9474

9474 STMICROELECTRONICS | Alldatasheet

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April 2003 - Ed: 1A POWER SCHOTTKY RECTIFIER 150V Power Schottky rectifier are suited for switch Mode Power Supplies on up to 24V rails and high frequency converters. Packaged in SMB and Axial, this device is intended for use in consumer & computer applications like TV, STB, PC and DVD where low drop forward voltage in required to reduce power dissipation.

DESCRIPTION

n NEGLIGIBLE SWITCHING LOSSES n LOW FORWARD VOLTAGE DROP FOR HIGHER EFFICIENCY AND EXTENDED BATTERY LIFE n LOW THERMAL RESISTANCE FEATURES AND BENEFITS Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) RMS forward current 15 A IF(AV) Average forward current T L = 130°C δ = 0.5 SMB 3A TL = 140°C δ = 0.5 DO-201AD IFSM Surge non repetitive forward current Half wave, single phase, 50Hz SMB 100 A DO-201AD 150 Tstg Storage temperature range - 65 to + 150 °C Tj Maximum junction temperature * 175 °C dV/dt Critical rate of rise of reverse voltage (rated VR ,Tj= 25°C) 10000 V/ µs ABSOLUTE RATINGS (limiting values) IF(AV) 3A VRRM 150 V Tj (max) 175°C VF (max) 0.66 V MAIN PRODUCT CHARACTERISTICS DO-201AD STPS3150 *: dPtot dTj Rth j a thermal runaway condition for a diode on its own heatsink SMB STPS3150U

Symbol Parameter Value Unit R th(j-l) Junction to leads Lead length = 10 mm DO-1201AD 20 °C/W SMB 15 THERMAL RESISTANCES Symbol Parameter Tests conditions Min. Typ. Max. Unit IR * Reverse leakage current Tj= 25°C V R = 150V 0.4 2.0 µA Tj= 125°C 0.6 2.0 mA VF * Forward voltage drop T j= 25°C I F =3 A 0.78 0.82 V Tj= 125°C 0.63 0.67 Tj= 25°C I F =6 A 0.85 0.89 Tj= 125°C 0.70 0.75 Pulse test : * tp = 380µs,δ <2 % To evaluate the maximum conduction losses use the following equation: P=0 . 5 9xI F(AV) + 0.023 x IF2(RMS) STATIC ELECTRICAL CHARACTERISTICS P (W)F(AV) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 I (A)F(AV) T δ=tp/T tp δ = 1 δ = 0.5 δ = 0.05 δ = 0.1 δ = 0.2 Fig. 1:Conduction losses versus average current. I (A)F(AV) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 175 T δ=tp/T tp T (°C)amb R =75°C/Wth(j-a) R= Rth(j-a) th(j-I) DO-201AD SMB Fig. 2:Average forward current versus ambient temperature (δ = 0.5). I (A)M IM t δ=0.5 t(s) T =25°Ca T =75°Ca T =125°Ca SMB Fig. 3-1:Non repetitive surge peak forward current versus overload duration (maximum values) (SMB). I (A)M IM t δ=0.5 t(s) T =25°Ca T =75°Ca T =125°Ca DO-201AD Fig. 3-2:Non repetitive surge peak forward current versus overload duration (maximum values) (DO-201AD).

Z/ Rth(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 T δ=tp/T tpt (s)p SMB δ = 0.5 δ = 0.2 δ = 0.1 Single pulse Fig. 4-1:Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Z/ Rth(j-c) th(j-c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 T δ=tp/T tpt (s)p δ = 0.5 δ = 0.2 δ = 0.1 Single pulse DO-201AD Fig. 4-2:Relative variation of thermal impedance junction to ambient versus pulse duration (DO-201AD). I (µA)R 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 0 25 50 75 100 125 150 V (V)R T =125°Cj T =150°Cj T =100°Cj T =50°Cj T =25°Cj T =75°Cj Fig. 5:Reverse leakage current versus reverse voltage applied (typical values). C(nF) 100 1000 1 10 100 1000 F=1MHz V =30mV T =25°C OSC RMS j V (V)R Fig. 6: Junction capacitance versus reverse voltage applied (typical values). I (A)FM 100 V (V)FM T =25°C (maximum values) j T =125°C (typical values) j T =125°C (maximum values) j Fig. 7: Forward voltage drop versus forward current. R (°C/W)th(j-a) 100 110 S(cm²) SMB Fig. 8:Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, Cu: 35µm) (SMB).

E C L D b 1.52 2.75 2.3 1.52 FOOT PRINT DIMENSIONS (in millimeters) REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 R (°C/W)th 5 1 01 52 02 5 R th(j-I) R th(j-a) L (mm)leads DO-201AD Fig. 9:Thermal resistance versus lead length (DO-201AD).

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com Ordering type Marking Package Weight Base qty Delivery mode STPS3150 STPS3150 DO-201AD 1.12 g 600 Ammopack STPS3150RL STPS3150 DO-201AD 1.12 g 1900 Tape & Reel STPS3150U G315 SMB 0.107 g 2500 Tape & Reel n Epoxy meets UL94,V0 PACKAGE MECHANICAL DATA DO-201AD plastic BA E E ØD ØD ØCB note 2 note 1note 1 REF. DIMENSIONS NOTESMillimeters Inches Min. Max. Min. Max. A 9.50 0.374 1 - The lead diameter∅ D is not controlled over zone E 2 - The minimum length which must stay straight between the right angles after bending is 0.59"(15 mm) B 25.40 1.000 C 5.30 0.209 D 1.30 0.051 E 1.25 0.049