NV24C32LV ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Automotive AEC−Q100 Grade 1 (−40°C to +125°C) Qualified
  • Supports Standard, Fast and Fast−Plus I2C Protocol
  • 1.7 V to 5.5 V Supply V oltage Range
  • 32−Byte Page Write Buffer
  • Fast Write Time (4 ms max)
  • Hardware Write Protection for Entire Memory
  • Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs (SCL and SDA)
  • Low Power CMOS Technology
  • 1,000,000 Program/Erase Cycles
  • 100 Year Data Retention
  • Automotive Grade 1 Temperature Range
  • US−8, UDFN−8, SOIC−8 and TSSOP−8 Packages
  • These Devices are Pb−Free, Halogen Free/BFR Free, and RoHS Compliant www.onsemi.com See detailed ordering, marking and shipping information in the package dimensions section on page 13 of this data sheet.

ORDERING INFORMATION

(Top View) SOIC−8 DW SUFFIX CASE 751BD UDFN−8 MUW3 SUFFIX CASE 517DH TSSOP−8 DT SUFFIX CASE 948AL

Figure 1. Functional Symbols Table 1. ABSOLUTE MAXIMUM RATINGS should not be assumed, damage may occur and reliability may be affected.

  1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. During transitions, the voltage on any pin may

undershoot to no less than −1.5 V or overshoot to no more than VCC + 1.5 V, for periods of less than 20 ns. Table 2. RELIABILITY CHARACTERISTICS

  1. A Write Cycle refers to writing a Byte or a Page.

performance may not be indicated by the Electrical Characteristics if operated under different conditions. Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 1.7 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)

  1. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
  2. For improved noise immunity (and to allow for floating input pins), the WP, A0, A1 & A2 inputs are pulled−down to GND by relatively strong
  1. Test conditions according to “A.C. Test Conditions” table.
  2. Tested initially and after a design or process change that affects this parameter.

PU is the delay between the time VCC is stable and the device is ready to accept commands. Table 6. A.C. TEST CONDITIONS

DATE 01 SEP 2021SCALE 4 :1 XX = Specific Device Code M = Date Code /C0071 = Pb−Free Package XX M/C0071 /C0071 GENERIC MARKING DIAGRAM* (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98AON04475DDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1US8 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2021 www.onsemi.com

UDFN8 2x3, 0.5P CASE 517DH ISSUE A DATE 10 DEC 2020SCALE 2:1 GENERIC MARKING DIAGRAM* XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package XXXXX AWLYW/C0071 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98AON06579GDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1UDFN8 2X3, 0.5P © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

SOIC 8, 150 mils CASE 751BD−01 ISSUE O DATE 19 DEC 2008 E1 E A h θ L c e b D PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW END VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. SYMBOL MIN NOM MAX θ A b c D E e h 0º 8º 0.10 0.33 0.19 0.25 4.80 5.80 3.80

1.27 BSC

1.75 0.25 0.51 0.25 0.50 5.00 6.20 4.00 L 0.40 1.27 1.35 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98AON34272EDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1SOIC 8, 150 MILS © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O DATE 19 DEC 2008 E1 E e b D cA TOP VIEW SIDE VIEW END VIEW /C01131 L Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. SYMBOL θ MIN NOM MAX A b c D E e 0º 8º L 0.05 0.80 0.19 0.09 0.50 2.90 6.30 4.30

0.65 BSC

1.00 REF

1.20 0.15 1.05 0.30 0.20 0.75 3.10 6.50 4.50 0.90 0.60 3.00 6.40 4.40 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 98AON34428EDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1TSSOP8, 4.4X3 © Semiconductor Components Industries, LLC, 2019 www.onsemi.com

onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative