NDS9410A FAIRCHILD | Alldatasheet

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Technical content

Features

  • 7.3 A, 30 V. RDS(ON) = 28 mΩ @ VGS = 10 V R DS(ON) = 42 mΩ @ VGS = 4.5 V
  • High performance trench technology for extremely low RDS(ON)
  • High power and current handling capability in a widely used surface mount package. S D SSSO-8 DD D G Absolute Maximum Ratings TA=25oC unless otherwise noted Symbol Parameter Ratings Units VDSS Drain-Source Voltage 30 V VGSS Gate-Source Voltage ±20 V ID Drain Current – Continuous (Note 1a) 7.3 A – Pulsed 20 Power Dissipation for Single Operation(Note 1a) 2.5 (Note 1b) 1.2 PD (Note 1c) 1.0 W TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C Thermal Characteristics R θJA Thermal Resistance, Junction-to-Ambient (Note 1a) 50 °C/W R θJC Thermal Resistance, Junction-to-Case (Note 1) 25 °C/W Package Marking and Ordering Information Device Marking Device Reel Size Tape width Quantity NDS9410A NDS9410A 13’’ 12mm 2500 units NDS9410A

NDS9410A Rev B(W) Electrical Characteristics TA = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV DSS Drain–Source Breakdown VoltageVGS = 0 V, ID = 250 µA 30 V ∆BV DSS ∆TJ Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 28 mV/°C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 2 µA IGSSF Gate–Body Leakage, Forward V GS = 20 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse V GS = –20 V VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS , ID = 250 µA 11 . 63 V ∆VGS(th) ∆TJ Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C -4.3 mV/°C R DS(on) Static Drain–Source On–Resistance VGS = 10 V, ID = 7.3 A VGS = 10 V, ID = 7.3 A, TJ=125°C VGS = 4.5 V, ID = 6.3 A VGS = 4.5 V, ID = 6.3 A, TJ=125°C m Ω ID(on) On–State Drain Current V GS = 10 V, VDS = 5 V 20 A gFS Forward Transconductance V DS = 15 V, ID = 7.3 A 22 S Dynamic Characteristics C iss Input Capacitance 830 pF C oss Output Capacitance 185 pF C rss Reverse Transfer Capacitance VDS = 15 V, V GS = 0 V, f = 1.0 MHz 80 pF Switching Characteristics(Note 2) td(on) Turn–On Delay Time 6 12 ns tr Turn–On Rise Time 10 20 ns td(off) Turn–Off Delay Time 18 32 ns tf Turn–Off Fall Time VDD = 25 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω 51 0n s Q g Total Gate Charge 14 22 nC Q gs Gate–Source Charge 2.7 nC Q gd Gate–Drain Charge VDS = 15 V, ID = 2 A, VGS = 10 V 3.0 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 2.2 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 2.2 A (Note 2) 0.78 1.1 V Notes: 1.R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 50°/W when mounted on a 1in2 pad of 2 oz copper b) 105°/W when mounted on a .04 in2 pad of 2 oz copper c) 125°/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2.Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0% NDS9410A

SOIC(8lds) Packaging Configuration: Figure 1.0 Components Leader Tape 1680mm minimum or 210 empty pockets Trailer Tape 640mm minimum or 80 empty pockets SOIC(8lds) Tape Leader and Trailer Configuration: Figure 2.0 Cover Tape Carrier Tape Note/Comments Packaging Option SOIC (8lds) Packaging Information Standard (no flow code) L86Z F011 Packaging type Reel Size TNR 13" Dia Rail/Tube TNR 13" Dia Qty per Reel/Tube/Bag 2,500 95 4,000 Box Dimension (mm) 343x64x343 530x130x83 343x64x343 Max qty per Box 5,000 30,000 8,000 D84Z TNR 7" Dia 500 184x187x47 1,000 Weight per unit (gm) 0.0774 0.0774 0.0774 0.0774 Weight per Reel (kg) 0.6060 - 0.9696 0.1182 F63TN Label ESD Label 343mm x 342mm x 64mm Standard Intermediate box ESD Label F63TNR Label sample F63TNLabel LOT: CBVK741B019 FSID: FDS9953A D/C1: D9842 QTY1: SPEC REV: SPEC: QTY: 2500 D/C2: QTY2: CPN: N/F: F (F63TNR)3 F852 NDS 9959 SOIC-8 Unit Orientation F852 NDS 9959 Pin 1 Static Dissipative Embossed Carrier Tape F63TNR Label Antistatic Cover Tape ESD Label ELECTROSTATI C SENSITIVE DEVICES DO NO T SHI P OR ST O RE N EAR STRO NG ELECTROSTATIC ELECTRO MAGN ET I C, MAG NETIC O R R ADIO ACTIVE F I EL D S TN R DA TE PT NUMB ER Customized Label Packaging Description: SOIC-8 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (anti- static coated). Other option comes in 500 units per 7" or 177cm diameter reel. This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. F852 NDS

9959 F852

SO-8 Tape and Reel Data and Package Dimensions July 1999, Rev. B

 1998 Fairchild Semiconductor Corporation Dimensions are in millimeter Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc SOIC (8lds) (12mm) 6.50 +/-0.10 5.30 +/-0.10 12.0 +/-0.3 1.55 +/-0.05 1.60 +/-0.10 1.75 +/-0.10 10.25 min 5.50 +/-0.05 8.0 +/-0.1 4.0 +/-0.1 2.1 +/-0.10 0.450 +/- 0.150 9.2 +/-0.3 0.06 +/-0.02 P1A0 D1 F W E2B0 Tc Wc T Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) 12mm 7" Dia 7.00 177.8 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 2.165 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 12mm 13" Dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 7.00 178 12.4 +2/0 0.724 18.4 0.469 – 0.606 11.9 – 15.4 See detail AA Dim A max 13" Diameter Option 7" Diameter Option Dim A Max See detail AA W2 max Measured at Hub W1 Measured at Hub Dim N Dim D min Dim C B Min DETAIL AA Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 20 deg maximum component rotation 0.5mm maximum 0.5mm maximum Sketch C (Top View) Component lateral movement Typical component cavity center line 20 deg maximum Typical component center line Sketch B (Top View) Component Rotation Sketch A (Side or Front Sectional View) Component Rotation User Direction of Feed SOIC(8lds) Embossed Carrier Tape Configuration: Figure 3.0 SOIC(8lds) Reel Configuration: Figure 4.0 SO-8 Tape and Reel Data and Package Dimensions, continued July 1999, Rev. B

SOIC-8 (FS PKG Code S1) 1 : 1 Scale 1:1 on letter size paper Dimensions s how n below are in: inches [millimeters] Part Weight per unit (gram): 0.0774 SO-8 Tape and Reel Data and Package Dimensions, continued September 1998, Rev. A

ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ E 2CMOS TM FACT™ FACT Quiet Series™ FAST FASTr™ GTO™ The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ HiSeC™ ISOPLANAR™ MICROWIRE™ POP™ PowerTrench QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 Rev. E