9800201KEC

6N140A_V01 BOARDCOM | Alldatasheet

Document overview

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Technical content

Features

 Dual marked with device part number and DLA Standard Microcircuit Drawing (SMD)  Manufactured and tested on a MIL-PRF-38534 Certified Line  QML-38534, Class H and K  Five hermetically sealed package configurations  Performance guaranteed over full military temperature range: –55°C to +125°C  Low input current requirement: 0.5 mA  High current transfer ratio: 1500% typical at IF = 0.5 mA  Low output saturation voltage: 0.11V typical  1500 Vdc withstand test voltage  High radiation immunity  6N138/9, HCPL-2730/31 function compatibility  Reliability data

Applications

 Military and aerospace  High reliability systems  Microprocessor system interface  Transportation, medical, and life critical systems  Isolated input line receiver  EIA RS-232-C line receiver  Voltage level shifting  Isolated input line receiver  Isolated output line driver  Logic ground isolation  Harsh industrial environments  Current loop receiver  System test equipment isolation  Process control input/output isolation 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 1 Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers Data Sheet

• 2 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Functional DiagramFunctional Diagram Multiple channel devices available. Truth Table (Positive Logic) NOTE The connection of a 0.1-μF bypass capacitor between VCC and GND is recommended. Package styles for these parts are 8-pin and 16-pin DIP through hole (case outlines P and E respectively), 16-pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide–Package Styles and Lead Configuration Options for details. Standard Military Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts except as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities justify the use of a common data base for die related reliability and certain limited radiation test results. Input Output On (H) L Off (L) H Selection Guide–Package Styles and Lead Configuration Options Package 16-pin DIP 8-pin DIP 8-pin DIP 16-pin Flat Pack 20-Pad LCCC Lead Style Through Hole Through Hole Through Hole Unformed Leads Surface Mount Channels 4 1 2 4 2 Common Channel Wiring V CC, GND None V CC, GND V CC, GND None Part Number and Options Commercial 6N140A HCPL-5700 HCPL-5730 HCPL-6750 HCPL-6730 MIL-PRF-38534 Class H 6N140A/883B HCPL-5701 HCPL-5731 HCPL-6751 HCPL-6731 MIL-PRF-38534 Class K HCPL-177K HCPL-570K HCPL-573K HCPL-675K HCPL-673K Standard Lead Finish Gold Plate a Gold Platea Gold Platea Gold Platea Solder Padsb Solder Dippedb Option #200 Option #200 Option #200 Butt Cut/Gold Platea Option #100 Option #100 Option #100 Gull Wing/Solderedb Option #300 Option #300 Option #300 Crew Cut/Gold Platea Option #600 Option #600 Option #600 Class H SMD Part Number Prescript for all below None 5962- 5962- None 5962- Gold Platea 8302401EC 8981001PC 8978501PC 8302401FC Solder Dippedb 8302401EA 8981001PA 8978501PA 89785022A

• 3 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Functional Diagrams Functional Diagrams NOTE All DIP and flat pack devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections. All diagrams are top view. Butt Cut/Gold Platea 8302401YC 8981001YC 8978501YC Butt Cut/Solderedb 8302401YA 8981001YA 8978501YA Gull Wing/Solderedb 8302401XA 8981001XA 8978501ZA Crew Cut/Gold Platea 8302401ZC Crew Cut/Solderedb 8302401ZA Class K SMD Part Number Prescript for all below 5962- 5962- 5962- 5962- 5962- Gold Platea 9800201KEC 8981002KPC 8978503KPC 9800201KFC Solder Dippedb 9800201KEA 8981002KPA 8978503KPA 8978504K2A Butt Cut/Gold Platea 9800201KYC 8981002KYC 8978503KYC Butt Cut/Solderedb 9800201KYA 8981002KYA 8978503KYA Gull Wing/Solderedb 9800201KXA 8981002KXA 8978503KZA Crew Cut/Gold Platea 9800201KZC Crew Cut/Solderedb 9800201KZA a. Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches. b. Solder lead finish: Sn63/Pb37. 16-pin DIP 8-pin DIP 8-pin DIP 16-pin Flat Pack 20-Pad LCCC Through Hole Through Hole Through Hole Unformed Leads Surface Mount

4 Channels 1 Channel 2 Channels 4 Channels 2 Channels

Package 16-pin DIP 8-pin DIP 8-pin DIP 16-pin Flat Pack 20-Pad LCCC 1 16 7 8 GND1 VO1 VCC1 GND2 VO2 VCC2

• 4 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Leaded Device MarkingLeaded Device Marking Leadless Device Marking A QYYWWZ XXXXXX XXXXXXX XXX XXX X 50434 Avago LOGO Avago P/N DLA SMD[1] DLA SMD[1] PIN ONE/ ESD IDENT COMPLIANCE INDICATOR,[1] DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Avago CAGE CODE[1] [1] QML PARTS ONLY A QYYWWZ XXXXXX X XXXX XXXXXX XXX 50434 Avago LOGO Avago P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. COMPLIANCE INDICATOR,[1] DATE CODE, SUFFIX (IF NEEDED) DLA SMD[1] DLA SMD[1] Avago CAGE CODE[1] [1] QML PARTS ONLY Outline Drawings 16-Pin DIP Through Hole, 4 Channels Note: Dimensions in millimeters (inches). 16-Pin Flat Pack, 4 Channels Note: Dimensions in millimeters (inches). 4.45 (0.175) MAX. 20.06 (0.790) 20.83 (0.820) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 0.89 (0.035) 1.65 (0.065) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 3.81 (0.150) MIN. 8.13 (0.320) MAX. 5.23 (0.206) MAX. 2.29 (0.090) MAX. 7.24 (0.285) REF. 0.46 (0.018) 0.36 (0.014) 11.13 (0.438) 10.72 (0.422) 2.84 (0.112) MAX. 0.89 (0.035) 0.69 (0.027) 0.30 (0.012) 0.23 (0.009) 0.88 (0.0345) MIN. 9.14 (0.360) 8.64 (0.340)

• 5 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Outline Drawings20-Terminal LCCC Surface Mount, 2 Channels Note: Dimensions in millimeters (inches). Solder Thickness 0.127 (0.005) Max. 8-Pin DIP Through Hole, 1 and 2 Channel Note: Dimensions in millimeters (inches). 8.69 (0.342) 9.09 (0.358) 4.95 (0.195) 5.21 (0.205) 1.78 (0.070) 2.03 (0.080) 4.95 (0.195) 5.21 (0.205) 8.69 (0.342) 2.03 (0.080) 0.51 (0.020) 0.64 (0.025) (20 PLCS) 1.52 (0.060) 2.03 (0.080) METALIZED CASTILLATIONS (20 PLCS) 2.16 (0.085) TERMINAL 1 IDENTIFIER 1.14 (0.045) 1.40 (0.055) 3.81 (0.150) MIN. 4.32 (0.170) MAX. 10.03 (0.395) 10.29 (0.405) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 1.02 (0.040) 1.52 (0.060) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 7.16 (0.282) 7.57 (0.298)

• 6 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Hermetic Optocoupler OptionsHermetic Optocoupler Options Option Description 100 Surface-mountable hermetic optocoupler with leads trimmed for bu tt joint assembly. This option is available on Commercial, Class H, and Class K product in 8-pin and 16-pin DIP . Note: Dimensions in millimeters (inches). 200 Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H, and Class K product in 8-pin and 16-pin DIP . DLA Drawing (SMD) part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder-dipped terminals as a standard feature. 300 Surface-mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on Commercia l, Class H, and Class K product in 8-pin and 16-pin DIP . This option has solder-dipped leads. Note: Dimensions in millimeters (inches). 600 Surface-mountable hermetic optocoupler with leads trimmed for bu tt joint assembly. This option is available on Commercial, Class H, and Class K product in 8-pin and 16-pin DIP . Contact factory for the availability of this option on DLA part types. Note: Dimensions in millimeters (inches). 1.14 (0.045) 1.40 (0.055) 4.32 (0.170) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 1.14 (0.045) 1.40 (0.055) 4.32 (0.170) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 1.40 (0.055) 1.65 (0.065) 4.57 (0.180) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 0.51 (0.020) MIN. 4.57 (0.180) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 9.65 (0.380) 9.91 (0.390) 5° MAX. 4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 1.07 (0.042) 1.32 (0.052) 3.81 (0.150) MAX. 1.02 (0.040) TYP. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 3.81 (0.150) MIN. 1.14 (0.045) 1.25 (0.049) 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) MAX.

• 7 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Absolute Maximum RatingsAbsolute Maximum Ratings 8-Pin Ceramic DIP Single Channel Schematic ESD Classification Recommended Operating Conditions Parameter Symbol Min Max Unit Notes Storage Temperature T S –65 +150 °C Operating Temperature T A –55 +125 °C Case Temperature T C — +170 °C Junction Temperature T J — +175 °C Lead Solder Temperature — 260 for 10 sec °C Output Current (each channel) I O — 40 mA Output Voltage (each channel) V O –0.5 20 V a a. GND pin should be the most negative voltage at the detector side. Keeping VCC as low as possible, but greater than 2.0V, provides the lowest total IOH over temperature. Supply Voltage V CC –0.5 20 V a Output Power Dissipation (each channel) — 50 mW b b. Output power is collector output power plus total supply po wer for the single-channel device. For the dual-channel device, output power is collector output power plus one half the total supply power. For the quad-channel device, output power is collector output power plus one fourth of total supply power. Derate at 1.66 mW/°C above 110°C. Peak Input Current (each channel, <1 ms duration) — 20 mA Average Input Current (each channel) I F — 10 mA c c. Derate I F at 0.33 mA/°C above 110°C. Reverse Input Voltage (each channel) V R —5 V Package Power Dissipation (each channel) P D — 200 mW (MIL-STD-883, Method 3015) HCPL-5700/01/0K and 6730/31/3K , Class 2 6N140A, 6N140A/883B, HCPL-177K, HCPL-6750/51/5K and HCPL-5730/31/3K , Class 3 Parameter Symbol Min Max Unit Input Voltage, Low Level (Each Channel) V F(OFF) —0 . 8 V Input Current, High Level (Each Channel) I F(ON) 0.5 5 mA Supply Voltage V CC 2.0 18 V Output Voltage V O 2.0 18 V ANODE CATHODE 6 VCC VO ICC GND IO IF2 VF

• 8 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Electrical CharacteristicsElectrical Characteristics TA= –55°C to +125°C, unless otherwise specified. Parameter Symbol Test Conditions Group Aa Subgroup Limits Unit Fig Notes Min Typb Max Current Transfer Ratio CTR I F = 0.5 mA, VO = 0.4V, VCC = 4.5V 1, 2, 3 300 1500 — % 3 c, d IF = 1.6 mA, VO = 0.4V, VCC = 4.5 V 300 1000 — IF =5 mA, VO = 0.4V, VCC = 4.5V 200 500 — Logic Low Output Voltage VOL I F = 0.5 mA, IOL = 1.5 mA, VCC = 4.5V 1, 2, 3 — 0.11 0.4 V 2 c IF = 1.6 mA, IOL = 4.8 mA, VCC = 4.5V — 0.13 0.4 c, e IF =5 mA, IOL = 10 mA, VCC = 4.5V — 0.16 0.4 c Logic High Output Current IOH I F =2 μA, VO = 18V, VCC = 18V 1, 2, 3 — 0.001 250 μA c IOHX 250 μA c, f Logic Low Supply Current Single Channel and LCCC ICCL IF = 1.6 mA, VCC = 18V 1, 2, 3 — 1.0 2 mA g Dual Channel IF1 = IF2 = 1.6 mA, VCC = 18V —1 . 0 4 4 Quad Channel IF1 = IF2 = IF3 = IF4 = 1.6 mA, VCC = 18V —1 . 7 4 Logic High Supply Current Single Channel and LCCC ICCH IF = 0 mA, VCC = 18V 1, 2, 3 — 0.001 20 μA g Dual Channel IF1 = IF2 = 0 mA, VCC = 18V —4 0 Quad Channel IF1 = IF2 = IF3 = IF4 = 0 mA, VCC = 18V —4 0 Input Forward Voltage Single and Dual Channel VF IF = 1.6 mA 1 1.0 1.4 1.7 V 1 c 2— — 1 . 7 3— — 1 . 8 LCCC 1, 2, 3 1.0 1.4 1.8 Quad Channel 1, 2 — 1.4 1.7 3— — 1 . 8 Input Reverse Breakdown Voltage BVR IR = 10 μA 1, 2, 3 5 — — V c Input-Output Insulation Leakage Current II-O ≤65% Relative Humidity TA = 25°C, t = 5s, VI-O = 1500 VDC 1 — — 1.0 μA h, i

• 9 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet

Electrical Characteristics

Capacitance Between Input-Output CI-O f = 1 MHz, T A = 25°C 4 — — 4 pF c, j k, l Propagation Delay Time to Logic Low at Output tPHL IF = 0.5 mA, RL = 4.7 kΩ, VCC = 5V 9, 10, 11 — 30 100 μs 5, 6, 7, 8 c IF = 1.6 mA, RL = 1.5 kΩ, VCC = 5V 9, 10, 11 — 5 30 c, e IF =5 mA, RL = 680Ω, VCC = 5V 9 — 2 5 c, l 10, 11 10 9, 10, 11 10 c, e Propagation Delay Time to Logic High at Output tPLH IF = 0.5 mA, RL = 4.7 kΩ, VCC = 5V 9, 10, 11 — 17 60 μs 5, 6, 7, 8 c IF = 1.6 mA, RL = 1.5 kΩ, VCC = 5 V 9, 10, 11 — 14 50 c, e IF = 5 mA, RL = 680 Ω, VCC = 5V 9 — 8 20 c, l 10, 11 30 9, 10, 11 30 c, e Common Mode Transient Immunity at Low Output Level |CML|V CC = 5V, IF = 1.6 mA RL =1.5 kΩ, |VCM| = 25 VP-P l |VCM| = 50 VP-P e 9, 10, 11 500 1000 V/μs 9 c, m, n, o Common Mode Transient Immunity at High Output Level |CMH|V CC = 5V, IF =0 mA RL =1.5 kΩ, |VCM| = 25 VP-P l |VCM| = 50 VP-P e 9, 10, 11 500 1000 V/μs 9 c, m, n, o a. Commercial parts receive 100% testing at 25°C (Subgroups 1 an d 9). SMD, Class H and Class K parts receive 100% testing at 25, 125, and –55°C (Subgroups 1 and 9, 2 and 10, 3 and 11, respectively). b. All typical values are at V CC = 5V, TA = 25°C. c. Each channel. d. Current Transfer Ratio is defined as the ratio of output collector current, I O, to the forward LED input current, IF, times 100%. e. Not required for 6N140A, 6N140A/883B, HCPL-177K, HCPL-6750/51/5K, 8302401, and 5962-9800201 types. f. I OHX is the leakage current resulting from channel-to-channel optical crosstalk. IF = 2 μA for channel under test. For all other channels, IF = 10 mA. g. The HCPL-6730, HCPL-6731, and HCPL-673K du al-channel parts function as two independent single channel units. Use the single channel parameter limits. h. All devices are considered two-terminal devices; measured betw een all input leads or terminals shorted together and all output leads or terminals shorted together. i. This is a momentary withstand test, not an operating condition. j. Measured between each input pair shorted together and all output connections for that channel shorted together. k. Parameters tested as part of device init ial characterization and after design and process changes. Parameters guaranteed to limits specified for all lots not specifically tested. l. Required for 6N140A, 6N140A/883B, HCPL-177K, HCPL-6750/51/5K, 8302401, and 5962-9800201 types. m. CM L is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state (VO < 0.8 V). CMH is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic high state (VO > 2.0 V). Parameter Symbol Test Conditions Group Aa Subgroup Limits Unit Fig Notes Min Typb Max

• 10 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Typical Characteristics Typical Characteristics TA = 25°C, VCC = 5V. n. In applications where dV/dt may exceed 50,000 V/μs (such as a static discharge), a series resistor, RCC, should be included to protect the detector ICs from destructively high surge currents. The recommended value is: For single channel: For dual channel: For quad channel: o. Parameters tested as part of device init ial characterization and after design and process changes. Parameters guaranteed to limits specified for all lots not specifically tested. Parameter Symbol Typ Unit Test Conditions Note Input Capacitance C IN 60 pF V F = 0V, f = 1 MHz a a. Each channel. Input Diode Temperature Coefficient ΔV F/ΔTA –1.8 mV/°C I F = 1.6 mA a Resistance (Input-Output) R I-O 1012 Ω V I-O = 500V a, b b. Measured between each input pair shorted together and all output connections for that channel shorted together. Capacitance (Input-Output) C I-O 2.0 pF f = 1 MHz a, b Dual and Quad Channel Product Only Input-Input Leakage Current I I-I 0.5 nA Relative Humidity = ≤65%, VI-I = 500V, t = 5s c c. Measured between adjacent input pairs shor ted together for each multichannel device. Resistance (Input-Input) R I-I 1012 Ω V I-I = 500V c Capacitance (Input-Input) C I-I 1.0 pF f = 1 MHz c RCC 1 (V) RCC 1 (V) RCC 1 (V)

• 13 - 6N140A, HCPL-675x, 83024, HCPL-570x, HCPL-177K, 5962-89810, HCPL-573x, HCPL-673x, 5962-89785, 5962-98002 Data Sheet Typical CharacteristicsFigure 11 Operating Circuit for Burn-In and Steady State Life Tests * ALL CHANNELS TESTED SIMULTANEOUSLY. VOC CONDITIONS: I F = 10 mA I O = 40 mA T A = +125°C VCC + 18 V VIN + – (EACH OUTPUT) (EACH INPUT) 0.01 PF2

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