98ASB14087C

LM393_V01 ONSEMI | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 13

Technical content

Features

• Wide Single−Supply Range: 2.0 Vdc to 36 Vdc
• Split−Supply Range: ±1.0 Vdc to ±18 Vdc
• Very Low Current Drain Independent of Supply V oltage: 0.4 mA
• Low Input Bias Current: 25 nA
• Low Input Offset Current: 5.0 nA
• Low Input Offset V oltage: 5.0 mV (max) LM293/393
• Input Common Mode Range to Ground Level
• Differential Input V oltage Range Equal to Power Supply V oltage
• Output V oltage Compatible with DTL, ECL, TTL, MOS, and CMOS Logic Levels
• ESD Clamps on the Inputs Increase the Ruggedness of the Device without Affecting Performance
• NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant See detailed marking information and ordering and shipping information on page 7 of this data sheet. DEVICE MARKING AND ORDERING INFORMATION PDIP−8 N SUFFIX CASE 626 SOIC−8 D SUFFIX CASE 751 PIN CONNECTIONS (Top View) GND Inputs A Inputs B Output B Output A VCC Micro8/C0069 DM SUFFIX CASE 846A8

Figure 1. Representative Schematic Diagram

LM393, LM393E, LM293, LM2903, LM2903E, LM2903V, NCV2903 www.onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Power Supply Voltage VCC +36 or ±18 V Input Differential Voltage VIDR 36 V Input Common Mode Voltage Range VICR −0.3 to +36 V Output Voltage VO 36 V Output Short Circuit−to−Ground Output Sink Current (Note 1) ISC ISink Continuous mA Power Dissipation @ TA = 25°C Derate above 25°C PD 1/R/C0113JA 570 5.7 mW mW/°C Operating Ambient Temperature Range LM293 LM393, LM393E LM2903, LM2903E LM2903V, NCV2903 (Note 2) TA −25 to +85 0 to +70 −40 to +105 −40 to +125 Maximum Operating Junction Temperature LM393, LM393E, LM2903, LM2903E, LM2903V LM293, NCV2903 TJ(max) 150 150 Storage Temperature Range Tstg −65 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The maximum output current may be as high as 20 mA, independent of the magnitude of V CC, output short circuits to V CC can cause excessive heating and eventual destruction. 2. NCV2903 is qualified for automotive use. ESD RATINGS Rating HBM MM Unit ESD Protection at any Pin (Human Body Model − HBM, Machine Model − MM) NCV2903 (Note 2) LM393E, LM2903E LM393DG/DR2G, LM2903DG/DR2G All Other Devices 2000 1500 250 1500 200 150 100 150 V V V V

LM393, LM393E, LM293, LM2903, LM2903E, LM2903V, NCV2903 www.onsemi.com ELECTRICAL CHARACTERISTICS (VCC = 5.0 Vdc, Tlow ≤ TA ≤ Thigh, unless otherwise noted.) Characteristic Symbol LM293, LM393, LM393E LM2903/E/V, NCV2903 UnitMin Typ Max Min Typ Max Input Offset Voltage (Note 4) VIO mV Input Offset Current IIO nA Input Bias Current (Note 5) IIB nA TA = 25°C − 20 250 − 20 250 Tlow ≤ TA ≤ Thigh − − 400 − 20 500 Input Common Mode Voltage Range (Note 6) VICR V TA = 25°C 0 − VCC −1.5 0 − VCC −1.5 Tlow ≤ TA ≤ Thigh 0 − VCC −2.0 0 − VCC −2.0 Voltage Gain AVOL 50 200 − 25 200 − V/mV RL ≥ 15 k/C0087, VCC = 15 Vdc, TA = 25°C Large Signal Response Time − − 300 − − 300 − ns Vin = TTL Logic Swing, Vref = 1.4 Vdc VRL = 5.0 Vdc, RL = 5.1 k/C0087, TA = 25°C Response Time (Note 7) tTLH − 1.3 − − 1.5 − /C0109s VRL = 5.0 Vdc, RL = 5.1 k/C0087, TA = 25°C Input Differential Voltage (Note 8) VID − − VCC − − VCC V All Vin ≥ GND or V− Supply (if used) Output Sink Current ISink 6.0 16 − 6.0 16 − mA Vin ≥ 1.0 Vdc, Vin+ = 0 Vdc, VO ≤ 1.5 Vdc TA = 25°C Output Saturation Voltage VOL mV Vin ≥ 1.0 Vdc, Vin+ = 0, ISink ≤ 4.0 mA, TA = 25°C − 150 400 − − 400 Tlow ≤ TA ≤ Thigh − − 700 − 200 700 Output Leakage Current IOL nA Vin− = 0 V, Vin+ ≥ 1.0 Vdc, VO = 5.0 Vdc, TA = 25°C − 0.1 − − 0.1 − Vin− = 0 V, Vin+ ≥ 1.0 Vdc, VO = 30 Vdc, Tlow ≤ TA ≤ Thigh − − 1000 − − 1000 Supply Current ICC mA RL = ∞ Both Comparators, TA = 25°C − 0.4 1.0 − 0.4 1.0 RL = ∞ Both Comparators, VCC = 30 V − − 2.5 − − 2.5 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. LM293 Tlow = −25°C, Thigh = +85°C LM393, LM393E Tlow = 0°C, Thigh = +70°C LM2903, LM2903E Tlow = −40°C, Thigh = +105°C LM2903V & NCV2903 Tlow = −40°C, Thigh = +125°C NCV2903 is qualified for automotive use. 3. The maximum output current may be as high as 20 mA, independent of the magnitude of V CC, output short circuits to V CC can cause excessive heating and eventual destruction. 4. At output switch point, V O/C00931.4 Vdc, RS = 0 /C0087 with VCC from 5.0 Vdc to 30 Vdc, and over the full input common mode range (0 V to VCC = −1.5 V). 5. Due to the PNP transistor inputs, bias current will flow out of the inputs. This current is essentially constant, independent of the output state, therefore, no loading changes will exist on the input lines. 6. Input common mode of either input should not be permitted to go more than 0.3 V negative of ground or minus supply. The upper limit of common mode range is VCC −1.5 V. 7. Response time is specified with a 100 mV step and 5.0 mV of overdrive. With larger magnitudes of overdrive faster response ti mes are obtainable. 8. The comparator will exhibit proper output state if one of the inputs becomes greater than VCC, the other input must remain within the common mode range. The low input state must not be less than −0.3 V of ground or minus supply.

Figure 2. Input Bias Current versus Figure 3. Input Bias Current versus Figure 4. Output Saturation Voltage Figure 5. Output Saturation Voltage Figure 6. Power Supply Current versus Figure 7. Power Supply Current versus

25 TA = 0°C

LM393, LM393E, LM293, LM2903, LM2903E, LM2903V, NCV2903 www.onsemi.com MARKING DIAGRAMS x = 2 or 3 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week /C0071, G = Pb −Free Package PDIP−8 CASE 626 SOIC−8 CASE 751 *This marking diagram also applies to NCV2903DR2G Micro8 CASE 846A LMx93 ALYW /C0071 2903V ALYW /C0071 2903 ALYW /C0071 LM393NG AWL YYWW LM2903N AWL YYWWG x93 AYW /C0071 /C0071 (Note: Microdot may be in either location) 2903 AYW /C0071 /C0071 903V AYW /C0071 /C0071 393E ALYW /C0071 2903E ALYW /C0071

LM393, LM393E, LM293, LM2903, LM2903E, LM2903V, NCV2903 www.onsemi.com

ORDERING INFORMATION

Range Package Shipping† LM293DG −25°C to +85°C SOIC−8 (Pb−Free)

98 Units / Rail

LM293DR2G 2500 / Tape & Reel LM293DMR2G Micro8 (Pb−Free) 4000 / Tape and Reel LM393DG 0°C to +70°C SOIC−8 (Pb−Free) LM393DR2G 2500 / Tape & Reel LM393EDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel LM393NG PDIP−8 (Pb−Free) 50 Units / Rail LM393DMR2G Micro8 (Pb−Free) 4000 / Tape and Reel LM2903DG −40°C to +105°C SOIC−8 (Pb−Free) LM2903DR2G 2500 / Tape & Reel LM2903EDR2G SOIC−8 (Pb−Free) 2500 / Tape & Reel LM2903DMR2G Micro8 (Pb−Free) 4000 / Tape and Reel LM2903NG PDIP−8 (Pb−Free) 50 Units / Rail LM2903VDG −40°C to +125°C SOIC−8 (Pb−Free) LM2903VDR2G 2500 / Tape & Reel LM2903VNG PDIP−8 (Pb−Free) 50 Units / Rail NCV2903DR2G* SOIC−8 (Pb−Free) 2500 / Tape & Reel NCV2903DMR2G* Micro8 (Pb−Free) 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.

PDIP−8 CASE 626−05 ISSUE P DATE 22 APR 2015 SCALE 1:1 NOTE 8 D b L A eB XXXXXXXXX AWL YYWWG E GENERIC MARKING DIAGRAM* XXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb −Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ /C0071”, may or may not be present. A TOP VIEW C SEATING PLANE

0.010 CASIDE VIEW

A −−−− 0.210 A1 0.015 −−−− b 0.014 0.022 C 0.008 0.014 D 0.355 0.400 D1 0.005 −−−− e 0.100 BSC E 0.300 0.325 M −−−− 10 −−− 5.33 0.38 −−− 0.35 0.56 0.20 0.36 9.02 10.16 0.13 −−−

2.54 BSC

7.62 8.26 −−− 10 MIN MAX MILLIMETERS NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK- AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3. 4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH. 5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C. 6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED. 7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY . 8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS). E1 0.240 0.280 6.10 7.11 0.060 TYP 1.52 TYP M c B A2 0.115 0.195 2.92 4.95 L 0.115 0.150 2.92 3.81 H NOTE 5 e e/2 A2 NOTE 3 M B M NOTE 6 M STYLE 1: PIN 1. AC IN 2. DC + IN 3. DC − IN 4. AC IN 5. GROUND 6. OUTPUT 7. AUXILIARY 8. V CC MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98ASB42420BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1PDIP−8 © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

SOIC−8 NB CASE 751−07 ISSUE AK DATE 16 FEB 2011 SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) SCALE 1:1 STYLES ON PAGE 2 DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 XXXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package GENERIC MARKING DIAGRAM* XXXXX ALYWX IC Discrete XXXXXX AYWW /C0071 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* Discrete XXXXXX AYWW (Pb−Free) XXXXX ALYWX /C0071 IC (Pb−Free) XXXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week /C0071 = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98ASB42564BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2SOIC−8 NB © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

SOIC−8 NB CASE 751−07 ISSUE AK DATE 16 FEB 2011 STYLE 4: PIN 1. ANODE 2. ANODE 3. ANODE 4. ANODE 5. ANODE 6. ANODE 7. ANODE 8. COMMON CATHODE STYLE 1: PIN 1. EMITTER 2. COLLECTOR 3. COLLECTOR 4. EMITTER 5. EMITTER 6. BASE 7. BASE 8. EMITTER STYLE 2: PIN 1. COLLECTOR, DIE, #1 2. COLLECTOR, #1 3. COLLECTOR, #2 4. COLLECTOR, #2 5. BASE, #2 6. EMITTER, #2 7. BASE, #1 8. EMITTER, #1 STYLE 3: PIN 1. DRAIN, DIE #1 2. DRAIN, #1 3. DRAIN, #2 4. DRAIN, #2 5. GATE, #2 6. SOURCE, #2 7. GATE, #1 8. SOURCE, #1 STYLE 6: PIN 1. SOURCE 2. DRAIN 3. DRAIN 4. SOURCE 5. SOURCE 6. GATE 7. GATE 8. SOURCE STYLE 5: PIN 1. DRAIN 2. DRAIN 3. DRAIN 4. DRAIN 5. GATE 6. GATE 7. SOURCE 8. SOURCE STYLE 7: PIN 1. INPUT 2. EXTERNAL BYPASS 3. THIRD STAGE SOURCE 4. GROUND 5. DRAIN 6. GATE 3 7. SECOND STAGE Vd 8. FIRST STAGE Vd STYLE 8: PIN 1. COLLECTOR, DIE #1 2. BASE, #1 3. BASE, #2 4. COLLECTOR, #2 5. COLLECTOR, #2 6. EMITTER, #2 7. EMITTER, #1 8. COLLECTOR, #1 STYLE 9: PIN 1. EMITTER, COMMON 2. COLLECTOR, DIE #1 3. COLLECTOR, DIE #2 4. EMITTER, COMMON 5. EMITTER, COMMON 6. BASE, DIE #2 7. BASE, DIE #1 8. EMITTER, COMMON STYLE 10: PIN 1. GROUND 2. BIAS 1 3. OUTPUT 4. GROUND 5. GROUND 6. BIAS 2 7. INPUT 8. GROUND STYLE 11: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 12: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 14: PIN 1. N −SOURCE 2. N −GATE 3. P −SOURCE 4. P −GATE 5. P −DRAIN 6. P −DRAIN 7. N −DRAIN 8. N −DRAIN STYLE 13: PIN 1. N.C. 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 15: PIN 1. ANODE 1 2. ANODE 1 3. ANODE 1 4. ANODE 1 5. CATHODE, COMMON 6. CATHODE, COMMON 7. CATHODE, COMMON 8. CATHODE, COMMON STYLE 16: PIN 1. EMITTER, DIE #1 2. BASE, DIE #1 3. EMITTER, DIE #2 4. BASE, DIE #2 5. COLLECTOR, DIE #2 6. COLLECTOR, DIE #2 7. COLLECTOR, DIE #1 8. COLLECTOR, DIE #1 STYLE 17: PIN 1. VCC 2. V2OUT 3. V1OUT 4. TXE 5. RXE 6. VEE 7. GND 8. ACC STYLE 18: PIN 1. ANODE 2. ANODE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. CATHODE 8. CATHODE STYLE 19: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. MIRROR 2 7. DRAIN 1 8. MIRROR 1 STYLE 20: PIN 1. SOURCE (N) 2. GATE (N) 3. SOURCE (P) 4. GATE (P) 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 21: PIN 1. CATHODE 1 2. CATHODE 2 3. CATHODE 3 4. CATHODE 4 5. CATHODE 5 6. COMMON ANODE 7. COMMON ANODE 8. CATHODE 6 STYLE 22: PIN 1. I/O LINE 1 2. COMMON CATHODE/VCC 3. COMMON CATHODE/VCC 4. I/O LINE 3 5. COMMON ANODE/GND 6. I/O LINE 4 7. I/O LINE 5 8. COMMON ANODE/GND STYLE 23: PIN 1. LINE 1 IN 2. COMMON ANODE/GND 3. COMMON ANODE/GND 4. LINE 2 IN 5. LINE 2 OUT 6. COMMON ANODE/GND 7. COMMON ANODE/GND 8. LINE 1 OUT STYLE 24: PIN 1. BASE 2. EMITTER 3. COLLECTOR/ANODE 4. COLLECTOR/ANODE 5. CATHODE 6. CATHODE 7. COLLECTOR/ANODE 8. COLLECTOR/ANODE STYLE 25: PIN 1. VIN 2. N/C 3. REXT 4. GND 5. IOUT 6. IOUT 7. IOUT 8. IOUT STYLE 26: PIN 1. GND 2. dv/dt 3. ENABLE 4. ILIMIT 5. SOURCE 6. SOURCE 7. SOURCE 8. VCC STYLE 27: PIN 1. ILIMIT 2. OVLO 3. UVLO 4. INPUT+ 5. SOURCE 6. SOURCE 7. SOURCE 8. DRAIN STYLE 28: PIN 1. SW_TO_GND 2. DASIC_OFF 3. DASIC_SW_DET 4. GND 5. V_MON 6. VBULK 7. VBULK 8. VIN STYLE 29: PIN 1. BASE, DIE #1 2. EMITTER, #1 3. BASE, #2 4. EMITTER, #2 5. COLLECTOR, #2 6. COLLECTOR, #2 7. COLLECTOR, #1 8. COLLECTOR, #1 STYLE 30: PIN 1. DRAIN 1 2. DRAIN 1 3. GATE 2 4. SOURCE 2 5. SOURCE 1/DRAIN 2 6. SOURCE 1/DRAIN 2 7. SOURCE 1/DRAIN 2 8. GATE 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98ASB42564BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2SOIC−8 NB © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

CASE 846A−02 ISSUE K DATE 16 JUL 2020SCALE 2:1 STYLE 1: PIN 1. SOURCE 2. SOURCE 3. SOURCE 4. GATE 5. DRAIN 6. DRAIN 7. DRAIN 8. DRAIN STYLE 2: PIN 1. SOURCE 1 2. GATE 1 3. SOURCE 2 4. GATE 2 5. DRAIN 2 6. DRAIN 2 7. DRAIN 1 8. DRAIN 1 STYLE 3: PIN 1. N-SOURCE 2. N-GATE 3. P-SOURCE 4. P-GATE 5. P-DRAIN 6. P-DRAIN 7. N-DRAIN 8. N-DRAIN GENERIC MARKING DIAGRAM* XXXX = Specific Device Code A = Assembly Location Y = Year W = Work Week /C0071 = Pb−Free Package XXXX AYW/C0071 /C0071 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. (Note: Microdot may be in either location) MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98ASB14087CDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1MICRO8 © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

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