDD 1 x 2.5" HDD/SSD (up to 2 x 2.5" SSD by optional kit; 2 x 3.5" HDD by i-Module) mSATA 1 NVMe M.2 1 x M Key 2280 with PCIe Gen 4 x 4 (R680E SKU, operating temp. -20 ~ 50 °C) RAID 0/1/5/10 (R680E SKU only) I/O USB R680E: 2 x USB3.2 (Gen2), 6 x USB3.2 (Gen1), 1 x USB 2.0 (Internal) H610E: 4 x USB3.2 (Gen1), 4 x USB2.0 Serial Port 2 x DB9, RS-232/422/485 support auto flow control; 4 x RS-232 (Optional) Audio 2 (1 x line out and 1 x mic in) Expansion Module Supports Advantech i-Modules Mini PCIe/mSATA R680E: 1 x mini PCIe, 1 x mini PCIe/mSATA H610E: 1 x mini PCIe, 1 x mSATA LED and Switch LED 2 (1 x Storage and 1 x Power), 4 for COM1 TX/RX and COM2 TX/RX Button 1 x Power on/off switch Remote Switch Yes, 2pin terminal block (Optional) Power Type ATX/AT Input Voltage 9 ~ 36 VDC Power consumption 9~19VDC support total 140W 19~36V support total 180W for system and Peripheral card Watchdog Timer Output System reset Interval Programmable 1 ~ 255 sec/min Environment Temperature 65W CPU w/ industrial wide Temp. SSD 35W CPU w/ industrial wide Temp. SSD Non-operating -20 ~ 50 °C with 0.7 m/s air flow -20 ~ 60 °C with 0.7 m/s air flow -40 ~ 85 °C Humidity 95% @ 40 °C (non-condensing) Vibration With SSD: 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis With 2.5" HDD: 1 Grms @ 5 ~ 500 Hz, random, 1 hr/axis 2G Shock With SSD: 20G, IEC-68-2-27, half-sine wave, 11 ms duration 50G 11 ms Mechanical Dimensions (W x H x D) 77 x 192 x 230 mm (3.07" x 7.55" x 9.05") Weight 2.8 kg (6.17 lbs) Installation Desktop/wall mount Certifications EMC CE/FCC Class A, CCC, BSMI Safety CB/UL, CCC, BSMI OS Support Windows 10, Windows 10 IoT, Linux OS Note: The CPU PCIe slot can support graphic cards only due to Intel design specification. Other types of add-on cards will have no function installed on this slot. Compact Fanless System with 12th Gen Intel® Core™ i CPU Socket (LGA 1700) Preliminary All product specifications are subject to change without notice. Last updated: 9-Jan-2023
www.advantech.com/productsOnline Download Front View Dimensions Unit: mm iDoor or 2 x RS-232 expansion slots MIC-770 V3 77 82.20 192 224 250 22 186 230 40 150 Ø10
Ordering Information
Part Number VGA HDMI 2.5" HDD/SSD mSATA NVMe M.2 USB3.2 (Gen2) USB3.2 (Gen1) USB
2.0 GbE COM PCIe Power
MIC-770V3W-00A1 1 1 1 1 1 2 6 0 2 2, up to 6 (Optional) i-Module (optional)* 9 ~ 36VDC MIC-770V3H-00A1 1 1 1 1 0 0 4 4 2 2, up to 6 (Optional) i-Module (optional)* 9 ~ 36VDC * MIC-770V3H does not support MIC-75M20-01 HDMI USB 3.2/2.0 COM 1/2 Power Flex IO interface 9 ~ 36 VDC Small Flex IO interface Line Out Mic In VGACOM2 TX/RX COM1 TX/RX LAN1/2 USB3.2 (Gen2)
96PSA-A230W24P4-3* ADP A/D 100-240V 230W 24V C14 TERMINAL BLOCK 4P 1702002600 Power cord (USA) UL/CSA, 3-pin, 10A, 125V, 1.83 M, 180 D
1700008921 Power Cord PSE 3P 7A 125V 183cm
1702002605 Power Cord (EU), 3-pin, 10A, 250V 1.83M, 90D Din Rail PSU 96PSD-A240W24-MN* A/D 100-240V 240W 24V NDR DIN RAIL 1700031170-01 DC-DC power cord, A cable TEM*4/TEM*4 UL2464 18AWG 150cm 1700029720-01 AC-DC power cord (US), M cable AC CONN 3P 183cm 1700030520-01 AC-DC power cord (CN), M cable conn 3P CCC 10A 250V 150cm 1700031408-01 AC-DC power cord (EU), M cable conn 3P/G-TEM*3 80CM * Please use 230W adaptor when i-Module is added. Note: 1. MIC-770 V3 supports Advantech iDoor modules (both MOS and PCM series), excluding the PoE model. 2. The PCM series module requires a bracket (P/N: 1960065854N001) that must be ordered separately. Optional Flex I/O* & Kits Part Number Description Flex I/O AIIS-DIO32-00A1E AIIS GPIO module (32 bit) PCA-TPMSPI-00A1 TPM 2.0 module (SPI) 98R17500001 MIC DVI FIO 98R17500101 MIC HDMI/Remote power on/off FIO 98R17500301 MIC HDMI kit FIO 98R17500401 MIC Remote power on/off FIO 98R17500601 MIC 2x COMports kit FIO 98R17500701 MIC Remote power on/off kit for SFIO 98R17500801 MIC Reset/Remote power on/off/5VDC kit FIO 98R17500901 MIC GPIO kit FIO 98R17501001 MIC DP kit FIO 98R17501101 COM and HDMI kit Advanced Flex I/O*
98910770301 MIC NVMe + 4 LAN Advanced FIO
98910770401 MIC NVMe Advanced FIO
98910770501 MIC 4 PoE Advanced FIO
98R1752010E 2nd 2.5" HDD/SSD kit (used in 2-slot i-Module) 98R1752020E 2 x 2.5" SSD kit (Thickness: 7mm) Mounting Kit 98R17500210 MIC Din Rail Mounting kit 98R17500501 MIC Wall Mounting kit * Please refer to Flex I/O datasheet for more detail. AIIS-DIO32 requires a DB37 bracket (P/N: 1960068787N002) * R680E SKU only Packing List Part Number Description Quantity MIC-770 V3 MIC-770 V3 bare system 1
2041077040 MIC-770 V3 startup manual
(ENG+TC+SC) 1 1652003234 4-pin Phoenix power connector 1 1960070543T005 2 x Mounting bracket 2 1700013095-01 SATA cable 1 1700024372-01 SATA power cable 1 2170000093-01 CPU thermal grease 1 1990019498N000 RAM thermal pad 2 Optional i-Modules* Part Number Description MIC-75M13-00A2 4-slot expansion module (1 x PCIe and 3 x PCI slots) MIC-75M20-00C1 2-slot expansion module (2 x PCIe slots) MIC-75M20-01A2 2-slot expansion module (2 x PCIe slots) MIC-75M11-00A2 2-slot expansion module (1 x PCIe and 1 x PCI slots) MIC-75S20-00A2 2-slot expansion and storage module (2 x PCIe and 2 x 2.5 removable 2.5" storage bay) MIC-75G20-10A2 GPU Card expansion module (2 x PCIe and 2 x removable 2.5" storage bay) MIC-75G30-00A2 Dual GPU card expansion module (3x PCIe and 2 x removable 2.5" storage bay) MIC-75GF10-00A1 MXM GPU expansion i-Module (1 x PCIe and 2 x removable 2.5" storage bay) 98R17520301 2 x 3.5" HDD kit *Please refer to i-Module datasheet for more detail. ** R680E SKU only Embedded OS Part Number Description TBD TBD MIC-770 V3