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Rev.2.08 Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 General description WBSC / WLSC Capacitors targets power supplies decoupling and filtering of active devices. They are based on PICS Integrated Passive technology. This product is a single 1nF capacitor array in a 0202 package size. Other capacitance values and other package size are available as a single die or capacitor array; please feel free to contact us. WBSC / WLSC capacitors are directly mounted on the PCB application using die bonding or wire bonding processes. Standard FR4 PCB can be used. The bottom electrode is in TiNiAu and the top electrode is in TiWAu. Other top finishings such as Aluminum are available on request. Key features

  • Compatible with MLCC footprint
  • Ultra-high stability of capacitance value:
  • Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage <0.02%/Volt o Negligible capacitance loss through ageing
  • Low profile 250µm or 100µm
  • Small size 0.5 x 0.5 mm (0202 format)
  • Break down voltage : 150V
  • Low leakage current
  • High reliability
  • High operating temperature (up to 150 °C)
  • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C)
  • Compatible with EIA 0202 footprint
  • Applicable for standard wire bonding assembly (ball and wedge) Key applications
  • Any demanding applications, such as medical, aerospace, automotive industrial…
  • Supply decoupling / filtering of active device
  • High reliability applications
  • High temperature applications
  • High volumetric efficiency (i.e. capacitance per unit volume)

Rev.2.08 Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Functional diagram The next figure provides implementation set-up diagram. Figure 1 Block Diagram Electrical performances Symbol Parameter Conditions Min. Typ. Max. Unit C Capacitance value @+25°C - 1 - nF ΔCP Capacitance tolerance (1) @+25°C -15 - +15 % TOP Operating temperature -55 20 150 °C TSTG Storage temperature (2) -70 - 165 °C ΔCT Capacitance temperature variation -55°C to +150°C 70 ppm/K RVDC Rated voltage (3) - 68 (4) 61 (5) VDC BV Breakdown voltage @+25°C 150 - - VDC ΔCRVDC DC Capacitance voltage variation From 0V to RVDC, IR Insulation resistance @ RVDC, +25°C, 120s - 10 - GΩ ESR Equivalent Series Resistance @+25°C, shunt mode - 10 - mΩ ESL Equivalent Series Inductance @+25°C, SRF shunt mode - 8 - pH ESD HBM stress (6) JS-001-2017 2 - - kV Table 1 - Electrical performances (1): other tolerance available upon request (2): without packaging (3): Lifetime is voltage and temperature dependent, please refer to application note ‘Lifetime of 3D capacitors’ (4): 10 years of intrinsic life time prediction at 100°C continuous operation (5): 10 years of intrinsic life time prediction at 150°C continuous operation (6): please refer to application note ‘ESD Challenge in 3D Murata Integrated Passive technology’ For extended frequency range (up to 26GHz), see Ultra large band Wire bondable vertical Silicon Capacitor (UWSC).

Rev.2.08 Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Pinning definition Figure 2 Pinning definition pin # Symbol Coordinates X / Y 1 Signal 0.0 / 0.0

2 GND Backside

Table 2 - Pining description. Reference (0,0) located at the centre of the die.

Ordering Information

Regardless of packaging, Murata Integrated Passive Devices delivers products with AQL level II (0.65). Type number Package Packaging Finishing Description 935142521410-F1T 6” FFC(1) Au(2) WBSC 1nF/0202 – 1 bondpad – 0.50 x 0.50mm x 0.25mm(3) 935142521410-F2T 8” FFC(1) Au(2) 935142521410-E1T 6” expander grip ring(1) Au(2) 935142521410-T3T T&R 1Kunits(4) Au(2) 935142521410-W0T Waffle pack 400units Au(2) 935146521410-F1T 6” FFC(1) Au(2) WLSC 1nF/0202 1 bondpad – 0.50 x 0.50mm x 0.10mm(3) 935146521410-F2T 8” FFC(1) Au(2) 935146521410-E1T 6” expander grip ring(1) Au(2) 935146521410-T3T T&R 1Kunits(4) Au(2) 935146521410-W0T Waffle pack 400units Au(2) (1) Other film frame carrier are possible on request (2) Au = TiWAu(0.3µm) / Au (3µm) (3) Refer to Figure 7 (4) missing capacitors can reach 0.5% Table 3 - Packaging and ordering information Product Name Die Name Description WBSC521.410 WO0202410 WBSC 1nF/0202/BV150– 1 bondpad – 0.50 x 0.50mm x 0.25mm WLSC521.410 WO0202410 WLSC 1nF/0202/BV150– 1 bondpad – 0.50 x 0.50mm x 0.10mm Table 4 - Die information

Rev.2.08 Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Figure 7 - Tape drawing Cavity dimensions Carrier tape width W0 Carrier tape pitch P0 Reel Capacity Ao Bo Ko 0.56 0.56 0.31 8 mm 4mm 1000 Table 7 - Tape dimensions (mm)

Rev.2.08 Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Waffle pack: Please refer to application note ‘Waffle Pack Chip Carrier Handling & Opening Procedure’. Dies are not flipped in the waffle pack cavity (wire bond pad up). Table 8 - Waffle pack drawing External dimensions Max. capacity Pocket length X Pocket width Y Pocket depth Z Table 9 - Waffle pack dimensions (mm) for 250µm thick product M M1 M2 M3 A Table 10 - Waffle pack dimensions (mm) for 250µm thick product External dimensions Max. capacity Pocket length X Pocket width Y Pocket depth Z Table 11 : Waffle pack dimensions (mm) for 100µm thick product M M1 M2 M3 A Table 12 : Waffle pack dimensions (mm) for 100µm thick product M M3 X Y Z B AC

Rev.2.08 Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Expander grip ring 6” diameter: With UV curable dicing tape (UV performed) Good dies are identified using the SINF electronic mapping format. No ink is added on wafer to label other dies. Figure 10 – Grip Ring drawing Grip Ring Style A B C D E Locator Notch Table 14 - Frame dimensions (inches) (1) or equivalent

Rev.2.08 Murata Integrated Passive Solutions S.A. makes no representation that the use of its products in the circuits described herein, or the use of other technical information contained herein, will not infringe upon existing or future patent rights. The descriptions contained herein do not imply the granting of licenses to make, use, or sell equipment constructed in accordance therewith. Specifications are subject to change without notice. Technical Datasheet Murata Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 www.murata.com mis@murata.com Wire Bondable Vertical Silicon Capacitor WBSC / WLSC 0202 1nF BV150 Definitions Data sheet status Objective specification: This data sheet contains target or goal specifications for product development. Preliminary specification: This data sheet contains preliminary data; supplementary data may be published later. Product specification: This data sheet contains final product specifications. Limiting values Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those given in the Electrical performances sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Revision history

Revision Date Description Author Rev 1.00 2014 May 12th Creation OGA Rev 2.07 2021 Feb 23rd Content and Layout update CGU / LLE / OGA Rev 2.08 2021 March 30rd Content and Layout update CGU / LLE / OGA Disclaimer / Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Murata customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Murata for any damages resulting from such improper use or sale. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.