NTD5C668NL ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- Low RDS(on) to Minimize Conduction Losses
- Low QG and Capacitance to Minimize Driver Losses
- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage VDSS 60 V Gate−to−Source Voltage VGS /C003420 V Continuous Drain Cur- rent R/C0113JC (Notes 1 & 3) Steady State TC = 25°C ID 48 A TC = 100°C 34 Power Dissipation R/C0113JC (Note 1) TC = 25°C PD 42 W TC = 100°C 21 Continuous Drain Cur- rent R/C0113JA (Notes 1, 2 & 3) Steady State TA = 25°C ID 15 A TA = 100°C 10 Power Dissipation R/C0113JA (Notes 1 & 2) TA = 25°C PD 4.0 W TA = 100°C 2.0 Pulsed Drain Current TA = 25°C, tp = 10 /C0109s IDM 250 A Operating Junction and Storage Temperature TJ, Tstg −55 to 175 Source Current (Body Diode) IS 25 A Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 3 A) EAS 104 mJ Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit Junction−to−Case (Drain) (Note 1) R/C0113JC 3.6 °C/W Junction−to−Ambient − Steady State (Note 2) R/C0113JA 37 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. DPAK CASE 369C STYLE 2 MARKING DIAGRAM & PIN ASSIGNMENT 60 V 8.9 m/C0087 @ 10 V RDS(on) 49 A IDV(BR)DSS 12.8 m/C0087 @ 4.5 V www.onsemi.com 1 2 See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
A = Assembly Location Y = Year WW = Work Week 5C668L = Device Code G = Pb−Free Package G S N−CHANNEL MOSFET D
www.onsemi.com ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 /C0109A 60 V Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/TJ 27 mV/°C Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 60 V TJ = 25°C 10 /C0109A TJ = 125°C 250 Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = 20 V 100 nA ON CHARACTERISTICS (Note 4) Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 50 /C0109A 1.2 2.1 V Negative Threshold Temperature Coefficient VGS(TH)/TJ 4.8 mV/°C Drain−to−Source On Resistance RDS(on) VGS = 10 V, ID = 25 A 7.4 8.9 m/C0087 VGS = 4.5 V, ID = 25 A 10.2 12.8 Forward Transconductance gFS VDS = 15 V, ID = 25 A 60 S CHARGES, CAPACITANCES AND GATE RESISTANCES Input Capacitance Ciss VGS = 0 V, f = 1.0 MHz, VDS = 25 V 1300 pF Output Capacitance Coss 580 Reverse Transfer Capacitance Crss 18 Total Gate Charge QG(TOT) VDS = 30 V, ID = 25 A VGS = 4.5 V 8.7 nC VGS = 10 V 18.7 Threshold Gate Charge QG(TH) VGS = 4.5 V, VDS = 30 V, ID = 25 A 2.4 nC Gate−to−Source Charge QGS 4.1 Gate−to−Drain Charge QGD 2.0 Plateau Voltage VGP 3.1 V SWITCHING CHARACTERISTICS (Note 5) Turn−On Delay Time td(on) VGS = 4.5 V, VDS = 30 V, ID = 25 A, RG = 2.5 /C0087 12 ns Rise Time tr 74 Turn−Off Delay Time td(off) 26 Fall Time tf 62 DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage VSD VGS = 0 V, IS = 20 A TJ = 25°C 0.87 1.2 V TJ = 125°C 0.76 Reverse Recovery Time tRR VGS = 0 V, dIS/dt = 100 A//C0109s, IS = 25 A 32 ns Charge Time ta 15 Discharge Time tb 16 Reverse Recovery Charge QRR 20 nC 4. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle ≤ 2%. 5. Switching characteristics are independent of operating junction temperatures.
www.onsemi.com TYPICAL CHARACTERISTICS Figure 13. Thermal Response Order Number Package Shipping† NTD5C668NLT4G DPAK (Pb−Free) 2500 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DPAK (SINGLE GAUGE) CASE 369C ISSUE F DATE 21 JUL 2015 SCALE 1:1 STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE STYLE 5: PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE STYLE 6: PIN 1. MT1 2. MT2 3. GATE 4. MT2 STYLE 7: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 1 2 STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE STYLE 9: PIN 1. ANODE 2. CATHODE 3. RESISTOR ADJUST 4. CATHODE STYLE 10: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE b D E M0.005 (0.13) C A c C Z DIM MIN MAX MIN MAX MILLIMETERSINCHES D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46 L 0.055 0.070 1.40 1.78 L3 0.035 0.050 0.89 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY . 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. 12 3 XXXXXX = Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb −Free Package AYWW XXX XXXXXG XXXXXXG ALYWW DiscreteIC 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 /C0466mm inches/C0467SCALE 3:1 GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13 L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC HDETAIL A SEATING PLANE A B C L H L2 GAUGE PLANE DETAIL A ROTATED 90 CW/C0053 e BOTTOM VIEW Z BOTTOM VIEW SIDE VIEW TOP VIEW ALTERNATE CONSTRUCTIONS NOTE 7 Z MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98AON10527DDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1DPAK (SINGLE GAUGE) © Semiconductor Components Industries, LLC, 2018 www.onsemi.com
onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative