93LC465B-I/OT

93AA46A_07 MICROCHIP | Alldatasheet

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© 2007 Microchip Technology Inc. DS21929D-page 1 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C 93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C 93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C 93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C 93AA86A/B/C, 93LC86A/B/C, 93C86A/B/C Features:

• Densities from 1 Kbits through 16 Kbits
• Low-power CMOS technology
• Available with or without ORG function: With ORG function: - ORG pin at Logic Low: 8-bit word - ORG pin at Logic High: 16-bit word Without ORG function: - ‘A’ version: 8-bit word - ‘B’ version: 16-bit word
• Program Enable pin: - Write-protect for entire array (93XX76C and 93XX86C only)
• Self-timed Erase/Write cycles (including auto-erase)
• Automatic ERAL before WRAL
• Power-on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device Status signal (Ready/Busy)
• Sequential Read function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Pb-free and RoHS compliant
• Temperature ranges supported: Pin Function Table Description: Microchip Technology Inc. supports the 3-wire Microwire bus with low-voltage serial Electrically Erasable PROMs (EEPROM) that range in density from 1 Kbits up to 16 Kbits. Each density is available with and without the ORG functionality, and selected by the part number ordered. Advanced CMOS technol- ogy makes these devices ideal for low-power, nonvol- atile memory applications. The entire series of Microwire devices are available in the standard 8-lead PDIP and SOIC packages, as well as the more advanced packaging such as the 8-lead MSOP, 8-lead TSSOP, 6-lead SOT-23, and 8-lead DFN (2x3). All packages are Pb-free. Pin Diagrams (not to scale) - Industrial (I) -40°C to +85°C - Automotive (E) -40°C to +125°C Name Function CS Chip Select CLK Serial Data Clock DI Serial Data Input DO Serial Data Output VSS Ground PE Program Enable ORG Memory Configuration VCC Power Supply Note: ORG and PE functionality not available in all products. See Table 1-1, Device Selection Table. PDIP/SOIC (P, SN) CS CLK DI DO VCC NC ORG VSS ROTATED SOIC (ex: 93LC46BX) TSSOP/MSOP CS CLK DI DO VCC PE(2,3) ORG(1,3) VSS (ST, MS) SOT-23 DO VSS DI VCC CS CLK (OT) Note 1: ORG pin: Only on 93XX46C/56C/66C/76C/86C. 2: PE pin: Only on 93XX76C/86C. 3: ORG/PE: No internal connections on 93XXA/B. DI DO VSS ORG CLK CS VCC PE (1,3) (1,3) (2,3) DFN (MC) CS CLK DI DO VCC PE(2,3) ORG(1,3) VSS 1K-16K Microwire Compatible Serial EEPROMs

© 2007 Microchip Technology Inc. TABLE 1-1: DEVICE SELECTION TABLE Part Number Density (Kbits) VCC Range ORG Pin Organization (Words) PE Pin Temp Range Packages 93XX46A/B/C 93AA46A 1.8-5.5 No 128 x 8 bits No I P, SN, ST, MS, OT, MC 93AA46B 1.8-5.5 No 64 x 16 bits No I P, SN, ST, MS, OT, MC 93AA46C 1.8-5.5 Yes Selectable x8 or x16 No I P, SN, ST, MS, MC 93LC46A 2.5-5.5 No 128 x 8 bits No I, E P, SN, ST, MS, OT, MC 93LC46B 2.5-5.5 No 64 x 16 bits No I, E P, SN, ST, MS, OT, MC 93LC46C 2.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93C46A 4.5-5.5 No 128 x 8 bits No I, E P, SN, ST, MS, OT, MC 93C46B 4.5-5.5 No 64 x 16 bits No I, E P, SN, ST, MS, OT, MC 93C46C 4.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93AA46AX/BX/CX, 93LC46AX/BX/CX, 93C46AX/BX/CX (Alternate pinout with die rotated 90°) 93AA46AX 1.8-5.5 No 128 x 8 bits No I P, SN, ST, MS, OT, MC 93AA46BX 1.8-5.5 No 64 x 16 bits No I P, SN, ST, MS, OT, MC 93AA46CX 1.8-5.5 Yes Selectable x8 or x16 No I P, SN, ST, MS, MC 93LC46AX 2.5-5.5 No 128 x 8 bits No I, E P, SN, ST, MS, OT, MC 93LC46BX 2.5-5.5 No 64 x 16 bits No I, E P, SN, ST, MS, OT, MC 93LC46CX 2.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93C46AX 4.5-5.5 No 128 x 8 bits No I, E P, SN, ST, MS, OT, MC 93C46BX 4.5-5.5 No 64 x 16 bits No I, E P, SN, ST, MS, OT, MC 93C46CX 4.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93XX56A/B/C 93AA56A 1.8-5.5 No 256 x 8 bits No I P, SN, ST, MS, OT, MC 93AA56B 1.8-5.5 No 128 x 16 bits No I P, SN, ST, MS, OT, MC 93AA56C 1.8-5.5 Yes Selectable x8 or x16 No I P, SN, ST, MS, MC 93LC56A 2.5-5.5 No 256 x 8 bits No I, E P, SN, ST, MS, OT, MC 93LC56B 2.5-5.5 No 128 x 16 bits No I, E P, SN, ST, MS, OT, MC 93LC56C 2.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93C56A 4.5-5.5 No 256 x 8 bits No I, E P, SN, ST, MS, OT, MC 93C56B 4.5-5.5 No 128 x 16 bits No I, E P, SN, ST, MS, OT, MC 93C56C 4.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93XX66A/B/C 93AA66A 1.8-5.5 No 512 x 8 bits No I P, SN, ST, MS, OT, MC 93AA66B 1.8-5.5 No 256 x 16 bits No I P, SN, ST, MS, OT, MC 93AA66C 1.8-5.5 Yes Selectable x8 or x16 No I P, SN, ST, MS, MC 93LC66A 2.5-5.5 No 512 x 8 bits No I, E P, SN, ST, MS, OT, MC 93LC66B 2.5-5.5 No 256 x 16 bits No I, E P, SN, ST, MS, OT, MC 93LC66C 2.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC 93C66A 4.5-5.5 No 512 x 8 bits No I, E P, SN, ST, MS, OT, MC 93C66B 4.5-5.5 No 256 x 16 bits No I, E P, SN, ST, MS, OT, MC 93C66C 4.5-5.5 Yes Selectable x8 or x16 No I, E P, SN, ST, MS, MC

© 2007 Microchip Technology Inc. DS21929D-page 3 93XX46X/56X/66X/76X/86X 93XX76A/B/C 93AA76A 1.8-5.5 No 1024 x 8 bits No I OT 93AA76B 1.8-5.5 No 512 x 16 bits No I OT 93AA76C 1.8-5.5 Yes Selectable x8 or x16 Yes I P, SN, ST, MS, MC 93LC76A 2.5-5.5 No 1024 x 8 bits No I, E OT 93LC76B 2.5-5.5 No 512 x 16 bits No I, E OT 93LC76C 2.5-5.5 Yes Selectable x8 or x16 Yes I, E P, SN, ST, MS, MC 93C76A 4.5-5.5 No 1024 x 8 bits No I, E OT 93C76B 4.5-5.5 No 512 x 16 bits No I, E OT 93C76C 4.5-5.5 Yes Selectable x8 or x16 Yes I, E P, SN, ST, MS, MC 93XX86A/B/C 93AA86A 1.8-5.5 No 2048 x 8 bits No I OT 93AA86B 1.8-5.5 No 1024 x 16 bits No I OT 93AA86C 1.8-5.5 Yes Selectable x8 or x16 Yes I P, SN, ST, MS, MC 93LC86A 2.5-5.5 No 2048 x 8 bits No I, E OT 93LC86B 2.5-5.5 No 1024 x 16 bits No I, E OT 93LC86C 2.5-5.5 Yes Selectable x8 or x16 Yes I, E P, SN, ST, MS, MC 93C86A 4.5-5.5 No 2048 x 8 bits No I, E OT 93C86B 4.5-5.5 No 1024 x 16 bits No I, E OT 93C86C 4.5-5.5 Yes Selectable x8 or x16 Yes I, E P, SN, ST, MS, MC TABLE 1-1: DEVICE SELECTION TABLE (CONTINUED) Part Number Density (Kbits) VCC Range ORG Pin Organization (Words) PE Pin Temp Range Packages

© 2007 Microchip Technology Inc. 2.0

ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings(†) † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 2-1: DC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. VCC = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Param. No. Symbol Parameter Min. Typ. Max. Units Conditions VIH1 VIH2 High-level input voltage 2.0

0.7 VCC

V V VCC ≥ 2.7V VCC < 2.7V VIL1 VIL2 Low-level input voltage -0.3 -0.3 0.8

0.2 VCC

V V VCC ≥ 2.7V VCC < 2.7V VOL1 VOL2 Low-level output voltage 0.4 0.2 V V IOL = 2.1 mA, VCC = 4.5V IOL = 100 μA, VCC = 2.5V VOH1 VOH2 High-level output voltage 2.4 VCC-0.2 V V IOH = -400 μA, VCC = 4.5V IOH = -100 μA, VCC = 2.5V ILI Input leakage current μA VIN = VSS to VCC ILO Output leakage current μA VOUT = VSS to VCC CIN, COUT Pin capacitance (all inputs/outputs) pF VIN/VOUT = 0V (Note 1) TA = 25°C, FCLK = 1 MHz ICC write Write current mA FCLK = 3 MHz, VCC = 5.5V (93XX46X/56X/66X) 500 mA μA FCLK = 3 MHz, VCC = 5.5V (93XX76X/86X) FCLK = 2 MHz, VCC = 2.5V ICC read Read current 100 500 mA μA μA FCLK = 3 MHz, VCC = 5.5V FCLK = 2 MHz, VCC = 3.0V FCLK = 2 MHz, VCC = 2.5V D10 ICCS Standby current μA μA I-Temp (Note 2, 3) E-Temp CLK = Cs = 0V ORG = DI = VSS or VCC D11 VPOR VCC voltage detect 1.5V 3.8V V V 93AAX6A/B/C, 93LCX6A/B/C, 93CX6A/B/C (Note 1) Note 1: This parameter is periodically sampled and not 100% tested. ORG and PE pins not available on ‘A’ or ‘B’ versions. Ready/Busy status must be cleared from DO, see Section 4.4 “Data Out (DO)”.

© 2007 Microchip Technology Inc. DS21929D-page 5 93XX46X/56X/66X/76X/86X TABLE 2-2: AC CHARACTERISTICS All parameters apply over the specified ranges unless otherwise noted. VCC = 1.8V to 5.5V Industrial (I): TA = -40°C to +85°C Automotive (E): TA = -40°C to +125°C Param. No. Symbol Parameter Min. Max. Units Conditions FCLK Clock frequency MHz MHz MHz 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCKH Clock high time 200 250 450 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCKL Clock low time 100 200 450 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCSS Chip Select setup time 100 250 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TCSH Chip Select hold time ns 1.8V ≤ VCC < 5.5V TCSL Chip Select low time 250 ns 1.8V ≤ VCC < 5.5V TDIS Data input setup time 100 250 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TDIH Data input hold time 100 250 ns ns ns 4.5V ≤ VCC < 5.5V 2.5V ≤ VCC < 4.5V 1.8V ≤ VCC < 2.5V TPD Data output delay time 100 ns 4.5V ≤ VCC < 5.5V, CL = 100 pF (93C76X/86X) 200 250 400 ns ns ns 4.5V ≤ VCC < 5.5V, CL = 100 pF 2.5V ≤ VCC < 4.5V, CL = 100 pF 1.8V ≤ VCC < 2.5V, CL = 100 pF A10 TCZ Data output disable time 100 200 ns ns 4.5V ≤ VCC < 5.5V, (Note 1) 1.8V ≤ VCC < 4.5V, (Note 1) A11 TSV Status valid time 200 300 500 ns ns ns 4.5V ≤ VCC < 5.5V, CL = 100 pF 2.5V ≤ VCC < 4.5V, CL = 100 pF 1.8V ≤ VCC < 2.5V, CL = 100 pF A12 TWC Program cycle time ms Erase/Write mode 93XX76X/86X (AA and LC versions) ms 93XX46X/56X/66X (AA and LC versions) A13 TWC ms 93C46X/56X/66X/76X/86X A14 TEC Program cycle time ms ERAL mode, 4.5V ≤ VCC ≤ 5.5V A15 TWL ms WRAL mode, 4.5V ≤ VCC ≤ 5.5V A16 Endurance cycles 25°C, VCC = 5.0V, (Note 2) Note 1: This parameter is periodically sampled and not 100% tested. This application is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which may be downloaded from Microchip’s web site at www.microchip.com.

© 2007 Microchip Technology Inc. FIGURE 2-1: SYNCHRONOUS DATA TIMING CS VIH VIL VIH VIL VIH VIL VOH VOL VOH VOL CLK DI DO (Read) DO (Program) TCSS TDIS TCKH TCKL TDIH TPD TCSH TPD TCZ Status Valid TSV TCZ Note: Status Valid Time (TSV) is relative to CS.

© 2007 Microchip Technology Inc. DS21929D-page 7 93XX46X/56X/66X/76X/86X TABLE 2-4: INSTRUCTION SET FOR 93XX56A/B/C TABLE 2-3: INSTRUCTION SET FOR 93XX46A/B/C Instruction SB Opcode Address Data In Data Out Req. CLK Cycles 93XX46B OR 93XX46C WITH ORG = 1 (16-BIT WORD ORGANIZATION) ERASE (RDY/BSY) ERAL x x x x (RDY/BSY) EWDS x x x x High-Z EWEN x x x x High-Z READ D15-D0 WRITE D15-D0 (RDY/BSY) WRAL x x x x D15-D0 (RDY/BSY) 93XX46A OR 93XX46C WITH ORG = 0 (8-BIT WORD ORGANIZATION) ERASE (RDY/BSY) ERAL x x x x x (RDY/BSY) EWDS x x x x x High-Z EWEN x x x x x High-Z READ D7-D0 WRITE D7-D0 (RDY/BSY) WRAL x x x x x D7-D0 (RDY/BSY) Instruction SB Opcode Address Data In Data Out Req. CLK Cycles 93XX56B OR 93XX56C WITH ORG = 1 (16-BIT WORD ORGANIZATION) ERASE x (RDY/BSY) ERAL x x x x x x (RDY/BSY) EWDS x x x x x x High-Z EWEN x x x x x x High-Z READ x D15-D0 WRITE x D15-D0 (RDY/BSY) WRAL x x x x x x D15-D0 (RDY/BSY) 93XX56A OR 93XX56C WITH ORG = 0 (8-BIT WORD ORGANIZATION) ERASE x (RDY/BSY) ERAL x x x x x x x (RDY/BSY) EWDS x x x x x x x High-Z EWEN x x x x x x x High-Z READ x D7-D0 WRITE x D7-D0 (RDY/BSY) WRAL x x x x x x x D7-D0 (RDY/BSY)

© 2007 Microchip Technology Inc. TABLE 2-5: INSTRUCTION SET FOR 93XX66A/B/C TABLE 2-6: INSTRUCTION SET FOR 93XX76A/B/C Instruction SB Opcode Address Data In Data Out Req. CLK Cycles 93XX66B OR 93XX66C WITH ORG = 1 (16-BIT WORD ORGANIZATION) ERASE (RDY/BSY) ERAL x x x x x x (RDY/BSY) EWDS x x x x x x High-Z EWEN x x x x x x High-Z READ D15-D0 WRITE D15-D0 (RDY/BSY) WRAL x x x x x x D15-D0 (RDY/BSY) 93XX66A OR 93XX66C WITH ORG = 0 (8-BIT WORD ORGANIZATION) ERASE (RDY/BSY) ERAL x x x x x x x (RDY/BSY) EWDS x x x x x x x High-Z EWEN x x x x x x x High-Z READ D7-D0 WRITE D7-D0 (RDY/BSY) WRAL x x x x x x x D7-D0 (RDY/BSY) Instruction SB Opcode Address Data In Data Out Req. CLK Cycles 93XX76B OR 93XX76C WITH ORG = 1 (16-BIT WORD ORGANIZATION) ERASE x (RDY/BSY) ERAL x x x x x x x x (RDY/BSY) EWDS x x x x x x x x High-Z EWEN x x x x x x x x High-Z READ x D15-D0 WRITE x D15-D0 (RDY/BSY) WRAL x x x x x x x x D15-D0 (RDY/BSY) 93XX76A OR 93XX76C WITH ORG = 0 (8-BIT WORD ORGANIZATION) ERASE x (RDY/BSY) ERAL x x x x x x x x x (RDY/BSY) EWDS x x x x x x x x x High-Z EWEN x x x x x x x x x High-Z READ x D7-D0 WRITE x D7-D0 (RDY/BSY) WRAL x x x x x x x x x D7-D0 (RDY/BSY)

© 2007 Microchip Technology Inc. DS21929D-page 9 93XX46X/56X/66X/76X/86X TABLE 2-7: INSTRUCTION SET FOR 93XX86A/B/C Instruction SB Opcode Address Data In Data Out Req. CLK Cycles 93XX86B OR 93XX86C WITH ORG = 1 (16-BIT WORD ORGANIZATION) ERASE (RDY/BSY) ERAL x x x x x x x x (RDY/BSY) EWDS x x x x x x x x High-Z EWEN x x x x x x x x High-Z READ D15-D0 WRITE D15-D0 (RDY/BSY) WRAL x x x x x x x x D15-D0 (RDY/BSY) 93XX86A OR 93XX86C WITH ORG = 0 (8-BIT WORD ORGANIZATION) ERASE A10 A9 (RDY/BSY) ERAL x x x x x x x x x (RDY/BSY) EWDS x x x x x x x x x High-Z EWEN x x x x x x x x x High-Z READ A10 A9 D7-D0 WRITE A10 A9 D7-D0 (RDY/BSY) WRAL x x x x x x x x x D7-D0 (RDY/BSY)

© 2007 Microchip Technology Inc. 3.0 FUNCTIONAL DESCRIPTION When the ORG pin is connected to VCC, the (x16) organization is selected. When it is connected to ground, the (x8) organization is selected. Instruc- tions, addresses and write data are clocked into the DI pin on the rising edge of the clock (CLK). The DO pin is normally held in a High-Z state except when reading data from the device, or when checking the Ready/Busy status during a programming operation. The Ready/Busy status can be verified during an Erase/Write operation by polling the DO pin; DO low indicates that programming is still in progress, while DO high indicates the device is ready. DO will enter the High-Z state on the falling edge of CS. 3.1 Start Condition The Start bit is detected by the device if CS and DI are both high with respect to the positive edge of CLK for the first time. Before a Start condition is detected, CS, CLK and DI may change in any combination (except to that of a Start condition), without resulting in any device operation (Read, Write, Erase, EWEN, EWDS, ERAL or WRAL). As soon as CS is high, the device is no longer in Standby mode. An instruction following a Start condition will only be executed if the required opcode, address and data bits for any particular instruction are clocked in. 3.2 Data In/Data Out (DI/DO) It is possible to connect the Data In and Data Out pins together. However, with this configuration it is possible for a “bus conflict” to occur during the “dummy zero” that precedes the read operation, if A0 is a logic high level. Under such a condition the voltage level seen at Data Out is undefined and will depend upon the relative impedances of Data Out and the signal source driving A0. The higher the current sourcing capability of the driver, the higher the voltage at the Data Out pin. In order to limit this current, a resistor should be connected between DI and DO. 3.3 Data Protection All modes of operation are inhibited when VCC is below a typical voltage of 1.5V for ‘93AAXX’ and ‘93LCXX’ devices or 3.8V for ‘93CXX’ devices. The EWEN and EWDS commands give additional protection against accidentally programming during normal operation. After power-up, the device is automatically in the EWDS mode. Therefore, an EWEN instruction must be performed before the initial ERASE or WRITE instruction can be executed. Block Diagram Note: When preparing to transmit an instruction, either the CLK or DI signal levels must be at a logic low as CS is toggled active high. Note: For added protection, an EWDS command should be performed after every write operation and an external 10 kΩ pull-down protection resistor should be added to the CS pin. Note: To prevent accidental writes to the array in the 93XX76C/86C devices, set the PE pin to a logic low. VCC VSS HV Generator EEPROM Array I/O Control Logic Memory Control Logic X Dec Byte Latches Y Decoder Sense Amp. R/W Control DI DO CS CLK ORG(1) PE(2) Note 1: ORG pin: Only on 93XX46C/56C/66C/76C/86C. 2: PE pin: Only on 93XX76C/86C.

© 2007 Microchip Technology Inc. 3.7 READ The READ instruction outputs the serial data of the addressed memory location on the DO pin. A dummy zero bit precedes the 8-bit (If ORG pin is low or A-version devices) or 16-bit (If ORG pin is high or B-version devices) output string. The output data bits will toggle on the rising edge of the CLK and are stable after the spec- ified time delay (TPD). Sequential read is possible when CS is held high. The memory data will automatically cycle to the next register and output sequentially. FIGURE 3-7: READ TIMING CS CLK DI DO An

• •• High-Z Dx
• •• Dx
• ••
• •• Dx

© 2007 Microchip Technology Inc. DS21929D-page 17 93XX46X/56X/66X/76X/86X 4.0 PIN DESCRIPTIONS TABLE 4-1: PIN DESCRIPTIONS 4.1 Chip Select (CS) A high level selects the device; a low level deselects the device and forces it into Standby mode. However, a programming cycle which is already in progress will be completed, regardless of the Chip Select (CS) input signal. If CS is brought low during a program cycle, the device will go into Standby mode as soon as the programming cycle is completed. CS must be low for 250 ns minimum (TCSL) between consecutive instructions. If CS is low, the internal control logic is held in a Reset status. 4.2 Serial Clock (CLK) The Serial Clock is used to synchronize the communi- cation between a master device and the 93XX series device. Opcodes, address and data bits are clocked in on the positive edge of CLK. Data bits are also clocked out on the positive edge of CLK. CLK can be stopped anywhere in the transmission sequence (at high or low level) and can be continued anytime with respect to Clock High Time (TCKH) and Clock Low Time (TCKL). This gives the controlling mas- ter freedom in preparing opcode, address and data. CLK is a “don't care” if CS is low (device deselected). If CS is high, but the Start condition has not been detected (DI = 0), any number of clock cycles can be received by the device without changing its status (i.e., waiting for a Start condition). CLK cycles are not required during the self-timed Write (i.e., auto Erase/Write) cycle. After detection of a Start condition the specified number of clock cycles (respectively low-to-high transitions of CLK) must be provided. These clock cycles are required to clock in all required opcode, address and data bits before an instruction is executed. CLK and DI then become “don't care” inputs waiting for a new Start condition to be detected. 4.3 Data In (DI) Data In (DI) is used to clock in a Start bit, opcode, address and data synchronously with the CLK input. 4.4 Data Out (DO) Data Out (DO) is used in the Read mode to output data synchronously with the CLK input (TPD after the positive edge of CLK). This pin also provides Ready/Busy status information during Erase and Write cycles. Ready/Busy status information is available on the DO pin if CS is brought high after being low for minimum Chip Select Low Time (TCSL) and an erase or write operation has been initiated. The Status signal is not available on DO, if CS is held low during the entire Erase or Write cycle. In this case, DO is in the High-Z mode. If status is checked after the Erase/Write cycle, the data line will be high to indicate the device is ready. Name SOIC/PDIP/MSOP/ TSSOP/DFN SOT-23 Function CS Chip Select CLK Serial Clock DI Data In DO Data Out VSS Ground ORG N/A Organization (93XX46C/56C/66C/76C/86C) NC(1) No connect on 93XXA/B devices PE N/A Program Enable (93XX76C/86C) NC(1) No connect on 93XXA/B devices VCC Power Supply Note 1: With no internal connection, logic levels on NC pins are “don’t cares.” Note: After the Read cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO.

© 2007 Microchip Technology Inc. 4.5 Organization (ORG) When the ORG pin is connected to VCC or Logic HI, the (x16) memory organization is selected. When the ORG pin is tied to VSS or Logic LO, the (x8) memory organization is selected. For proper operation, ORG must be tied to a valid logic level. For devices without the ORG functionality, there is no internal connection to the ORG pin. In these devices the functionality has been set at the factory to support a single word size. ‘A’ series devices – x8 organization ‘B’ series devices – x16 organization 4.6 Program Enable (PE) A logic level on the PE pin will enable or disable the abil- ity to write data to the memory array in only the 8-lead 93XX76C and 93XX86C devices. For all other devices the PE function is not present and the PE pin is a no connect. When driving the PE pin to a logic High, the device can be programmed, but when the PE pin is driven Low, programming is inhibited. This pin is used in parallel with the EWEN/EWDS latch to protect the memory array from inadvertent writes, as shown in Table 4-2. In either the 93XX76C or 93XX86C devices, the PE pin must be tied to a specific logic level and cannot be floated. In all other devices without the PE function, the PE pin has no internal connections and programming is always enabled. TABLE 4-2: WRITE PROTECTION SCHEME EWEN/EWDS Latch PE Pin* Array WRITE Enabled Yes Disabled No Enabled No Disabled No * PE pin level does not alter the state of the EWEN/EWDS latch. Note: For devices with PE functionality such as 93XX76C or 93XX86C, the write sequence requires a logic high signal on the PE pin prior to the rising edge of clock on the last data bit.

© 2007 Microchip Technology Inc. DS21929D-page 19 93XX46X/56X/66X/76X/86X APPENDIX A:

REVISION HISTORY

Original release of document. Combined all the 93-Series Microwire Serial EEPROM device data sheets. Revision B Revised 2x3 (MC) DFN package drawing. Revision C Correction to Table 2-6, 93XX76A (EWDS). Revision D (03/2007) Revised Description; Delete Pb-free notes; Replaced Package Drawings; Revised Product ID System.

© 2007 Microchip Technology Inc. 5.0 PACKAGING INFORMATION 5.1 Package Marking Information TXXXXNNN XXXXXXXX YYWW 8-Lead PDIP I/P IL7 93LC46A 0528 Example: Pb-free 3-Wire 8-Lead PDIP Package Marking Part Line 1 Marking Part Line 1 Marking Part Line 1 Marking 93AA46A 93AA46A 93LC46A 93LC46A 93C46A 93C46A 93AA46B 93AA46B 93LC46B 93LC46B 93C46B 93C46B 93AA46C 93AA46C 93LC46C 93LC46C 93C46C 93C46C 93AA56A 93AA56A 93LC56A 93LC56A 93C56A 93C56A 93AA56B 93AA56B 93LC56B 93LC56B 93C56B 93C56B 93AA56C 93AA56C 93LC56C 93LC56C 93C56C 93C56C 93AA66A 93AA66A 93LC66A 93LC66A 93C66A 93C66A 93AA66B 93AA66B 93LC66B 93LC66B 93C66B 93C66B 93AA66C 93AA66C 93LC66C 93LC66C 93C66C 93C66C 93AA76A 93AA76A 93LC76A 93LC76A 93C76A 93C76A 93AA76B 93AA76B 93LC76B 93LC76B 93C76B 93C76B 93AA76C 93AA76C 93LC76C 93LC76C 93C76C 93C76C 93AA86A 93AA86A 93LC86A 93LC86A 93C86A 93C86A 93AA86B 93AA86B 93LC86B 93LC86B 93C86B 93C86B 93AA86C 93AA86C 93LC86C 93LC86C 93C86C 93C86C Note: Temperature range on second line. e Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2007 Microchip Technology Inc. DS21929D-page 21 93XX46X/56X/66X/76X/86X 8-Lead SOIC XXXXYYWW XXXXXXXT NNN Example: Pb-free SN 0528 93LC46AI 1L7 3-Wire 8-Lead SOIC (SN) Package Marking Part Line 1 Marking Part Line 1 Marking Part Line 1 Marking 93AA46A 93AA46AT 93LC46A 93LC46AT 93C46A 93C46AT 93AA46B 93AA46BT 93LC46B 93LC46BT 93C46B 93C46BT 93AA46C 93AA46CT 93LC46C 93LC46CT 93C46C 93C46CT 93AA56A 93AA56AT 93LC56A 93LC56AT 93C56A 93C56AT 93AA56B 93AA56BT 93LC56B 93LC56BT 93C56B 93C56BT 93AA56C 93AA56CT 93LC56C 93LC56CT 93C56C 93C56CT 93AA66A 93AA66AT 93LC66A 93LC66AT 93C66A 93C66AT 93AA66B 93AA66BT 93LC66B 93LC66BT 93C66B 93C66BT 93AA66C 93AA66CT 93LC66C 93LC66CT 93C66C 93C66CT 93AA76A 93AA76AT 93LC76A 93LC76AT 93C76A 93C76AT 93AA76B 93AA76BT 93LC76B 93LC76BT 93C76B 93C76BT 93AA76C 93AA76CT 93LC76C 93LC76CT 93C76C 93C76CT 93AA86A 93AA86AT 93LC86A 93LC86AT 93C86A 93C86AT 93AA86B 93AA86BT 93LC86B 93LC86BT 93C86B 93C86BT 93AA86C 93AA86CT 93LC86C 93LC86CT 93C86C 93C86CT Note: T = Temperature Range: I = Industrial, E = Extended e Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2007 Microchip Technology Inc. 3-Wire 2x3 DFN Package Marking Part Industrial Line 1 Marking E-Temp Line 1 Marking Part Industrial Line 1 Marking E-Temp Line 1 Marking Part Industrial Line 1 Marking E-Temp Line 1 Marking 93AA46A 301 302 93LC46A 304 305 93C46A 307 308 93AA46B 311 312 93LC46B 314 315 93C46B 317 318 93AA46C 321 322 93LC46C 324 325 93C46C 327 328 93AA56A 331 332 93LC56A 334 335 93C56A 337 338 93AA56B 341 342 93LC56B 344 345 93C56B 347 348 93AA56C 351 352 93LC56C 354 355 93C56C 357 358 93AA66A 361 362 93LC66A 364 365 93C66A 367 368 93AA66B 371 372 93LC66B 374 375 93C66B 377 378 93AA66C 381 382 93LC66C 384 385 93C66C 387 388 93AA76C 3B1 3B2 93LC76C 3B4 3B5 93C76C 3B7 3B8 93AA86C 3E1 3E2 93LC86C 3E4 3E5 93C86C 3E7 3E8 8-Lead 2x3 DFN Example: 304 506 XXX YWW NN Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2007 Microchip Technology Inc. DS21929D-page 23 93XX46X/56X/66X/76X/86X Example: 6-Lead SOT-23 XXNN 1EL7 3-Wire 6-Lead SOT-23 Package Marking Part Industrial Line 1 Marking E-Temp Line 1 Marking Part Industrial Line 1 Marking E-Temp Line 1 Marking Part Industrial Line 1 Marking E-Temp Line 1 Marking 93AA46A 1BNN 1CNN 93LC46A 1ENN 1FNN 93C46A 1HNN 1JNN 93AA46B 1LNN 1MNN 93LC46B 1PNN 1RNN 93C46B 1TNN 1UNN 93AA56A 2BNN 2CNN 93LC56A 2ENN 2FNN 93C56A 2HNN 2JNN 93AA56B 2LNN 2MNN 93LC56B 2PNN 2RNN 93C56B 2TNN 2UNN 93AA66A 3BNN 3CNN 93LC66A 3ENN 3FNN 93C66A 3HNN 3JNN 93AA66B 3LNN 3MNN 93LC66B 3PNN 3RNN 93C66B 3TNN 3UNN 93AA76A 4BNN 4CNN 93LC76A 4ENN 4FNN 93C76A 4HNN 4JNN 93AA76B 4LNN 4MNN 93LC76B 4PNN 4RNN 93C76B 4TNN 4UNN 93AA86A 5BNN 5CNN 93LC86A 5ENN 5FNN 93C86A 5HNN 5JNN 93AA86B 5LNN 5MNN 93LC86B 5PNN 5RNN 93C86B 5TNN 5UNN Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2007 Microchip Technology Inc. 3-Wire 8-Lead MSOP Package Marking Part Line 1 Marking Part Line 1 Marking Part Line 1 Marking 93AA46A 3A46AT 93LC46A 3L46AT 93C46A 3C46AT 93AA46B 3A46BT 93LC46B 3L46BT 93C46B 3C46BT 93AA46C 3A46CT 93LC46C 3L46CT 93C46C 3C46CT 93AA56A 3A56AT 93LC56A 3L56AT 93C56A 3C56AT 93AA56B 3A56BT 93LC56B 3L56BT 93C56B 3C56BT 93AA56C 3A56CT 93LC56C 3L56CT 93C56C 3C56CT 93AA66A 3A66AT 93LC66A 3L66AT 93C66A 3C66AT 93AA66B 3A66BT 93LC66B 3L66BT 93C66B 3C66BT 93AA66C 3A66CT 93LC66C 3L66CT 93C66C 3C66CT 93AA76A 3A76AT 93LC76A 3L76AT 93C76A 3C76AT 93AA76B 3A76BT 93LC76B 3L76BT 93C76B 3C76BT 93AA76C 3A76CT 93LC76C 3L76CT 93C76C 3C76CT 93AA86A 3A86AT 93LC86A 3L86AT 93C86A 3C86AT 93AA86B 3A86BT 93LC86B 3L86BT 93C86B 3C86BT 93AA86C 3A86CT 93LC86C 3L86CT 93C86C 3C86CT Note: T = Temperature Range: I = Industrial, E = Extended 8-Lead MSOP (150 mil) Example: XXXXXXT YWWNNN 3L46AI 5281L7 Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2007 Microchip Technology Inc. DS21929D-page 25 93XX46X/56X/66X/76X/86X NNN XXXX TYWW 8-Lead TSSOP 1L7 L46A I528 Example: 3-Wire 8-Lead TSSOP Package Marking Part Line 1 Marking Part Line 1 Marking Part Line 1 Marking 93AA46A A46A 93LC46A L46A 93C46A C46A 93AA46B A46B 93LC46B L46B 93C46B C46B 93AA46C A46C 93LC46C L46C 93C46C C46C 93AA56A A56A 93LC56A L56A 93C56A C56A 93AA56B A56B 93LC56B L56B 93C56B C56B 93AA56C A56C 93LC56C L56C 93C56C C56C 93AA66A A66A 93LC66A L66A 93C66A C66A 93AA66B A66B 93LC66B L66B 93C66B C66B 93AA66C A66C 93LC66C L66C 93C66C C66C 93AA76A A76A 93LC76A L76A 93C76A C76A 93AA76B A76B 93LC76B L76B 93C76B C76B 93AA76C A76C 93LC76C L76C 93C76C C76C 93AA86A A86A 93LC86A L86A 93C86A C86A 93AA86B A86B 93LC86B L86B 93C86B C86B 93AA86C A86C 93LC86C L86C 93C86C C86C Note: Temperature range on second line. Legend: XX...X Part number or part number code T Temperature (I, E) Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn) Note: For very small packages with no room for the Pb-free JEDEC designator , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e e

© 2007 Microchip Technology Inc. 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N Pitch e .100 BSC Top to Seating Plane A .210 Molded Package Thickness .115 .130 .195 Base to Seating Plane .015 Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB .430 N NOTE 1 D A L b e E eB c Microchip Technology Drawing C04-018B

© 2007 Microchip Technology Inc. DS21929D-page 27 93XX46X/56X/66X/76X/86X 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

1.27 BSC

A 1.75 Molded Package Thickness 1.25 Standoff § 0.10 0.25 Overall Width E

6.00 BSC

3.90 BSC

D

4.90 BSC

Chamfer (optional) h 0.25 0.50 Foot Length L 0.40 1.27 Footprint

1.04 REF

φ Lead Thickness c 0.17 0.25 Lead Width b 0.31 0.51 Mold Draft Angle Top α 15° Mold Draft Angle Bottom β 15° D N e E NOTE 1 b A L c h h φ β α Microchip Technology Drawing C04-057B

© 2007 Microchip Technology Inc. 8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.50 BSC

A 0.80 0.90 1.00 Standoff 0.00 0.02 0.05 Contact Thickness

0.20 REF

D

2.00 BSC

E

3.00 BSC

1.30 1.75 Exposed Pad Width 1.50 1.90 Contact Width b 0.18 0.25 0.30 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 D N E NOTE 1 EXPOSED PAD NOTE 1 K L N e b A NOTE 2 BOTTOM VIEW TOP VIEW Microchip Technology Drawing C04-123B

© 2007 Microchip Technology Inc. DS21929D-page 29 93XX46X/56X/66X/76X/86X 6-Lead Plastic Small Outline Transistor (CH or OT) [SOT-23] Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.95 BSC

1.90 BSC

A 0.90 1.45 Molded Package Thickness 0.89 1.30 Standoff 0.00 0.15 Overall Width E 2.20 3.20 Molded Package Width 1.30 1.80 Overall Length D 2.70 3.10 Foot Length L 0.10 0.60 Footprint 0.35 0.80 Foot Angle φ 30° Lead Thickness c 0.08 0.26 Lead Width b 0.20 0.51 b E N PIN 1 ID BY LASER MARK D e A c L φ Microchip Technology Drawing C04-028B

© 2007 Microchip Technology Inc. 8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e

0.65 BSC

A 1.10 Molded Package Thickness 0.75 0.85 0.95 Standoff 0.00 0.15 Overall Width E D L 0.40 0.60 0.80 Footprint

0.95 REF

φ Lead Thickness c 0.08 0.23 Lead Width b 0.22 0.40 D N E NOTE 1 e b A c L φ Microchip Technology Drawing C04-111B

© 2007 Microchip Technology Inc. DS21929D-page 31 93XX46X/56X/66X/76X/86X 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N Pitch e A 1.20 Molded Package Thickness 0.80 1.00 1.05 Standoff 0.05 0.15 Overall Width E

6.40 BSC

4.30 4.40 4.50 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint

1.00 REF

φ Lead Thickness c 0.09 0.20 Lead Width b 0.19 0.30 D N E NOTE 1 b e c A L φ Microchip Technology Drawing C04-086B

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21929D-page 33 93XX46X/56X/66X/76X/86X THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com

© 2007 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod- uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response From: Name Company Address City / State / ZIP / Country Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: DS21929D 93XX46X/56X/66X/76X/86X What are the best features of this document? How does this document meet your hardware and software development needs? Do you find the organization of this document easy to follow? If not, why? What additions to the document do you think would enhance the structure and subject? What deletions from the document could be made without affecting the overall usefulness? Is there any incorrect or misleading information (what and where)? How would you improve this document?

© 2007 Microchip Technology Inc. DS21929D-page 35 93XX46X/56X/66X/76X/86X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Examples: 93AA46A-I/MS: 1K, 128x8 Serial EEPROM, Industrial Temperature, MSOP package, 1.8V 93AA46BT-I/OT: 1K, 64x16 Serial EEPROM, SOT-23 package, tape and reel, 1.8V 93AA46CT-I/MS: 1K, 128x8 or 64x16 Serial EEPROM, MSOP package, tape and reel, 1.8V 93AA46BX-I/SN: 1K, 128x8 Serial EEPROM, Industrial temperature, SOIC package (alter- nate pinout), tape and reel package, 1.8V 93LC66A-I/MS: 4K, 512x8 Serial EEPROM, MSOP package, 2.5V 93LC66BT-I/OT: 4K, 256x16 Serial EEPROM, SOT-23 package, tape and reel, 2.5V 93C86AT-I/OT: 16K, 2048x8 Serial EEPROM, SOT-23 package, tape and reel, 5.0V 93C86BT-I/OT: 16K, 1024x16 Serial EEPROM, SOT-23 package, tape and reel, 5.0V 93C86CT-I/MC: 16K, 2048x8 or 1024x16 Serial EEPROM, DFN Industrial temperature, tape and reel package, 5.0V EEPROM Package Tape & Reel Series Voltage Density Size Word Temp Range AA = 1.8V-5.5V LC = 2.5V-5.5V C = 4.5V-5.5V 46 = 1 Kbit 56 = 2 Kbit 66 = 4 Kbit 76 = 8 Kbit 86 = 16 Kbit A = x8 bit B = x16 bit C = Selectable Blank = Std Pkg T = Tape & Reel I = -40°C to +85°C E = -40°C to +125°C P = 8-Lead PDIP SN = 8-Lead SOIC (3.90 mm) MC = 8-Lead 2x3 DFN CH or OT = 6-Lead SOT-23 MS = 8-Lead MSOP ST = 8-Lead TSSOP

© 2007 Microchip Technology Inc. NOTES:

© 2007 Microchip Technology Inc. DS21929D-page 37 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

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