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Technical content

Features

n Very high voltage operation n Scalable output power n Minimum external components n External compensation n Thermal Shutdown and Mute

Applications

n High voltage industrial applications Typical Application and Connection Diagrams 20158319 FIGURE 1. Typical Audio Amplifier Application Circuit Overture® is a registered trademark of National Semiconductor Corporation.

FIGURE 1. Typical Audio Amplifier Application Circuit

Plastic Package (For B and C) (Note 13) 20158301 Top View Order Number LM4702BTA, LM4702CTA See NS Package Number TA15A LM4702 www.national.com3

Absolute Maximum Ratings (Notes 1, If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage |V +|+| V -| C Part 200V A, B Parts 200V Differential Input Voltage +/-6V Common Mode Input Range 0.4 Vee to 0.4 Vcc Power Dissipation (Note 3) 4W ESD Susceptibility (Note 4) 1.5kV ESD Susceptibility (Note 5) 200V Junction Temperature (T JMAX) (Note 9) 150˚C Soldering Information T Package (10 seconds) 260˚C Storage Temperature -40˚C to +150˚C Thermal Resistance θ JA 30˚C/W θJC 1˚C/W Operating Ratings (Notes 1, 2) Temperature Range TMIN ≤ TA ≤ TMAX −20˚C ≤ TA ≤ +75˚C Supply Voltage |V+|+| V -| LM4702A (in development) +/-20V ≤ VTOTAL ≤ +/-100V LM4702B +/-20V ≤ VTOTAL ≤ +/-100V LM4702C +/-20V ≤ VTOTAL ≤ +/-75V The following specifications apply for IMUTE = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25˚C. Symbol Parameter Conditions LM4702 Units (Limits)Typical Limit (Note 6) (Notes 7, 8) ICC Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 25 30 mA (max) THD+N Total Harmonic Distortion + Noise No load, AV = 30dB VOUT = 14VRMS @ 1kHz 0.005 % RS Input Bias Resistor 50 100 k Ω (max) Av Closed Loop Voltage Gain 26 dB (min) Av open Open Loop Gain Vin = 1mVrms , f = 1KHz, C = 30pF 93 dB Vom Output Voltage Swing THD = 0.05%, Freq = 20Hz to 20KHz 51 Vrms (min) Vnoise Output Noise Rs = 10kΩ, LPF = 30kHz, Av = 30dB A-weighted 150 300 µV (max) 90 µV I OUT Output Current Current from Source to Sink Pins 5.5 3 mA(min) mA (max) Imute Current into Mute Pin To put part in “play” mode 1.5 1 mA(min) mA (max) XTALK Channel Separation (Note 11) f = 1kHz @ Av = 30dB 85 dB SR Slew Rate VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted 15 V/µs VOS Input Offset Voltage V CM = 0V, IO = 0mA 10 35 mV (max) IB Input Bias Current V CM = 0V, IO = 0mA 500 nA PSRR Power Supply Rejection Ratio Rs = 1k, f = 100Hz, Vripple = 1Vrms, Input Referred 110 95 dB (min) The following specifications apply for IMUTE = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25˚C. Symbol Parameter Conditions LM4702 Units (Limits)Typical Limit (Note 6) (Notes 7, 8) ICC Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO =0 A 22 30 mA (max) THD+N Total Harmonic Distortion + Noise No load, AV = 30dB VOUT = 10VRMS @ 1kHz 0.005 % LM4702 www.national.com 4

2) (Continued) The following specifications apply for IMUTE = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25˚C. Symbol Parameter Conditions LM4702 Units (Limits)Typical Limit (Note 6) (Notes 7, 8) RS Input Bias Resistor 50 100 k Ω (max) Av Closed Loop Voltage Gain 26 dB (min) Av open Open Loop Gain Vin = 1mVrms , f = 1KHz, C = 30pF 93 dB Vom Output Voltage Swing THD = 0.05%, Freq = 20Hz to 20KHz 33 Vrms (min) Vnoise Output Noise Rs = 10kΩ, LPF = 30kHz, Av = 30dB A-weighted 150 300 µV (max) 90 µV I OUT Output Current Outputs Shorted 5.2 3 mA(min) mA (max) Imute Current into Mute Pin To put part in “play” mode 1.5 1 mA(min) mA (max) XTALK Channel Separation (Note 11) f = 1kHz at Av = 30dB 85 dB SR Slew Rate VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted 15 V/µs VOS Input Offset Voltage V CM = 0V, IO = 0mA 10 35 mV (max) IB Input Bias Current V CM = 0V, IO = 0mA 500 nA PSRR Power Supply Rejection Ratio Rs = 1k, f = 100Hz, Vripple = 1Vrms, Input Referred 110 95 dB (min) The following specifications apply for IMUTE = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25˚C. Symbol Parameter Conditions LM4702 Units (Limits)Typical Limit (Note 6) (Notes 7, 8) ICC Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 27 35 mA (max) THD+N Total Harmonic Distortion + Noise No load, AV = 30dB VOUT = 20VRMS @ 1kHz 0.0003 0.001 % (max) RS Input Bias Resistor 50 100 k Ω (max) Av Closed Loop Voltage Gain 26 dB (min) Av open Open Loop Gain Vin = 1mVrms , f = 1KHz, C = 30pF 93 dB Vom Output Voltage Swing THD = 0.05%, Freq = 20Hz to 20KHz 67 Vrms (min) Vnoise Output Noise Rs = 10kΩ, LPF = 30kHz, Av = 30dB A-weighted 150 300 µV (max)90 I OUT Output Current Outputs Shorted 5.5 3 mA(min) mA (max) Imute Current into Mute Pin To put part in “play” mode 1.5 1 mA(min) mA (max) XTALK Channel Separation (Note 11) f = 1kHz at Av = 30dB 87 85 dB (min) SR Slew Rate VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted 17 15 V/µs (min) VOS Input Offset Voltage V CM = 0V, IO = 0mA 14 40 mV (max) IB Input Bias Current V CM = 0V, IO = 0mA 200 nA (max) PSRR Power Supply Rejection Ratio Rs = 1k, f = 100Hz, Vripple = 1Vrms, Input Referred 110 100 dB (min) LM4702 www.national.com5

(Pre-release information) (Notes 1, 2) The following specifications apply for IMUTE = 1.5mA, Figure 1, unless otherwise specified. Limits apply for TA = 25˚C. Symbol Parameter Conditions LM4702 Units (Limits)Typical Limit (Note 6) (Notes 7, 8) ICC Total Quiescent Power Supply Current VCM = 0V, VO = 0V, IO = 0A 27 TBD mA (max) THD+N Total Harmonic Distortion + Noise No load, AV = 30dB VOUT = 20VRMS f = 1kHz 0.001 TBD % (max)f = 10kHz TBD TBD f = 100Hz TBD TBD RS Input Bias Resistor 50 TBD k Ω (max) Av Closed Loop Voltage Gain TBD dB (min) Av open Open Loop Gain Vin = 1mVrms , f = 1KHz, C = 30pF 93 dB Vom Output Voltage Swing THD = 0.05%, Freq = 20Hz to 20KHz 57 TBD Vrms (min) Vnoise Output Noise Rs = 10kΩ, LPF = 30kHz, Av = 30dB A-weighted 100 TBD TBD µV (max) I OUT Output Current Outputs Shorted 5.5 TBD TBD mA(min) mA (max) Imute Current into Mute Pin To put part in “play” mode 1.5 TBD TBD mA(min) mA (max) XTALK Channel Separation (Note 11) Av = 30dB f = 1kHz 90 TBD dB (min)f = 10kHz TBD TBD f = 100Hz TBD TBD SR Slew Rate VIN = 1.2VP-P, f = 10kHz square Wave, Outputs shorted TBD TBD V/µs (min) VOS Input Offset Voltage V CM = 0V, IO = 0mA 5 TBD mV (max) IB Input Bias Current V CM = 0V, IO = 0mA 150 TBD nA (max) PSRR Power Supply Rejection Ratio Rs = 1k, f = 100Hz, Vripple = 1Vrms, Input Referred 110 TBD dB (min) IMD Intermodulation Distortion at 20kHz / 19kHz at 60Hz / 7kHz TBD TBD dB Note 1: All voltages are measured with respect to the ground pins, unless otherwise specified. Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test condition which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit is given. However, the typical value is a good indication of device’s performance. Note 3: The maximum power dissipation must be de-rated at elevated temperatures and is dictated by TJMAX, θJC, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX =( TJMAX -TA)/θJC or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4702, TJMAX = 150˚C and the typicalθJC is 1˚C/W. Refer to theThermal Considerations section for more information. Note 4: Human body model, 100pF discharged through a 1.5kΩ resistor. Note 5: Machine Model: a 220pF - 240pF discharged through all pins. Note 6: Typical specifications are measured at 25˚C and represent the parametric norm. Note 7: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Note 9: The maximum operating junction temperature is 150˚C. Note 10: PCB layout will affect cross talk. It is recommended that input and output traces be separated by as much distance as possible. Return ground traces from outputs should be independent back to a single ground point and use as wide of traces as possible. Note 11: The TA15A is a non-isolated package. The package’s metal back and any heat sink to which it is mounted are connected to the Vee potential when using only thermal compound. If a mica washer is used in addition to thermal compound,θCS (case to sink) is increased, but the heat sink will be electrically isolated from Vee. LM4702 www.national.com 6

Typical Performance Characteristics for LM4702C THD+N vs Output Voltage VDD = ±50V, f = 1kHz, outputs shorted THD+N vs Output Voltage VDD = ±75V, f = 1kHz, outputs shorted 20158308 20158338 THD+N vs Frequency VDD = ±50V, VOUT = 10Vrms, outputs shorted THD+N vs Frequency VDD = ±75V, VOUT = 14Vrms, outputs shorted 20158310 20158339 Crosstalk vs Frequency VDD = ±50V Crosstalk vs Frequency VDD = ±75V 20158335 20158336 LM4702 www.national.com7

Typical Performance Characteristics for LM4702C (Continued) +PSRR vs Frequency VDD = ±50V, RS =1 kΩ, Ripple on V CC −PSRR vs Frequency VDD = ±50V, RS =1 kΩ, Ripple on V ee 20158331 20158333 +PSRR vs Frequency VDD = ±75V, RS =1 kΩ, Ripple on V CC −PSRR vs Frequency VDD = ±75V, RS =1 kΩ, Ripple on V ee 20158332 20158334 Open Loop and Phase Upper-Phase, Lower-Gain 20158337 LM4702 www.national.com 8

Typical Performance Characteristics for LM4702B THD+N vs Output Voltage VDD = 100V THD+N vs Frequency VDD = 100V, VOUT = 30VRMS 20158341 20158340 PSRR vs Frequency VDD = 100V XTALK vs Frequency B grade Demo Amp @ VDD = 50V 20158343 20158342 LM4702 www.national.com9

FIGURE 1. LM4702 www.national.com 10

Application Information

The mute function of the LM4702 is controlled by the amount of current that flows into the mute pin. If there is less than 1mA of current flowing into the mute pin, the part will be in mute. This can be achieved by shorting the mute pin to ground or by floating the mute pin. If there is between 1mA and 2mA of current flowing into the mute pin, the part will be in “play” mode. This can be done by connecting a power supply (Vmute) to the mute pin through a resistor (Rm). The current into the mute pin can be determined by the equation Imute = (Vmute – 2.9) / Rm. For example, if a 5V power supply is connected through a 1.4k resistor to the mute pin, then the mute current will be 1.5mA, at the center of the specified range. It is also possible to use Vcc as the power supply for the mute pin, though Rm will have to be recalcu- lated accordingly. It is not recommended to flow more than 2mA of current into the mute pin because damage to the LM4702 may occur. It is highly recommended to switch between mute and “play” modes rapidly. This is accomplished most easily through using a toggle switch that alternatively connects the mute pin through a resistor to either ground or the mute pin power supply. Slowly increasing the mute current may result in undesired voltages on the outputs of the LM4702, which can damage an attached speaker. THERMAL PROTECTION The LM4702 has a sophisticated thermal protection scheme to prevent long-term thermal stress of the device. When the temperature on the die exceeds 150˚C, the LM4702 shuts down. It starts operating again when the die temperature drops to about 145˚C, but if the temperature again begins to rise, shutdown will occur again above 150˚C. Therefore, the device is allowed to heat up to a relatively high temperature if the fault condition is temporary, but a sustained fault will cause the device to cycle in a Schmitt Trigger fashion be- tween the thermal shutdown temperature limits of 150˚C and 145˚C. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions. Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen so that thermal shutdown is not activated during normal operation. Using the best heat sink possible within the cost and space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink section. POWER DISSIPATION AND HEAT SINKING When in “play” mode, the LM4702 draws a constant amount of current, regardless of the input signal amplitude. Conse- quently, the power dissipation is constant for a given supply voltage and can be computed with the equation P DMAX = Icc * (Vcc – Vee). For a quick calculation of PDMAX, approximate the current to be 25mA and multiply it by the total supply voltage (the current varies slightly from this value over the operating range). DETERMINING THE CORRECT HEAT SINK The choice of a heat sink for a high-power audio amplifier is made entirely to keep the die temperature at a level such that the thermal protection circuitry is not activated under normal circumstances. The thermal resistance from the die to the outside air,θ JA (junction to ambient), is a combination of three thermal re- sistances, θJC (junction to case),θCS (case to sink), andθSA (sink to ambient). The thermal resistance,θJC (junction to case), of the LM4702T is 0.8˚C/W. Using Thermalloy Ther- macote thermal compound, the thermal resistance, θ CS (case to sink), is about 0.2˚C/W. Since convection heat flow (power dissipation) is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM4702 is equal to the following: P DMAX =( TJMAX−TAMB)/ θJA (1) where TJMAX = 150˚C, TAMB is the system ambient tempera- ture and θJA = θJC + θCS + θSA. 20158355 Once the maximum package power dissipation has been calculated using equation 2, the maximum thermal resis- tance, θ SA, (heat sink to ambient) in ˚C/W for a heat sink can be calculated. This calculation is made using equation 4 which is derived by solving forθ SA in equation 3. θSA = [(TJMAX−TAMB)−PDMAX(θJC +θCS) ]/P DMAX (2) Again it must be noted that the value ofθSA is dependent upon the system designer’s amplifier requirements. If the ambient temperature that the audio amplifier is to be working under is higher than 25˚C, then the thermal resistance for the heat sink, given all other things are equal, will need to be smaller. PROPER SELECTION OF EXTERNAL COMPONENTS Proper selection of external components is required to meet the design targets of an application. The choice of external component values that will affect gain and low frequency response are discussed below. The gain of each amplifier is set by resistors R f and Ri for the non-inverting configuration shown in Figure 1. The gain is found by Equation (3)below: A V =1+R f /R i (V/V) (3) For best noise performance, lower values of resistors are used. A value of 1kΩ is commonly used for Ri and then setting the value of Rf for the desired gain. For the LM4702 the gain should be set no lower than 26dB. Gain settings below 26dB may experience instability. The combination of R i with Ci (see Figure 1) creates a high pass filter. The low frequency response is determined by these two components. The -3dB point can be found from Equation (4)shown below: f i =1/( 2 πRiCi) (Hz) (4) If an input coupling capacitor is used to block DC from the inputs as shown in Figure 5, there will be another high pass filter created with the combination of C IN and RIN. When using a input coupling capacitor RIN is needed to set the DC LM4702 www.national.com11

Application Information (Continued) bias point on the amplifier’s input terminal. The resulting -3dB frequency response due to the combination of CIN and RIN can be found fromEquation (5)shown below: fIN =1/( 2 πRINCIN) (Hz) (5) With large values of RIN oscillations may be observed on the outputs when the inputs are left floating. Decreasing the value of R IN or not letting the inputs float will remove the oscillations. If the value of RIN is decreased then the value of CIN will need to increase in order to maintain the same -3dB frequency response. AVOIDING THERMAL RUNAWAY WHEN USING BIPOLAR OUTPUT STAGES When using a bipolar output stage with the LM4702 (as in Figure 1), the designer must beware of thermal runaway. Thermal runaway is a result of the temperature dependence of Vbe (an inherent property of the transistor). As tempera- ture increases, Vbe decreases. In practice, current flowing through a bipolar transistor heats up the transistor, which lowers the Vbe. This in turn increases the current again, and the cycle repeats. If the system is not designed properly, this positive feedback mechanism can destroy the bipolar tran- sistors used in the output stage. One of the recommended methods of preventing thermal runaway is to use a heat sink on the bipolar output transis- tors. This will keep the temperature of the transistors lower. A second recommended method is to use emitter degenera- tion resistors (see Re1, Re2, Re3, Re4 in Figure 1). As current increases, the voltage across the emitter degenera- tion resistor also increases, which decreases the voltage across the base and emitter. This mechanism helps to limit the current and counteracts thermal runaway. A third recommended method is to use a “Vbe multiplier” to bias the bipolar output stage (see Figure 1). The Vbe multi- plier consists of a bipolar transistor (Qmult, see Figure 1) and two resistors, one from the base to the collector (Rb2, Rb4, see Figure 1) and one from the base to the emitter (Rb1, Rb3, see Figure 1). The voltage from the collector to the emitter (also the bias voltage of the output stage) is Vbias = Vbe(1+Rb2/Rb1), which is why this circuit is called the Vbe multiplier. When Vbe multiplier transistor (Qmult, see Figure 1) is mounted to the same heat sink as the bipolar output transistors, its temperature will track that of the output transistors. Its Vbe is dependent upon temperature as well, and so it will draw more current as the output transistors heat it up. This will limit the base current into the output transis- tors, which counteracts thermal runaway. LM4702 www.national.com 12

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LM4702 Demo Board Artwork (Continued) Bottom Layer 20158328 LM4702 www.national.com 14

Revision History

1.0 8/31/05 Initial WEB. 1.1 9/09/05 Taken out Limits on Vom (under the +75V and +50V). 1.2 9/14/05 Changed TM t o R ( Overture R) in the doc title. 1.3 03/08/06 Text edits. 1.4 04/26/04 Edited Limit values on the LM4702B spec table. 1.5 08/09/06 Released the D/S to the WEB with the LM4702B data. 1.6 09/19/06 Removed the “Overture R” from the document title, then released the D/S to the WEB LM4702 www.national.com15

Physical Dimensions inches (millimeters) unless otherwise noted Non-Isolated TO-220 15-Lead Package Order Number LM4702BTA, LM4702CTA National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor follows the provisions of the Product Stewardship Guide for Customers (CSP-9-111C2) and Banned Substances and Materials of Interest Specification (CSP-9-111S2) for regulatory environmental compliance. Details may be found at: www.national.com/quality/green. Lead free products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com LM4702 Stereo High Fidelity 200 Volt Driver with Mute