935242520427-F1T

935242520427-F1T MURATA1 | Alldatasheet

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Technical content

Rev. 2.01 Technical Datasheet Murata Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 General description The aim of this document is to give a description of Murata Integrated Passive Solutions’ Wire Bonding Silicon vertical Capacitor (WBSC) characteristics for Chip On Board (COB) assembly solutions. The WBSC/WLSC Capacitor targets power supplies decoupling and filtering of active devices. This version is a single 2.7nF capacitor in 0.5 x 1.25mm package size. Other capacitance values and other package size are available as a single die or capacitor array; please feel free to contact us. The WBSC/WLSC Capacitor is based on PICS Integrated Passive technology. Standard PCB FR4 can be used. WBSC/WLSC capacitors are directly mounted on the PCB application using die bonding and wire bonding processes. Standard FR4 PCB can be used. The bottom electrode is in TiNiAu and the top electrode is in TiWAu. Other top finishings such as Aluminum are available on request. Key features  Full compatible Monolithic ceramic capacitors for replacement  Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage <-0.02%/Volts o Negligible capacitance loss through ageing  Low profile 0.25mm +/-0.010mm (standard), but lower thickness is possible (i.e 0.10mm) on request.  Small size 0205 [0.5 x 1.25 mm +/-0.02mm ]  Break down voltage: 150V  Low leakage current  High reliability  High operating temperature (up to 150 °C)  Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C)  Applicable for standard wire bonding assembly (ball and wedge) Key applications  Any demanding applications, such as medical, aerospace, automotive industrial…  Supply decoupling / filtering of active device  High reliability applications  Devices with battery operations  High temperature applications  High volumetric efficiency (i.e. capacitance per unit volume)

Rev. 2.01 Technical Datasheet Murata Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 Functional diagram The next figure provides implementation set-up diagram. Figure 1 Block Diagram Electrical performances Symbol Parameter Conditions Min. Typ. Max. Unit C Capacitance value @+25°C - 2.7 - nF CP Capacitance tolerance (1) @+25°C -15 - +15 % TOP Operating temperature -55 20 150 °C TSTG Storage temperature (2) -70 - 165 °C CT Capacitance temperature variation -55 °C to 150 °C - 60 - ppm/K RVDC Rated voltage (3) - - 61 (4) 68 (5) VDC BV Break down voltage @+25°C 150 - - V CRVDC Capacitance voltage variation From 0 V to RVDC, IR Insulation resistor @RVDC, +25°C, 120s - 1 - GΩ ESL Equivalent Serial Inductance (6) @+25°C, SRF shunt mode - 20 - pH ESR Equivalent Serial Resistance (6) @+25°C, shunt mode - 30 - mOhm Table 1 - Electrical performances (1): other tolerance available upon request (2): without packaging (3): Lifetime is voltage and temperature dependent, please refer to application note ‘Lifetime of 3D capacitors’ (4): 10 years of intrinsic life time prediction at 100°C continuous operation (5): 10 years of intrinsic life time prediction at 150°C continuous operation (6): estimate, theoretical two terminal equivalent (applicable to multi term capacitors) (7): please refer to application note ‘ESD Challenge in 3D Murata Integrated Passive technology’ For extended frequency range (up to 26GHz), see Ultra large band Wire bonding vertical Silicon Capacitor (UWSC).

Rev. 2.01 Technical Datasheet Murata Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 Pinning definition Figure 2 Pinning definition pin #

1 Top side 7

2 Back side

bottom electrode in Ti (0.1 µm)/Ni (0.3µm)/Au (0.2µm) Table 2 - Pining description.

Ordering Information

Murata Integrated Passive Devices delivers products with AQL level II (0.65). Part number Die Name Package Packaging Finishing Description 935242520427-F1T WO0205427 6” FFC (1) Au(2) WBSC 2.7nF BV150 – 1 bondpad – 0.5 x 1.25mm x 0.25mm (3) 935242520427-T3T WO0205427 T&R 1Kunits(4) Au(2) WBSC 2.7nF BV150 – 1 bondpad – 0.5 x 1.25mm x 0.25mm (3) 935246520427-F1T WO0205427 6” FFC (1) Au(2) WLSC 2.7nF BV150 – 1 bondpad – 0.5 x 1.25mm x 0.10mm (3) 935246520427-T3T WO0205427 T&R 1Kunits(4) Au(2) WLSC 2.7nF BV150 – 1 bondpad – 0.5 x 1.25mm x 0.10mm (3) Table 3 - Packaging and ordering information (1) Other film frame carrier are possible on request (2) Au = TiWAu(0.3µm) / Au (3µm) (3) Refer to Figure 3 (4) Missing capacitors can reach 0.5%

Rev. 2.01 Murata Integrated Passive Solutions S.A. makes no representation that the use of its products in the circuits described herein, or the use of other technical information contained herein, will not infringe upon existing or future patent rights. The descriptions contained herein do not imply the granting of licenses to make, use, or sell equipment constructed in accordance therewith. Specifications are subject to change without notice. Technical Datasheet Murata Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 www.murata.com mis@murata.com Wire Bondable Vertical SiCap WBSC/WLSC 0205 2.7 nF BV150 Definitions Data sheet status Objective specification: This data sheet contains target or goal specifications for product development. Preliminary specification: This data sheet contains preliminary data; supplementary data may be published later. Product specification: This data sheet contains final product specifications. Limiting values Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those given in the Electrical performances sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Revision history

Revision Date Description Author Release 1.0 2019 January 09th Objective specification LLE Release 1.1 2019 may 24th Objective specification LLE Release 1.4 2019 september 12th Objective specification LLE Release 1.5 2020 April 15th Objective specification LLE + SCA Release 2.01 2020 July 29th Product Release LLE + SCA Disclaimer / Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Murata customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Murata for any damages resulting from such improper use or sale. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.