9334

9334 NSC | Alldatasheet

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Features

Y Random (addressable) data entry Y Serial to parallel capability Y 8 bits of storage/output of each bit available Y Active high demultiplexing/decoding capability Y Alternate Military/Aerospace device (9334) is available. Contact a National Semiconductor Sales Office/Distrib- utor for specifications. Connection Diagram Dual-In-Line Package TL/F/6609–1 Order Number 9334DMQB, 9334FMQB, DM9334J or DM9334N See NS Package Number J16A, N16E or W16A C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Absolute Maximum Ratings (Note) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage 7V Input Voltage 5.5V Operating Free Air Temperature Range Military b55§Ct o a125§C Commercial 0 § to a70§C Storage Temperature Range b65§Ct o a150§C Note: The ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaran- teed. The device should not be operated at these limits. The parametric values defined in the ‘‘Electrical Characteristics’’ table are not guaranteed at the absolute maximum ratings. The ‘‘Recommended Operating Conditions’’ table will define the conditions for actual device operation. Recommended Operating Conditions Symbol Parameter Military Commercial Units Min Nom Max Min Nom Max VCC Supply Voltage 4.5 5 5.5 4.75 5 5.25 V VIH High Level Input Voltage 2 2 V VIL Low Level Input Voltage 0.8 0.8 V IOH High Level Output Current b0.8 b0.8 mA IOL Low Level Output Current 16 16 mA tW ENABLE Pulse Width 19 13 19 13 ns(Fig. 1) (Note 4) tSU Setup Time Data 1 (Fig. 4) 20 13 20 13 (Note 4) Data 0 (Fig. 4) 20 14 20 14 ns Address (Fig. 6) 10 5 10 5(Note 1) tH Hold Time Data 1 (Fig. 4) 0 b10 0 b10 ns(Note 4) Data 0 (Fig. 4) 0 b13 0 b13 TA Free Air Operating Temperature b55 125 0 70 §C Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units(Note 2) VI Input Clamp Voltage V CC e Min, I I eb 12 mA b1.5 V VOH High Level Output V CC e Min, I OH e Max 2.4 3.6 VVoltage V IL e Max, V IH e Min VOL Low Level Output V CC e Min, I OL e Max 0.2 0.4 VVoltage V IH e Min, V IL e Max II Input Current @ Max V CC e Max, V I e 5.5V 1m AInput Voltage IIH High Level Input V CC e Max E Input 60 mACurrent V I e 2.4V Others 40 IIL Low Level Input V CC e Max E Input b2.4 mACurrent V I e 0.4V Others b1.6 IOS Short Circuit V CC e Max MIL b30 b100 mAOutput Current (Note 3) COM b30 b100 ICC Supply Current V CC e Max 56 86 mA Note 1: The ADDRESS setup time is the time before the negative ENABLE transition that the ADDRESS must be stable so that the correct latch is addressed without affecting the other latches. Note 2: All typicals are at V CC e 5V, T A e 25§C. Note 3: Not more than one output should be shorted at a time, and the duration should not exceed one second. Note 4: TA e 25§C and V CC e 5V.

Switching Characteristics at V CC e 5V and T A e 25§C (See Section 1 for Test Waveforms and Output Load) Symbol Parameter From (Input) R L e 400X,C L e 15 pF UnitsTo (Output) Min Max tPLH Propagation Delay Time Enable to 28 nsLow to High Level Output Output, Fig. 1 tPHL Propagation Delay Time Enable to 27 nsHigh to Low Level Output Output, Fig. 1 tPLH Propagation Delay Time Data to 35 nsLow to High Level Output Output, Fig. 2 tPHL Propagation Delay Time Data to 28 nsHigh to Low Level Output Output, Fig. 2 tPLH Propagation Delay Time Address to 35 nsLow to High Level Output Output, Fig. 3 tPHL Propagation Delay Time Address to 35 nsHigh to Low Level Output Output, Fig. 3 tPHL Propagation Delay Time Clear to 31 nsHigh to Low Level Output Output, Fig. 5 Function Tables E C Mode L H Addressable Latch H H Memory L L Active High Eight Channel Demultiplexer H L Clear Inputs Present Output States Mode C E DA 0A 1A 2 Q 0 Q 1 Q 2 Q 3 Q 4Q 5 Q 6 Q 7 L H X X X X L L L L L L L L Clear LLL L L L L L L L L L L L L L H LLL H L L L LL L L LLL H L L L L L L L L L L LLH H L L L H L L L L L L L L H HHH L L L L L L L H H H X XXX Q Nb1 Memory H L L LLL L Q Nb1 QNb1 QNb1 HLH L L L H Q Nb1 QNb1 HLL H L L Q Nb1 LQ Nb1 HLH H L L Q Nb1 HQ Nb1 Addressable H L L HHH Q Nb1 QNb1 L HLH H H H Q Nb1 QNb1 H X e Don’t Care Condition L e Low Voltage Level H e High Voltage Level QNb1 e Previous Output State

Physical Dimensions inches (millimeters) 16-Lead Ceramic Dual-In-Line Package (J) Order Number 9334DMQB or DM9334J 16-Lead Molded Dual-In-Line Package (N) Order Number DM9334N

9334/DM9334 8-Bit Addressable Latch Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flat Package (W) Order Number 9334FMQB LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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