935142837522-F1T_V01 MURATA | Alldatasheet

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Technical content

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 General description WBSC / WLSC Capacitors target power supplies decoupling and filtering of active devices. They are based on PICS Integrated Passive technology. This product is a single 22nF capacitor in 0402 package size (1.00 x 0.50 mm). Other capacitance values and other package size are available as a single die or capacitor array; please feel free to contact us. WBSC/WLSC capacitors are directly mounted on the PCB application using die bonding and wire bonding processes. Standard FR4 PCB can be used. The bottom electrode is in TiNiAu and the top electrode is in TiWAu. Other top finishings such as Aluminum are available on request. Key features

  • Full compatible Monolithic ceramic capacitors for replacement
  • Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage < -0.02%/Volt o Negligible capacitance loss through ageing
  • Low profile 0.25mm (standard), but lower thickness is possible (i.e 0.10mm) on request
  • Small size 1.00 x 0.50 mm (0402 format)
  • Break down voltage: 30V
  • Low leakage current
  • High reliability
  • High operating temperature (up to 150 °C)
  • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C)
  • Compatible with EIA 0402 footprint
  • Applicable for standard wire bonding assembly (ball and wedge) Key applications
  • Any demanding applications, such as medical, aerospace, automotive industrial…
  • Supply decoupling / filtering of active device
  • High reliability applications
  • High temperature applications
  • High volumetric efficiency (i.e. capacitance per unit volume)

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Functional diagram The next figure provides implementation set-up diagram. Figure 1 Block Diagram Electrical performances Symbol Parameter Conditions Min. Typ. Max. Unit C Capacitance value @+25°C - 22 - nF ΔCP Capacitance tolerance (1) @+25°C -15 - +15 % TOP Operating temperature -55 20 150 °C TSTG Storage temperature (2) -70 - 165 °C ΔCT Capacitance temperature variation -55°C to 150°C 70 ppm/K RVDC Rated voltage (3) - 16.0 (4) 14.7 (5) VDC BV Breakdown voltage @+25°C 30 - - VDC ΔCRVDC DC Capacitance voltage variation From 0V to RVDC, @25°C - - -0.02 %/VDC IR Insulation resistance @ RVDC, +25°C, 120s - 10 - GΩ ESL Equivalent Series Inductance @+25°C, SRF shunt mode - 3 - pH ESD HBM stress (6) JS-001-2017 2 - - kV Table 1 - Electrical performances (1): other tolerance available upon request (2): without packaging (3): Lifetime is voltage and temperature dependent, please refer to application note ‘Lifetime of 3D capacitors’ (4): 10 years of intrinsic life time prediction at 100°C continuous operation (5): 10 years of intrinsic life time prediction at 150°C continuous operation (6): please refer to application note ‘ESD Challenge in 3D Murata Integrated Passive technology’ For extended frequency range (up to 26GHz), see Ultra large band Wire bonding vertical Silicon Capacitor (UWSC).

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Pinning definition Figure 5 Pinning definition pin # Symbol Coordinates X / Y 1 Signal 0.0 / 0.0

2 GND Backside

Table 2 - Pining description. Reference (0,0) located at the centre of the die.

Ordering Information

Murata Integrated Passive Devices delivers products with AQL level II (0.65). Tighter quality levels are available upon request. Part number Package Die Name Packaging Finishing Description 935142837522-F1T 6” FFC(1) Au(2) WBSC 22nF/0402/BV30 1 bondpad 1.00 x 0.50mm x 0.25mm(3) WR0402522 935142837522-F2T 8” FFC(1) Au(2) 935142837522-E1T 6” Grip Ring(1) Au(2) 935142837522-T3T T&R 1Kunits(4) Au(2) 935142837522-W0T Waffle pack 400units Au(2) 935146837522-F1T 6” FFC(1) Au(2) WLSC 22nF/0402/BV30 1 bondpad 1.00 x 0.50mm x 0.10mm(3) WR0402522 935146837522-F2T 8” FFC(1) Au(2) 935146837522-E1T 6” Grip Ring(1) Au(2) 935146837522-T3T T&R 1Kunits(4) Au(2) 935146837522-W0T Waffle pack 400units Au(2) Table 3 - Packaging and ordering information (1) Other film frame carrier are possible on request (2) Au= TiWAu (0.3µm) / Au (3µm) (3) Refer to Package outline (4) missing capacitors can reach 0.5%

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Packaging format Please refer to application note ‘Products Storage Conditions and Shelf Life’. Tape and Reel: Dies are flipped in the tape cavity (bump down) with die ID located near the driving holes of the tape. Figure 11 - Reel drawing

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Tape Width Diameter A C D Hub N W1 W2 8 178 (7 inches) 13.5 20.2 60 9.3 11.5 Table 5 – Reel dimensions (mm) Figure 12 - Tape drawing Cavity dimensions Carrier tape width W0 Carrier tape pitch P0 Reel Capacity Ao Bo Ko 0.59 1.09 0.20 8 4 1000 0.65 1.14 0.33 8 4 1000 Table 6 - Tape dimensions (mm)

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Waffle pack: Please refer to application note ‘Waffle Pack Chip Carrier Handling & Opening Procedure’. Dies are not flipped in the waffle pack cavity (wire bond pad up). Table 8 - Waffle pack drawing Supplier reference External dimensions Max. capacity Pocket length X Pocket width Y Pocket depth Z (*) 2 inches 20 x 20 tbd tbd tbd Table 9 - Waffle pack dimensions (mm) for 250µm thick product (*) or equivalent M M1 M2 M3 A tbd tbd tbd tbd tbd Table 10 - Waffle pack dimensions (mm) for 250µm thick product Supplier reference External dimensions Max. capacity Pocket length X Pocket width Y Pocket depth Z (*) 2 inches 20 x 20 tbd tbd tbd Table 11 Waffle pack dimensions (mm) for 100µm thick product M M1 M2 M3 A tbd tbd tbd tbd tbd Table 12: Waffle pack dimensions (mm) for 100µm thick product M M3 X Y Z B AC

Rev.3.01 Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Expander Grip Ring 6” diameter: With UV curable dicing tape (UV performed) Good dies are identified using the SINF electronic mapping format. No physical ink is added on wafer to label other dies. Figure 15 – Grip Ring drawing Grip Ring Style A B C D E Locator Notch Table 13 - Frame dimensions (inches) (*) or equivalent

Rev.3.01 Murata Integrated Passive Solutions S.A. makes no representation that the use of its products in the circuits described herein, or the use of other technical information contained herein, will not infringe upon existing or future patent rights. The descriptions contained herein do not imply the granting of licenses to make, use, or sell equipment constructed in accordance therewith. Specifications are subject to change without notice. Technical Datasheet Murata Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 www.murata.com mis@murata.com Wire bonding Vertical Silicon Capacitor WBSC / WLSC 0402 22nF BV30 Definitions Data sheet status Objective specification: This data sheet contains target or goal specifications for product development. Preliminary specification: This data sheet contains preliminary data; supplementary data may be published later. Product specification: This data sheet contains final product specifications. Limiting values Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those given in the Electrical performances sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Revision history

Revision Date Description Author Rev 1.00 2010 August 13th Creation OGA Rev 2.04 2020 Sept. 7th General update OGA Rev.2.05 2021 Feb. 24th Layout and content update CG/OGA Rev.3.01 2022 April. 18th Adding of Top & Bottom electrode description OGA Disclaimer / Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Murata customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Murata for any damages resulting from such improper use or sale. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.