MMBT3904L_V01 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- These Devices are PbïFree, Halogen Free/BFR Free and are RoHS Compliant
- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECïQ101 Qualified and PPAP Capable MAXIMUM RATINGS Rating Symbol Value Unit CollectorïEmitter Voltage VCEO 40 Vdc CollectorïBase Voltage VCBO 60 Vdc EmitterïBase Voltage VEBO 6.0 Vdc Collector Current ï Continuous IC 200 mAdc Collector Current ï Peak (Note 3) ICM 900 mAdc THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FRï5 Board (Note 1) @TA = 25°C Derate above 25°C PD 225 1.8 mW mW/°C Thermal Resistance, JunctionïtoïAmbient R/C0113JA 556 °C/W Total Device Dissipation Alumina Substrate, (Note 2) @TA = 25°C Derate above 25°C PD 300 2.4 mW mW/°C Thermal Resistance, JunctionïtoïAmbient R/C0113JA 417 °C/W Junction and Storage Temperature TJ, Tstg ï55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 3. Reference SOA curve. COLLECTOR BASE EMITTER For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D. SOTï23 (TOï236) CASE 318 STYLE 6 MARKING DIAGRAM 1AM = Specific Device Code M = Date Code* /C0071 = PbïFree Package *Date Code orientation and/or overbar may vary depending upon manufacturing location. (Note: Microdot may be in either location) 1AM M /C0071 /C0071 Device Package Shipping
ORDERING INFORMATION
SOTï23 (PbïFree) MMBT3904LT1G SMMBT3904LT1G SOTï23 (PbïFree) 3000 / Tape & Reel 10,000 / Tape & Reel
SOTï23 (TOï236) CASE 318ï08 ISSUE AS DATE 30 JAN 2018 SCALE 4:1 D 1 2 XXXM/C0071 /C0071 XXX = Specific Device Code M = Date Code /C0071= PbïFree Package *This information is generic. Please refer to device data sheet for actual part marking. PbïFree indicator, G or microdot /C0071, may or may not be present. GENERIC MARKING DIAGRAM* NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. SOLDERING FOOTPRINT VIEW C L 0.25 e E E b A SEE VIEW C DIM A MIN NOM MAX MIN MILLIMETERS 0.89 1.00 1.11 0.035 INCHES A1 0.01 0.06 0.10 0.000 b 0.37 0.44 0.50 0.015 c 0.08 0.14 0.20 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.30 0.43 0.55 0.012 0.039 0.044 0.002 0.004 0.017 0.020 0.006 0.008 0.114 0.120 0.051 0.055 0.075 0.080 0.017 0.022 NOM MAX H STYLE 22: PIN 1. RETURN 2. OUTPUT 3. INPUT STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 7: PIN 1. EMITTER 2. BASE 3. COLLECTOR STYLE 8: PIN 1. ANODE 2. NO CONNECTION 3. CATHODE STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 10: PIN 1. DRAIN 2. SOURCE 3. GATE STYLE 11: PIN 1. ANODE 2. CATHODE 3. CATHODE ïANODE STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE STYLE 13: PIN 1. SOURCE 2. DRAIN 3. GATE STYLE 14: PIN 1. CATHODE 2. GATE 3. ANODE STYLE 15: PIN 1. GATE 2. CATHODE 3. ANODE STYLE 16: PIN 1. ANODE 2. CATHODE 3. CATHODE STYLE 17: PIN 1. NO CONNECTION 2. ANODE 3. CATHODE STYLE 18: PIN 1. NO CONNECTION 2. CATHODE 3. ANODE STYLE 19: PIN 1. CATHODE 2. ANODE 3. CATHODE ïANODE STYLE 23: PIN 1. ANODE 2. ANODE 3. CATHODE STYLE 20: PIN 1. CATHODE 2. ANODE 3. GATE STYLE 21: PIN 1. GATE 2. SOURCE 3. DRAIN STYLE 1 THRU 5: CANCELLED STYLE 24: PIN 1. GATE 2. DRAIN 3. SOURCE STYLE 25: PIN 1. ANODE 2. CATHODE 3. GATE STYLE 26: PIN 1. CATHODE 2. ANODE 3. NO CONNECTION STYLE 27: PIN 1. CATHODE 2. CATHODE 3. CATHODE c 0 ïïï 10 0 ïïï 10T ° ° ° ° T TOP VIEW SIDE VIEW END VIEW 2.90 0.80 DIMENSIONS: MILLIMETERS 0.90 PITCH 3X 0.95 RECOMMENDED STYLE 28: PIN 1. ANODE 2. ANODE 3. ANODE MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98ASB42226BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped CONTROLLED COPY in red. PAGE 1 OF 1SOTï23 (TOï236) Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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