935142050510-F1T_V01 MURATA | Alldatasheet

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Technical content

Rev.3.01 Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 General description WBSC / WLSC Capacitors targets power supplies decoupling and filtering of active devices. They are based on PICS Integrated Passive technology. This product is a single 10nF capacitor in 0303 package size. Other capacitance values and other package size are available as a single die or capacitor array; please feel free to contact us. WLSC capacitors are directly mounted on the PCB application using die bonding and wire bonding processes. Standard FR4 PCB can be used. The bottom electrode is in TiNiAu and the top electrode is in TiWAu. Other top finishings such as Aluminum are available on request. Key features

  • Compatible with MLCC footprint
  • Ultra-high stability of capacitance value: o Temperature 70ppm/K (-55 °C to +150 °C) o Voltage <-0.02%/Volt o Negligible capacitance loss through ageing
  • Low profile 0.1mm or 0.25mm
  • Small size 0.80 x 0.80 mm (0303 format)
  • Break down voltage: 100V
  • Low leakage current
  • High reliability
  • High operating temperature (up to 150 °C)
  • Compatible with high temperature cycling during manufacturing operations (exceeding 300 °C)
  • Compatible with EIA 00303 footprint
  • Applicable for standard wire bonding assembly (ball and wedge) Key applications
  • Any demanding applications, such as medical, aerospace, automotive industrial…
  • Supply decoupling / filtering of active device
  • High reliability applications
  • Battery operated devices
  • High temperature applications
  • High volumetric efficiency (i.e. capacitance per unit volume)

Rev.3.01 Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Functional diagram The next figure provides implementation set-up diagram. Figure 1 Block Diagram Electrical performances Symbol Parameter Conditions Min. Typ. Max. Unit C Capacitance value @+25°C - 10 - nF ΔCP Capacitance tolerance (1) @+25°C -15 - +15 % TOP Operating temperature -55 20 150 °C TSTG Storage temperature (2) -70 - 165 °C ΔCT Capacitance temperature variation -55°C to +150°C - 41 - ppm/K RVDC Rated voltage (3) - - 33 (4) 29 (5) VDC BV Breakdown voltage @+25°C 100 - - VDC ΔCRVDC DC Capacitance voltage variation From 0V to RVDC, IR Insulation resistance @ RVDC, +25°C, 120s - 100 - GΩ ESR Equivalent Series Resistance @+25°C, shunt mode - 250 - mΩ ESL Equivalent Series Inductance @+25°C, SRF shunt mode - 20 - pH ESD HBM stress (6) JS-001-2017 2 - - kV Table 1 - Electrical performances (1): other tolerance available upon request (2): without packaging (3): Lifetime is voltage and temperature dependent, please refer to application note ‘Lifetime of 3D capacitors’ (4): 10 years of intrinsic life time prediction at 100°C continuous operation (5): 10 years of intrinsic life time prediction at 150°C continuous operation (6): please refer to application note ‘ESD Challenge in 3D Murata Integrated Passive technology’ For extended frequency range (up to 26GHz), see Ultra large band Wire bondable vertical Silicon Capacitor (UWSC).

Rev.3.01 Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Pinning definition Figure 5 Pinning definition pin # Symbol Metalization

1 Signal TiWAu

2 GND TiNiAu

Table 2 - Pining description.

Ordering Information

Murata Integrated Passive Devices delivers products with AQL level II (0.65). Tighter quality levels are available upon request. Part number Package Die Name Packaging Finishing Description 935142050510-F1T 6” FFC Au (1) WBSC 10nF/0303/BV100 1 bondpad 0.80 x 0.80mm x 0.25mm (2) WK0303510 935142050510-F2T 8” FFC Au (1) 935142050510-T3T T&R 1Kunits(3) Au(1) 935142050510-E1T 6” GR Au (1) 935142050510-W0T Waffle pack 400units Au(1) 935146050510-F1T 6” FFC Au(1) WLSC 10nF/0303/BV100 1 bondpad 0.80 x 0.80mm x 0.10mm (2) WK0303510 935146050510-F2T 8” FFC Au(1) 935142050510-E1T 6” FFC Au (1) 935146050510-T3T T&R 1Kunits(3) Au(1) 935146050510-W0T Waffle pack 400units Au(1) Table 3 - Packaging and ordering information (1) detail for pad finishing: cf pad metallization chapter (2) Refer to Package outline (3) missing capacitors can reach 0.5% (only applicable to T&R)

Rev.3.01 Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Pad Metallization This wire bondable capacitor is delivered as standard with the bottom electrode in TiNiAu (Ti (0.1 µm)/Ni (0.3µm)/Au (0.2µm)) and top electrode in TiWAu (TiWAu (0.3µm) / Au (3µm)). Other Metallization, such as thick Gold or Aluminum top pads are possible on request. Silicon dies are not sensitive to humidity, please refer to applications notes ‘Assembly Notes’ section ‘Handling precautions and storage’. Material regulation This product is RoHS compliant at the time of publication. For further information about regulation compliancy, please ask your sales representative.

Rev.3.01 Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Assembly WBSC/WLSC capacitors are directly mounted on the PCB application using die bonding and wire bonding. It is applicable for standard wire bonding assembly (ball and wedge). For further information, please see our mounting application note. The attachment techniques recommended by Murata on the customer’s substrates are fully detailed in specific documents available on our website. To assure the correct use and proper functioning of Murata capacitors please download the assembly instructions on https://www.murata.com/en- us/products/capacitor/siliconcapacitors and read them carefully. Figure 8 Scan this QR Code to access the Murata Silicon Capacitor web page

Rev.3.01 Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Expander grip ring 6” diameter: With UV curable dicing tape (UV performed) Good dies are identified using the SINF electronic mapping format. No ink is added on wafer to label other dies. Figure 13 – Grip Ring drawing Grip Ring Style A B C D E Locator Notch Table 8 - Frame dimensions (inches) (1) or equivalent

Rev.3.01 Murata Integrated Passive Solutions S.A. makes no representation that the use of its products in the circuits described herein, or the use of other technical information contained herein, will not infringe upon existing or future patent rights. The descriptions contained herein do not imply the granting of licenses to make, use, or sell equipment constructed in accordance therewith. Specifications are subject to change without notice. Technical Datasheet Murata Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 www.murata.com mis@murata.com Wire bondable Vertical Silicon Capacitor WBSC / WLSC 0303 10nF BV100 Definitions Data sheet status Objective specification: This data sheet contains target or goal specifications for product development. Preliminary specification: This data sheet contains preliminary data; supplementary data may be published later. Product specification: This data sheet contains final product specifications. Limiting values Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those given in the Electrical performances sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Revision history

Revision Date Description Author Rev 1.0 2018 January 09th Objective specification OGA Rev 1.1 2018 April 06th Update of specification OGA Rev 1.2 2018 June 28th Update OGA Rev 1.3 2018 September 05th Transfer FBC 0001 OGA Rev 2.0 2020 March 10th Preliminary specification SCA Rev 2.01 2021, February 19th Layout and content update CGU /LLE/SCA/OGA Rev 2.02 2021, June 30th GR drawing and measurement curve LLE/SCA/OGA Rev 3.01 2022, June 27th Product specification LLE/SCA/DDE/OGA Disclaimer / Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Murata customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Murata for any damages resulting from such improper use or sale. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.