89HPES16T4G2

89HPES16T4G2 RENESAS | Alldatasheet

Document overview

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Technical content

Features

◆ High Performance PCI Express Switch – Sixteen 5 Gbps Gen2 PCI Express lanes – Four switch ports

• One x4 upstream port
• Three x4 downstream ports – Low latency cut-through switch architecture – Support for Max Payload Size up to 2048 bytes – One virtual channel – Eight traffic classes – PCI Express Base Specification Revision 2.0 compliant ◆ Flexible Architecture with Numerous Configuration Options – Automatic per port link width negotiation to x4, x2 or x1 – Automatic lane reversal on all ports – Automatic polarity inversion – Ability to load device conf iguration from serial EEPROM ◆ Legacy Support – PCI compatible INTx emulation – Bus locking ◆ Highly Integrated Solution – Incorporates on-chip internal memory for packet buffering and queueing – Integrates sixteen 5 Gbps embedded SerDes with 8b/10b encoder/decoder (no separate transceivers needed)
• Receive equalization (RxEQ) ◆ Reliability, Availability, and Serviceability (RAS) Features – Internal end-to-end parity protecti on on all TLPs ensures data integrity even in systems t hat do not implement end-to-end CRC (ECRC) – Supports ECRC and Advanced Error Reporting – Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O – Compatible with Hot-Plug I/O expanders used on PC mother- boards – Supports Hot-Swap Block Diagram Figure 1 Internal Block Diagram 4-Port Switch Core / 16 PCI Express Lanes Frame Buffer Route Table Port Arbitration Scheduler SerDes Phy Logical Layer Multiplexer / Demultiplexer Transaction Layer Data Link Layer Multiplexer / Demultiplexer Transaction Layer Data Link Layer Multiplexer / Demultiplexer Transaction Layer Data Link Layer (Port 0) (Port 2) (Port 6) Multiplexer / Demultiplexer Transaction Layer Data Link Layer (Port 4) SerDes Phy Logical Layer SerDes Phy Logical Layer SerDes Phy Logical Layer 89HPES16T4G2 Data Sheet 16-Lane 4-Port Gen2 PCI Express® Switch

2 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet ◆ Power Management – Utilizes advanced low-power design techniques to achieve low typical power consumption – Support PCI Express Power Management Interface specifica- tion (PCI-PM 1.2) – Supports PCI Express Active State Power Management (ASPM) link state – Supports PCI Express Power Budgeting Capability – Supports the optional PCI Express SerDes Transmit Low- Swing Voltage Mode – Unused SerDes are disabled and can be powered-off. ◆ Testability and Debug Features – Built in Pseudo-Random Bi t Stream (PRBS) generator – Numerous SerDes test modes – Ability to read and write any in ternal register via the SMBus – Ability to bypass link training and force any link into any mode – Provides statistics and performance counters ◆ Sixteen General Purpose Input/Output Pins – Each pin may be individually co nfigured as an input or output – Each pin may be individually co nfigured as an interrupt input – Some pins have selectable alternate functions ◆ Packaged in a 23mm x 23mm, 288-ball BGA with 1mm ball spacing Pr oduct Description Utilizing standard PCI Express interconnect, the PES16T4G2 provides the most efficient fan-out solution for applications requiring high throughput, low latency, and simple board layout with a minimum number of board layers. It provides 16 GBps (128 Gbps) of aggregated, full-duplex switching capacity through 16 integrated serial lanes, using proven and robust IDT technology. Each lane provides 5 Gbps of band- width in both directions and is fully compliant with PCI Express Base Specification, Revision 2.0. The PES16T4G2 is based on a flexible and efficient layered architec- ture. The PCI Express layer consists of SerDes, Physical, Data Link and Transaction layers in compliance with PCI Express Base specification forward or cut-through switch and is designed to switch memory and I/O transactions. It supports eight Tr affic Classes (TCs) and one Virtual Channel (VC) with sophisticated re source management to enable effi- cient switching and I/O connectivity for servers, storage, and embedded processors with limited connectivity. Figure 2 I/O Expansion Application SMBus Interface The PES16T4G2 contains two SMBus interfaces. The slave inter- face provides full access to the configuration registers in the PES16T4G2, allowing every configurat ion register in the device to be read or written by an external agen t. The master interface allows the default configuration register val ues of the PES16T4G2 to be over- ridden following a reset with values programmed in an external serial EEPROM. The master interface is also used by an external Hot-Plug I/O expander. Six pins make up each of the two SMBus interfaces. These pins consist of an SMBus clock pin, an SMBus data pin, and 4 SMBus address pins. In the slave interfac e, these address pins allow the SMBus address to which the device re sponds to be configured. In the master interface, these address pins allow the SMBus address of the serial configuration EEPROM from which data is loaded to be config- ured. The SMBus address is set up on negation of PERSTN by sampling the corresponding address pi ns. When the pins are sampled, the resulting address is assigned as shown in Table 1. Bit Slave SMBus Address Master SMBus Address

1 SSMBADDR[1] MSMBADDR[1]

2 SSMBADDR[2] MSMBADDR[2]

3 SSMBADDR[3] MSMBADDR[3]

4 0 MSMBADDR[4]

5 SSMBADDR[5] 1

Table 1 Master and Slave SMBus Address Assignment MemoryMemoryMemory Processor MemoryNorth Bridge PES16T4G2 I/O 10GbE I/O 10GbE I/O SATA I/O SATAPCI Express Slot Processor x4 x4 x4

3 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet As shown in Figure 3, the master and slave SMBuses may be used in a unified or split configuration. In the unified configuration, shown in Figure 3(a), the master and slave SMBuses are tied together and the PES16T4G2 acts both as a SMBu s master as well as a SMBus slave on this bus. This requires that the SMBus master or processor that has access to PES16T4G2 registers supports SMBus arbitration. In some systems, this SMBus master interface may be implemented using general purpose I/O pins on a processor or micro controller, and may not support SMBu s arbitration. To support these systems, the PES16T4G2 may be configured to operate in a split configuration as shown in Figure 3(b). In the split configuration, the master and slave SMBuses oper ate as two independent buses and thus multi-master arbitration is never required. The PES16T4G2 supports reading and writing of the serial EEPROM on the master SMBus via the slave SMBus, allowing in system pro gramming of the serial EEPROM. Figure 3 SMBus Interface Configuration Examples Hot-Plug Interface The PES16T4G2 supports PCI Express Hot-Plug on each downstream port. To reduce the number of pins required on the device, the PES16T4G2 utilizes an external I/O expander, such as that used on PC motherboards, connected to the SMBus mast er interface. Following reset and configura- tion, whenever the state of a Hot-Plug output needs to be modified, the PES16T4G2 generat es an SMBus transaction to the I/O exp ander with the new value of all of the outputs. Whenever a Hot-Plug input c hanges, the I/O expander generates an interrupt which is received o n the IOEXPINTN input pin (alternate function of GPIO) of the PES16T4G2. In response to an I/O expander interrupt, the PES16T4G2 generates an SMBus transaction to read the state of all of the Hot-Plug inputs from the I/O expander. General Purpose Input/Output The PES16T4G2 provides 16 General Purpose Input/Output (GPIO) pins that may be used by the system designer as bit I/O ports. Each GPIO pin may be configured independently as an input or output through software control. Some GPIO pins are shared with other on-chip fu nctions. These alternate functions may be enabled via software, SMBus slave interface, or serial configuration EEPROM. Processor PES16T4G2 SSMBCLK SSMBDAT MSMBCLK MSMBDAT SMBus Master Other SMBus Devices Serial EEPROM Processor PES16T4G2 SSMBCLK SSMBDAT MSMBCLK MSMBDAT SMBus Master Other SMBus Devices Serial EEPROM (a) Unified Configuration and Management Bus (b) Split Configuration and Man agement Buses

4 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Pin Description The following tables list the functions of the pins provided on the PES16T4G2. Some of the functions listed may be multiplexed onto the same pin. The active polarity of a signal is defined using a suffix. Signals ending with an “N” are defined as being active, or asserted, when at a logic zero (low) level. All other signals (including clocks, buses, and select lines) will be interpreted as being active, or asserted, when at a logic one (high) level. Note: In the PES16T4G2, the three downstream ports are labeled port 2, port 4, and port 6. Signal Type Name/Description PE0RP[3:0] PE0RN[3:0] I PCI Express Port 0 Serial Data Receive. Differential PCI Express receive pairs for port 0. Port 0 is the upstream port. PE0TP[3:0] PE0TN[3:0] O PCI Express Port 0 Serial Data Transmit. Differential PCI Express trans- mit pairs for port 0. Port 0 is the upstream port. PE2RP[3:0] PE2RN[3:0] I PCI Express Port 2 Serial Data Receive. Differential PCI Express receive pairs for port 2. PE2TP[3:0] PE2TN[3:0] O PCI Express Port 2 Serial Data Transmit. Differential PCI Express trans- mit pairs for port 2. PE4RP[3:0] PE4RN[3:0] I PCI Express Port 4 Serial Data Receive. Differential PCI Express receive pairs for port 4. PE4TP[3:0] PE4TN[3:0] O PCI Express Port 4 Serial Data Transmit. Differential PCI Express trans- mit pairs for port 4. PE6RP[3:0] PE6RN[3:0] I PCI Express Port 6 Serial Data Receive. Differential PCI Express receive pairs for port 6. PE6TP[3:0] PE6TN[3:0] O PCI Express Port 6 Serial Data Transmit. Differential PCI Express trans- mit pairs for port 6. PEREFCLKP[0] PEREFCLKN[0] I PCI Express Reference Clock. Differential reference clock pair input. This clock is used as the reference clock by on-chip PLLs to generate the clocks required for the system logic and on-chip SerDes. The frequency of the dif- ferential reference clock is determined by the REFCLKM signal. REFCLKM I PCI Express Reference Clock Mode Select. This signal selects the fre- quency of the reference clock input. 0x0 - 100 MHz 0x1 - 125 MHz This pin should be static and not change following the negation of PERSTN. Table 2 PCI Express Interface Pins Signal Type Name/Description MSMBADDR[4:1] I Master SMBus Address. These pins determine the SMBus address of the serial EEPROM from which configuration information is loaded. MSMBCLK I/O Master SMBus Clock. This bidirectional signal is used to synchronize transfers on the master SMBus. MSMBDAT I/O Master SMBus Data. This bidirectional signal is used for data on the mas- ter SMBus. Table 3 SMBus Interface Pins (Part 1 of 2)

5 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet SSMBADDR[5,3:1] I Slave SMBus Address. These pins determine the SMBus address to which the slave SMBus interface responds. SSMBCLK I/O Slave SMBus Clock. This bidirectional signal is used to synchronize trans- fers on the slave SMBus. SSMBDAT I/O Slave SMBus Data. This bidirectional signal is used for data on the slave SMBus. Signal Type Name/Description GPIO[0] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: P2RSTN Alternate function pin type: Output Alternate function: Reset output for downstream port 2. GPIO[1] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: P4RSTN Alternate function pin type: Output Alternate function: Reset output for downstream port 4. GPIO[2] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: IOEXPINTN0 Alternate function pin type: Input Alternate function: I/O expander interrupt 0 input. GPIO[3] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[4] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: IOEXPINTN2 Alternate function pin type: Input Alternate function: I/O Expander interrupt 2 input GPIO[5] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[6] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[7] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: GPEN Alternate function pin type: Output Alternate function: General Purpose Event (GPE) output GPIO[8] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[9] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[10] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Table 4 General Purpose I/O Pins (Part 1 of 2) Signal Type Name/Description Table 3 SMBus Interface Pins (Part 2 of 2)

6 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet GPIO[11] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Alternate function pin name: P6RSTN Alternate function pin type: Output Alternate function: Reset output for downstream port 6. GPIO[12] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[13] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[14] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. GPIO[15] I/O General Purpose I/O. This pin can be configured as a general purpose I/O pin. Signal Type Name/Description CCLKDS I Common Clock Downstream. The assertion of this pin indicates that all downstream ports are using the same clock source as that provided to downstream devices.This bit is used as the initial value of the Slot Clock Configuration bit in all of the Link Status Registers for downstream ports. The value may be overridden by modifying the SCLK bit in each down- stream port’s PCIELSTS register. CCLKUS I Common Clock Upstream. The assertion of this pin indicates that the upstream port is using the same clock source as the upstream device. This bit is used as the initial value of the Slot Clock Configuration bit in the Link Status Register for the upstream port. The value may be overridden by modifying the SCLK bit in the P0_PCIELSTS register. MSMBSMODE I Master SMBus Slow Mode. The assertion of this pin indicates that the master SMBus should operate at 100 KHz instead of 400 KHz. This value may not be overridden. PERSTN I Fundamental Reset. Assertion of this signal resets all logic inside PES16T4G2 and initiates a PCI Express fundamental reset. RSTHALT I Reset Halt. When this signal is asserted during a PCI Express fundamental reset, PES16T4G2 executes the reset procedure and remains in a reset state with the Master and Slave SMBuses active. This allows software to read and write registers internal to the device before normal device opera- tion begins. The device exits the reset state when the RSTHALT bit is cleared in the SWCTL register by an SMBus master. SWMODE[2:0] I Switch Mode. These configuration pins determine the PES16T4G2 switch operating mode. 0x0 - Normal switch mode 0x1 - Normal switch mode with Serial EEPROM initialization 0x2 - through 0x7 Reserved These pins should be static and not change following the negation of PERSTN. Table 5 System Pins Signal Type Name/Description Table 4 General Purpose I/O Pins (Part 2 of 2)

7 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Signal Type Name/Description JTAG_TCK I JTAG Clock. This is an input test clock used to clock the shifting of data into or out of the boundary scan logic or JTAG Controller. JTAG_TCK is independent of the system clock with a nominal 50% duty cycle. JTAG_TDI I JTAG Data Input. This is the serial data input to the boundary scan logic or JTAG Controller. JTAG_TDO O JTAG Data Output. This is the serial data shifted out from the boundary scan logic or JTAG Controller. When no data is being shifted out, this signal is tri-stated. JTAG_TMS I JTAG Mode. The value on this signal controls the test mode select of the boundary scan logic or JTAG Controller. JTAG_TRST_N I JTAG Reset. This active low signal asynchronously resets the boundary scan logic and JTAG TAP Controller. An external pull-up on the board is recommended to meet the JTAG specification in cases where the tester can access this signal. However, for systems running in functional mode, one of the following should occur: 1) actively drive this signal low with control logic 2) statically drive this signal low with an external pull-down on the board Table 6 Test Pins Signal Type Name/Description REFRES0 I/O Port 0 External Reference Resistor. Provides a reference for the Port 0 SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resis- tor should be connected from this pin to ground. REFRES2 I/O Port 2 External Reference Resistor. Provides a reference for the Port 2 SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resis- tor should be connected from this pin to ground. REFRES4 I/O Port 4 External Reference Resistor. Provides a reference for the Port 4 SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resis- tor should be connected from this pin to ground. REFRES6 I/O Port 6 External Reference Resistor. Provides a reference for the Port 6 SerDes bias currents and PLL calibration circuitry. A 3 kOhm +/- 1% resis- tor should be connected from this pin to ground. V DDCORE I Core VDD. Power supply for core logic. VDDI/O I I/O VDD. LVTTL I/O buffer power supply. VDDPEA I PCI Express Analog Power. Serdes analog power supply (1.0V). VDDPEHA I PCI Express Analog High Power. Serdes analog power supply (2.5V). VDDPETA I PCI Express Transmitter Analog Voltage. Serdes transmitter analog power supply (1.0V). VSS I Ground. Table 7 Power, Ground, and SerDes Resistor Pins

8 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Pin Characteristics Note: Some input pads of the PES16T4G2 do not contain internal pull-ups or pull-downs. Unused inputs should be tied off to appropriate levels. This is especially critical for unused control signal inputs which, if left floating, could adversely affect operation. Also, any input pin left floating can cause a slight increase in power consumption. Function Pin Name Type Buffer I/O Type Internal Resistor1 Notes PCI Express Inter- face PE0RN[3:0] I PCIe differential2 Serial Link PE0RP[3:0] I PE0TN[3:0] O PE0TP[3:0] O PE2RN[3:0] I PE2RP[3:0] I PE2TN[3:0] O PE2TP[3:0] O PE4RN[3:0] I PE4RP[3:0] I PE4TN[3:0] O PE4TP[3:0] O PE6RN[3:0] I PE6RP[3:0] I PE6TN[3:0] O PE6TP[3:0] O PEREFCLKN[0] I HCSL Diff. Clock Input Refer to Table 9 PEREFCLKP[0] I REFCLKM I LVTTL Input pull-down SMBus MSMBADDR[4:1] I LVTTL Input pull-up MSMBCLK I/O STI 3 pull-up on board MSMBDAT I/O STI pull-up on board SSMBADDR[5,3:1] I Input pull-up SSMBCLK I/O STI pull-up on board SSMBDAT I/O STI pull-up on board General Purpose I/O GPIO[15:0] I/O LVTTL STI, High Drive pull-up System Pins CCLKDS I LVTTL Input pull-up CCLKUS I Input pull-up MSMBSMODE I Input pull-down PERSTN I STI RSTHALT I Input pull-down SWMODE[2:0] I Input pull-down Table 8 Pin Characteristics (Part 1 of 2)

9 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet EJTAG / JTAG JTAG_TCK I LVTTL STI pull-up JTAG_TDI I STI pull-up JTAG_TDO O JTAG_TMS I STI pull-up JTAG_TRST_N I STI pull-up SerDes Reference Resistors REFRES0 I/O Analog REFRES2 I/O REFRES4 I/O REFRES6 I/O 1. Internal resistor values under typical operating conditions are 92K Ω for pull-up and 90K Ω for pull-down. 2. All receiver pins set the DC common mode voltage to ground. All transmitters must be AC coupled to the media. 3. Schmitt Trigger Input (STI). Function Pin Name Type Buffer I/O Type Internal Resistor1 Notes Table 8 Pin Characteristics (Part 2 of 2)

10 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Logic Diagram — PES16T4G2 Figure 4 PES16T4G2 Logic Diagram PE0TP[0] Reference Clocks PEREFCLKP[0] PEREFCLKN[0] JTAG_TCK GPIO[15:0]

16 General Purpose

MSMBADDR[4:1] MSMBCLK MSMBDAT SSMBADDR[5,3:1] SSMBCLK SSMBDAT Master SMBus Interface Slave SMBus Interface CCLKUS RSTHALTSystem Pins JTAG_TDI JTAG_TDO JTAG_TMS JTAG_TRST_N JTAG Pins VSS SWMODE[2:0] CCLKDS PERSTN REFCLKM MSMBSMODE PE0RP[0] PE0RN[0] PE0RP[3] PE0RN[3] PCI Express Switch SerDes Input PE0TN[0] PE0TP[3] PE0TN[3] PCI Express Switch SerDes Output ... Port 0 Port 0 ... PE2RP[0] PE2RN[0] PE2RP[3] PE2RN[3] PCI Express Switch SerDes Input PE2TP[0] PE2TN[0] PE2TP[3] PE2TN[3] PCI Express Switch SerDes Output ... Port 2 Port 2 ... PE4RP[0] PE4RN[0] PE4RP[3] PE4RN[3] PCI Express Switch SerDes Input PE4TP[0] PE4TN[0] PE4TP[3] PE4TN[3] PCI Express Switch SerDes Output ... Port 4 Port 4 ... PE6RP[0] PE6RN[0] PE6RP[3] PE6RN[3] PCI Express Switch SerDes Input PE6TP[0] PE6TN[0] PE6TP[3] PE6TN[3] PCI Express Switch SerDes Output ... Port 6 Port 6 ... PES16T4G2 REFRES0 SerDes Reference Resistors REFRES2 REFRES4 REFRES6 VDDPEHA Reference Clock Frequency Selection VDDPETA

11 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet System Clock Parameters Values based on systems running at recommended supply voltages and operating temperatures, as shown in Tables 13 and 15. AC Timing Characteristics Parameter Description Condition Min Typical Max Unit RefclkFREQ Input reference clock frequency range 100 125 1 1. The input clock frequency will be either 100 or 125 MHz depending on signal REFCLKM. MHz TC-RISE Rising edge rate Differential 0.6 4 V/ns TC-FALL Falling edge rate Differential 0.6 4 V/ns VIH Differential input high voltage Differential +150 mV VIL Differential input low voltage Differential -150 mV voltage Single-ended +250 +550 mV VCROSS-DELTA Variation of VCROSS over all rising clock edges Single-ended +140 mV VRB Ring back voltage margin Differential -100 +100 mV TSTABLE Time before VRB is allowed Differential 500 ps TPERIOD-AVG Average clock period accuracy -300 2800 ppm trum and jitter 9.847 10.203 ns TCC-JITTER Cycle to cycle jitter 150 ps Duty Cycle Duty cycle 40 60 % Rise/Fall Matching Single ended rising Refclk edge rate ver- sus falling Refclk edge rate 20 % Z C-DC Clock source output DC impedance 40 60 Ω Table 9 Input Clock Requirements Parameter Description Gen 1 Gen 2 Units Min1 Typ1 Max1 Min1 Typ1 Max1 PCIe Transmit UI Unit Interval 399.88 400 400.12 199.94 200 200.06 ps T TX-EYE Minimum Tx Eye Width 0.75 0.75 UI TTX-EYE-MEDIAN-to- MAX-JITTER Maximum time between the jitter median and maximum deviation from the median 0.125 UI TTX-RISE, TTX-FALL TX Rise/Fall Time: 20% - 80% 0.125 0.15 UI TTX- IDLE-MIN Minimum time in idle 20 20 UI Table 10 PCIe AC Timing Characteristics (Part 1 of 2)

12 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet TTX-IDLE-SET-TO-IDLE Maximum time to transition to a valid Idle after sending an Idle ordered set 88 n s TTX-IDLE-TO-DIFF- DATA Maximum time to transition from valid idle to diff data 8 8 ns TTX-SKEW Transmitter data skew between any 2 lanes 1.3 1.3 ns TMIN-PULSED Minimum Instantaneous Lone Pulse Width NA 0.9 UI TTX-HF-DJ-DD Transmitter Deterministic Jitter > 1.5MHz Bandwidth NA 0.15 UI TRF-MISMATCH Rise/Fall Time Differential Mismatch NA 0.1 UI PCIe Receive UI Unit Interval 399.88 400 400.12 199.94 200.06 ps T RX-EYE (with jitter) Minimum Receiver Eye Width (jitter tolerance) 0.4 0.4 UI TRX-EYE-MEDIUM TO MAX JITTER Max time between jitter median & max deviation 0.3 UI TRX-SKEW Lane to lane input skew 20 8 ns TRX-HF-RMS 1.5 — 100 MHz RMS jitter (common clock) NA 3.4 ps TRX-HF-DJ-DD Maximum tolerable DJ by the receiver (common clock) NA 88 ps TRX-LF-RMS 10 KHz to 1.5 MHz RMS jitter (common clock) NA 4.2 ps TRX-MIN-PULSE Minimum receiver instantaneous eye width NA 0.6 UI 1. Minimum, Typical, and Maximum values meet the requirements under PCI Specification 2.0 Signal Symbol Reference Edge Min Max Unit Timing Diagram Reference GPIO GPIO[15:0]1 1. GPIO signals must meet the setup and hold times if they are synchronous or the minimum pulse width if they are asynchronous. Tpw2 2. The values for this symbol were determined by calculation, not by testing. None 50 — ns Table 11 GPIO AC Timing Characteristics Parameter Description Gen 1 Gen 2 Units Min1 Typ1 Max1 Min1 Typ1 Max1 Table 10 PCIe AC Timing Characteristics (Part 2 of 2)

13 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Figure 5 JTAG AC Timing Waveform Signal Symbol Reference Edge Min Max Unit Timing Diagram Reference JTAG JTAG_TCK Tper_16a none 50.0 — ns See Figure 5. Thigh_16a, Tlow_16a 10.0 25.0 ns JTAG_TMS1, JTAG_TDI 1. The JTAG specification, IEEE 1149.1, reco mmends that JTAG_TMS should be held at 1 while the signal applied at JTAG_TRST_N changes from 0 to 1. Otherwise, a race may occur if JTAG_TRST_N is deasserted (going from low to high) on a rising edge of JTAG_TCK when JTAG_TMS is low, because the TAP controller might go to either the Run-Test/Idle state or stay in the Test-Logic-Reset state. Tsu_16b JTAG_TCK rising 2.4 — ns Thld_16b 1.0 — ns JTAG_TDO Tdo_16c JTAG_TCK falling — 20 ns Tdz_16c2 2. The values for this symbol were determined by calculation, not by testing. —2 0n s JTAG_TRST_N Tpw_16d 2 none 25.0 — ns Table 12 JTAG AC Timing Characteristics Tpw_16d Tdz_16cTdo_16c Thld_16b Tsu_16b Thld_16b Tsu_16b Tlow_16aTlow_16a Tper_16a Thigh_16a JTAG_TCK JTAG_TDI JTAG_TMS JTAG_TDO JTAG_TRST_N

14 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Recommended Operating Supply Voltages Absolute Maximum Voltage Rating Warning: For proper and reliable operation in adherence with this data sheet, the device should not exceed the recommended operating voltages in Table 13. The absolute maximum operating voltages in Table 14 are offered to provide guidelines for voltage excursions outside the recommended voltage ranges. Device functionality is not guaranteed at these conditions and sustained operation at these values or any exposure to voltages outside the maximum range may adversely affect device functionality and reliability. Power-Up/Power-Down Sequence During power supply ramp-up, V DDCORE must remain at least 1.0V below V DDI/O at all times. There are no other power-up sequence require- ments for the various operating supply voltages. The power-down sequence can occur in any order. Recommended Operating Temperature Symbol Parameter Minimum Typical Maximum Unit VDDCORE Internal logic supply 0.9 1.0 1.1 V VDDI/O I/O supply except for SerD es LVPECL/CML 3.135 3.3 3.465 V VDDPEA1 1. VDDPEA and VDDPETA should have no more than 25mVpeak-peak AC power supply noise superimposed on the 1.0V nominal DC value. PCI Express Analog Power 0.95 1.0 1.1 V VDDPEHA2 2. VDDPEHA should have no more than 50mVpeak-peak AC power supply noise superimposed on the 2.5V nominal DC value. PCI Express Analog High Power 2.25 2.5 2.75 V VDDPETA1 PCI Express Transmitter Analog Voltage 0.95 1.0 1.1 V VSS Common ground 0 0 0 V Table 13 PES16T4G2 Operating Voltages Core Supply PCIe Analog Supply PCIe Analog High Supply PCIe Transmitter Supply I/O Supply Table 14 PES16T4G2 Absolute Maximum Voltage Rating Grade Temperature Commercial 0 °C to +70°C Ambient Industrial -40 °C to +85°C Ambient Table 15 PES16T4G2 Operating Temperatures

15 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Power Consumption Typical power is measured under the following conditions: 25°C Am bient, 35% total link usage on all ports, typical voltages def ined in Table 13 (and also listed below). Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in Table 13 (and also listed below). Thermal Considerations This section describes thermal cons iderations for the PES16T4G2 (23mm2 SBGA288 package). The data in Table 17 below contains information that is relevant to the thermal performance of the PES16T4G2 switch. Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the TJ(max) value specified in Table 17. Consequently, the effective junction to ambient thermal resistance (θJA) for the worst case scenario must be maintained below the value determined by the formula: θJA = (TJ(max) - TA(max))/P Given that the values of TJ(max), TA(max), and P are known, the value of desired θJA becomes a known entity to the system designer. How to achieve the desired θJA is left up to the board or system designer, but in general, it can be achieved by adding the effects of θJC (value provided in Table 17), thermal resistance of the chosen adhesive (θCS), that of the heat sink (θSA), amount of airflow, and properties of the circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform their own thermal analysis for their own board and system design scenarios. Number of active Lanes per Port Core Supply PCIe Analog Supply PCIe Analog High Supply PCIe Termin- ation Supply I/O Supply Total Typ 1.0V Max 1.1V Typ 1.0V Max 1.1V Typ 2.5V Max 2.75V Typ 1.0V Max 1.1V Typ 3.3V Max 3.465V Typ Power Max Power 4/4/4/4 (Full swing) mA 650 908 650 770 260 330 361 429 3 4 4/4/1/1 (Full swing) mA 500 660 440 550 150 220 160 165 3 4 Table 16 PES16T4G2 Power Consumption Symbol Parameter Value Units Conditions TJ(max) Junction Temperature 125 oCM a x i m u m TA(max) Ambient Temperature 70 oCM a x i m u m θJA(effective) Effective Thermal Resistance, Junction-to-Ambient 19.8 oC/W Zero air flow 13.3 oC/W 1 m/S air flow 11.8 oC/W 2 m/S air flow θJB Thermal Resistance, Junction-to-Board 9.5 oC/W θJC Thermal Resistance, Junction-to-Case 1.1 oC/W P Power Dissipation of the Device 3.24 Watts Maximum Table 17 Thermal Specifications for PES16T4G2, 23x23 mm SBGA288 Package

16 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Values based on systems running at recommended supply voltages, as shown in Table 13. Note: See Table 8, Pin Characteristics, for a complete I/O listing. I/O Type Parameter Description Gen1 Gen2 Unit Condi- tions Min1 Typ1 Max1 Min1 Typ1 Max1 Serial Link PCIe Transmit VTX-DIFFp-p Differential peak-to-peak output voltage 800 1200 800 1200 mV VTX-DIFFp-p-LOW Low-Drive Differential Peak to Peak Output Voltage 400 1200 400 1200 mV VTX-DE-RATIO- 3.5dB De-emphasized differential output voltage VTX-DE-RATIO- 6.0dB De-emphasized differential output voltage VTX-DC-CM DC Common mode voltage 0 3.6 0 3.6 V VTX-CM-ACP RMS AC peak common mode output voltage 20 mV VTX-CM-DC-active- idle-delta Abs delta of DC common mode voltage between L0 and idle 100 100 mV VTX-CM-DC-line- delta Abs delta of DC common mode voltage between D+ and D- 25 25 mV VTX-Idle-DiffP Electrical idle diff peak output 20 20 mV RLTX-DIFF Transmitter Differential Return loss 10 10 dB 0.05 - 1.25GHz 8 dB 1.25 - 2.5GHz RLTX-CM Transmitter Common Mode Return loss 66 d B ZTX-DIFF-DC DC Differential TX impedance 80 100 120 120 Ω VTX-CM-ACpp Peak-Peak AC Common NA 100 mV VTX-DC-CM Transmit Driver DC Common Mode Voltage 0 3.6 0 3.6 V VTX-RCV-DETECT The amount of voltage change allowed during Receiver Detec- tion 600 600 mV ITX-SHORT Transmitter Short Circuit Current Limit 09 0 9 0 m A Table 18 DC Electrical Characteristics (Part 1 of 2)

17 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Serial Link (cont.) PCIe Receive VRX-DIFFp-p Differential input voltage (peak-to- peak) 175 1200 120 1200 mV RLRX-DIFF Receiver Differential Return Loss 10 10 dB 0.05 - 1.25GHz 8 1.25 - 2.5GHz RLRX-CM Receiver Common Mode Return Loss 66 d B ZRX-DIFF-DC Differential input impedance (DC) 80 100 120 Refer to return loss spec Ω ZRX--DC DC common mode impedance 40 50 60 40 60 Ω ZRX-COMM-DC Powered down input common mode impedance (DC) 200k 350k 50k Ω ZRX-HIGH-IMP-DC- POS DC input CM input impedance for V>0 during reset or power down 50k 50k Ω ZRX-HIGH-IMP-DC- NEG DC input CM input impedance for V<0 during reset or power down 1.0k 1.0k Ω VRX-IDLE-DET- DIFFp-p Electrical idle detect threshold 65 175 65 175 mV VRX-CM-ACp Receiver AC common-mode peak voltage 150 150 mV V RX-CM-ACp PCIe REFCLK CIN Input Capacitance 1.5 — 1.5 — pF Other I/Os LOW Drive Output I OL —2 . 5— —2 . 5 — m A V OL = 0.4v IOH —- 5 . 5— —- 5 . 5 — m A V OH = 1.5V High Drive Output IOL — 12.0 — — 12.0 — mA V OL = 0.4v Schmitt Trig- ger Input (STI) VIH 2.0 — V DDI/O + 0.5 2.0 — V DDI/O + 0.5 Input V IL -0.3 — 0.8 -0.3 — 0.8 V — VIH 2.0 — V DDI/O + 0.5 2.0 — V DDI/O + 0.5 Capacitance C IN —— 8 . 5 ——8 . 5p F — Leakage Inputs — — + 10 — — + 10 μAV DDI/O (max) I/OLEAK W/O Pull-ups/downs —— + 10 — — + 10 μAV DDI/O (max) I/OLEAK WITH Pull-ups/downs —— + 80 — — + 80 μAV DDI/O (max) 1. Minimum, Typical, and Maximum values meet the requirements under PCI Specification 2.0. I/O Type Parameter Description Gen1 Gen2 Unit Condi- tions Min1 Typ1 Max1 Min1 Typ1 Max1 Table 18 DC Electrical Characteristics (Part 2 of 2)

18 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet The following table lists the pin numbers and signal names for the PES16T4G2 device. Pin Function Alt Pin Function Alt Pin Function Alt Pin Function Alt A1 V SS B13 V DDPEHA D3 PE2TP00 F21 GPIO_06 A2 V SS B14 V SS D4 V DDPETA F22 PE4RN03 A3 V DDI/O B15 V SS D5 V DDPEA G1 V DDCORE A4 V DDCORE B16 V DDPEHA D6 V SS G2 V DDPEHA A5 PE6RP03 B17 V SS D7 V DDPETA G3 PE2TP01 A6 PE6RN03 B18 V SS D8 V DDPEA G4 V DDPEA A7 V DDCORE B19 V SS D9 V SS G19 V DDPETA A8 PE6RP02 B20 REFCLKM D10 V DDPETA G20 PE4TP03 A9 PE6RN02 B21 GPIO_13 D11 V DDPEA G21 GPIO_05 A10 V DDCORE B22 V SS D12 V SS G22 V SS A11 V SS C1 SSMBCLK D13 V DDPEA H1 PE2RN01 A12 V SS C2 SSMBDAT D14 V SS H2 V SS A13 V DDCORE C3 MSMBSMODE D15 V DDPETA H3 PE2TN01 A14 PE6RP01 C4 MSMBDAT D16 V DDPEA H4 V DDPETA A15 PE6RN01 C5 MSMBADDR_4 D17 V SS H19 V DDPEA A16 V DDCORE C6 PE6TN03 D18 V DDCORE H20 V DDI/O A17 PE6RP00 C7 PE6TP03 D19 V DDPETA H21 GPIO_04 1 A18 PE6RN00 C8 V DDI/O D20 GPIO_09 H22 PE4RP02 A19 V DDI/O C9 PE6TN02 D21 GPIO_11 1 J1 PE2RP01 A20 GPIO_15 C10 PE6TP02 D22 V DDCORE J2 V SS A21 GPIO_14 C11 V SS E1 PE2RN00 J3 V SS A22 V SS C12 V DDPEHA E2 V SS J4 V SS B1 SSMBADDR_5 C13 V SS E3 PE2TN00 J19 V SS B2 SSMBADDR_3 C14 V SS E4 V DDCORE J20 PE4TN02 B3 SSMBADDR_2 C15 PE6TN01 E19 V DDPEA J21 V DDPEHA B4 SSMBADDR_1 C16 PE6TP01 E20 GPIO_07 1 J22 PE4RN02 B5 MSMBCLK C17 V DDPEHA E21 GPIO_08 K1 V DDCORE B6 MSMBADDR_3 C18 PE6TN00 E22 PE4RP03 K2 V DDPEHA B7 MSMBADDR_2 C19 PE6TP00 F1 PE2RP00 K3 V SS B8 MSMBADDR_1 C20 GPIO_10 F2 V SS K4 V DDPEA B9 V DDPEHA C21 GPIO_12 F3 V DDPEHA K19 V DDPETA B10 NC C22 V DDI/O F4 V SS K20 PE4TP02 B11 REFRES6 D1 V SS F19 V SS K21 NC B12 V SS D2 V DDI/O F20 PE4TN03 K22 V DDCORE Table 19 PES16T4G2 288-pin Signal Pin-Out (Part 1 of 2)

19 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet L1 V SS R21 V SS W13 V DDPETA AA7 V DDPEHA L2 V SS R22 PE4RN01 W14 V SS AA8 V SS L3 V DDPEHA T1 V DDCORE W15 V DDPEA AA9 V SS L4 V SS T2 JTAG_TRST_N W16 V DDPETA AA10 V DDPEHA L19 V DDPEA T3 PE2TP03 W17 V SS AA11 V SS L20 V SS T4 JTAG_TDO W18 V DDPEA AA12 REFRES0 L21 REFRES4 T19 V DDPEA W19 V DDPETA AA13 NC L22 V SS T20 PE4TP01 W20 PE4TP00 AA14 V DDPEHA M1 V SS T21 V DDPEHA W21 V DDI/O AA15 CCLKUS M2 REFRES2 T22 V DDCORE W22 V SS AA16 CCLKDS M3 V SS U1 PE2RN03 Y1 JTAG_TDI AA17 SWMODE_0 M4 V DDPEA U2 JTAG_TMS Y2 V DDI/O AA18 SWMODE_2 M19 V SS U3 PE2TN03 Y3 V DDI/O AA19 NC M20 V DDPEHA U4 V SS Y4 PE0TP00 AA20 NC M21 V SS U19 V SS Y5 PE0TN00 AA21 GPIO_00 1 M22 V SS U20 V DDPEHA Y6 V DDPEHA AA22 GPIO_01 1 N1 V DDCORE U21 V SS Y7 PE0TP01 AB1 V SS N2 NC U22 PE4RP00 Y8 PE0TN01 AB2 V SS N3 PE2TP02 V1 PE2RP03 Y9 V SS AB3 V SS N4 V DDPETA V2 V SS Y10 V SS AB4 V DDCORE N19 V DDPEA V3 V SS Y11 V DDPEHA AB5 PE0RN00 N20 V SS V4 V DDPEA Y12 V SS AB6 PE0RP00 N21 V DDPEHA V19 V DDCORE Y13 PE0TP02 AB7 V DDCORE N22 V DDCORE V20 PE4TN00 Y1 4 PE0TN02 AB8 PE0RN01 P1 PE2RN02 V21 V SS Y15 V DDI/O AB9 PE0RP01 P2 V DDPEHA V22 PE4RN00 Y16 PE0TP03 AB10 V DDCORE P3 PE2TN02 W1 JTAG_TCK Y17 PE0TN03 AB11 PEREFCLKP0 P4 V SS W2 V SS Y18 SWMODE_1 AB12 PEREFCLKN0 P19 V SS W3 V SS Y19 PERSTN AB13 V DDCORE P20 V SS W4 V DDPETA Y20 RSTHALT AB14 PE0RN02 P21 V SS W5 V DDCORE Y21 GPIO_03 AB15 PE0RP02 P22 PE4RP01 W6 V SS Y22 GPIO_02 1 AB16 V DDCORE R1 PE2RP02 W7 V DDPEA AA1 V SS AB17 PE0RN03 R2 V DDI/O W8 V DDPETA AA2 V SS AB18 PE0RP03 R3 V DDPETA W9 V SS AA3 V SS AB19 V SS R4 V DDPEA W10 V DDPEA AA4 V SS AB20 V DDI/O R19 V DDPETA W11 V SS AA5 V SS AB21 V SS R20 PE4TN01 W12 V DDPEA AA6 V SS AB22 V SS Pin Function Alt Pin Function Alt Pin Function Alt Pin Function Alt Table 19 PES16T4G2 288-pin Signal Pin-Out (Part 2 of 2)

20 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Alternate Signal Functions No Connection Pins Pin GPIO Alternate AA21 GPIO_00 P2RSTN AA22 GPIO_01 P4RSTN Y22 GPIO_02 IOEXPINTN0 H21 GPIO_04 IOEXPINTN2 E20 GPIO_07 GPEN D21 GPIO_11 P6RSTN Table 20 PES16T4G2 Alternate Signal Functions NC Pins B10 K21 AA13 AA19 AA20 Table 21 PES16T4G2 No Connection Pins

21 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Power Pins VDDCore V DDI/O V DDPEA V DDPEHA V DDPETA A4 A3 D5 B9 D4 A7 A19 D8 B13 D7 A10 C8 D11 B16 D10 A13 C22 D13 C12 D15 A16 D2 D16 C17 D19 D18 H20 E19 F3 G19 D 2 2 R 2G 4G 2H 4 E4 W21 H19 J21 K19 G1 Y2 K4 K2 N4 K1 Y3 L19 L3 R3 K22 Y15 M4 M20 R19 N1 AB20 N19 N21 W4 N22 R4 P2 W8 T1 T19 T21 W13 T22 V4 U20 W16 V19 W7 Y6 W19 W5 W10 Y11 AB4 W12 AA7 AB7 W15 AA10 AB10 W18 AA14 AB13 AB16 Table 22 PES16T4G2 Power Pins

22 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Ground Pins Vss Vss Vss Vss A1 D17 M21 W17 A2 E2 M22 W22 A11 F2 N20 Y9 A12 F4 P4 Y10 A22 F19 P19 Y12 B12 G22 P20 AA1 B14 H2 P21 AA2 B15 J2 R21 AA3 B17 J3 U4 AA4 B18 J4 U19 AA5 B19 J19 U21 AA6 B22 K3 V2 AA8 C11 L1 V3 AA9 C13 L2 V21 AA11 C14 L4 W2 AB1 D1 L20 W3 AB2 D6 L22 W6 AB3 D9 M1 W9 AB19 D12 M3 W11 AB21 D14 M19 W14 AB22 Table 23 PES16T4G2 Ground Pins

23 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet Signals Listed Alphabetically Signal Name I/O Type Location Signal Category CCLKDS I AA16 System CCLKUS I AA15 GPIO_00 I/O AA21 General Purpose Input/Output GPIO_01 I/O AA22 GPIO_02 I/O Y22 GPIO_03 I/O Y21 GPIO_04 I/O H21 GPIO_05 I/O G21 GPIO_06 I/O F21 GPIO_07 I/O E20 GPIO_08 I/O E21 GPIO_09 I/O D20 GPIO_10 I/O C20 GPIO_11 I/O D21 GPIO_12 I/O C21 GPIO_13 I/O B21 GPIO_14 I/O A21 GPIO_15 I/O A20 JTAG_TCK I W1 JTAG JTAG_TDI I Y1 JTAG_TDO O T4 JTAG_TMS I U2 JTAG_TRST_N I T2 MSMBADDR_1 I B8 SMBus MSMBADDR_2 I B7 MSMBADDR_3 I B6 MSMBADDR_4 I C5 MSMBCLK I/O B5 MSMBDAT I/O C4 MSMBSMODE I C3 System No Connection See Table 21 PE0RN00 I AB5 PCI Express PE0RN01 I AB8 PE0RN02 I AB14 Table 24 89PES16T4G2 Alphabetical Signal List (Part 1 of 4)

24 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet PE0RN03 I AB17 PCI Express (Cont.) PE0RP00 I AB6 PE0RP01 I AB9 PE0RP02 I AB15 PE0RP03 I AB18 PE0TN00 O Y5 PE0TN01 O Y8 PE0TN02 O Y14 PE0TN03 O Y17 PE0TP00 O Y4 PE0TP01 O Y7 PE0TP02 O Y13 PE0TP03 O Y16 PE2RN00 I E1 PE2RN01 I H1 PE2RN02 I P1 PE2RN03 I U1 PE2RP00 I F1 PE2RP01 I J1 PE2RP02 I R1 PE2RP03 I V1 PE2TN00 O E3 PE2TN01 O H3 PE2TN02 O P3 PE2TN03 O U3 PE2TP00 O D3 PE2TP01 O G3 PE2TP02 O N3 PE2TP03 O T3 PE4RN00 I V22 PE4RN01 I R22 PE4RN02 I J22 PE4RN03 I F22 PE4RP00 I U22 PE4RP01 I P22 PE4RP02 I H22 Signal Name I/O Type Location Signal Category Table 24 89PES16T4G2 Alphabetical Signal List (Part 2 of 4)

25 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet PE4RP03 I E22 PCI Express (Cont.) PE4TN00 O V20 PE4TN01 O R20 PE4TN02 O J20 PE4TN03 O F20 PE4TP00 O W20 PE4TP01 O T20 PE4TP02 O K20 PE4TP03 O G20 PE6RN00 I A18 PE6RN01 I A15 PE6RN02 I A9 PE6RN03 I A6 PE6RP00 I A17 PE6RP01 I A14 PE6RP02 I A8 PE6RP03 I A5 PE6TN00 O C18 PE6TN01 O C15 PE6TN02 O C9 PE6TN03 O C6 PE6TP00 O C19 PE6TP01 O C16 PE6TP02 O C10 PE6TP03 O C7 PEREFCLKN0 I AB12 PEREFCLKP0 I AB11 PERSTN I Y19 System REFCLKM I B20 PCI Express REFRES0 I/O AA12 SerDes Reference Resistors REFRES2 I/O M2 REFRES4 I/O L21 REFRES6 I/O B11 RSTHALT I Y20 System Signal Name I/O Type Location Signal Category Table 24 89PES16T4G2 Alphabetical Signal List (Part 3 of 4)

26 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet SSMBADDR_1 I B4 SMBus SSMBADDR_2 I B3 SSMBADDR_3 I B2 SSMBADDR_5 I B1 SSMBCLK I/O C1 SMBus SSMBDAT I/O C2 SWMODE_0 I AA17 System SWMODE_1 I Y18 SWMODE_2 I AA18 V DDCORE, VDDI/O, VDDPEA, VDDPEHA, VDDPETA See Table 22 for a listing of power pins. VSS See Table 23 for a listing of ground pins. Signal Name I/O Type Location Signal Category Table 24 89PES16T4G2 Alphabetical Signal List (Part 4 of 4)

27 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet PES16T4G2 Pinout — Top View 12 3456789 1 0 11 12 13 14 15 16 Vss (Ground) VDDCore (Power) VDDI/O (Power) 17 18 19 20 21 22 VDDPETA (Transmitter Power) VDDPEA (Analog Power) VDDPEHA (High Analog Power) SignalsX A B C D E F G H J K L M N P R T U V W Y AA AB X A B C D E F G H J K L M N P R T U V W Y AA AB 12 3456789 1 0 11 12 13 14 15 16 17 18 19 20 21 22 XX X X X X X X X X X X X X X No Connect

28 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet

29 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet

30 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet

Revision History

March 27, 2008: Initial publication of final data sheet. April 17, 2008: In Table 16, Thermal Specifications, revised values for θJA, θJB, and θJC. October 28, 2008: Added ZB silicon to Ordering Information section. February 24, 2009: Revised AC Timing Characteristics table and DC Electrical Characteristics table to correct typos. January 18, 2010: Revised Power Management list in Features section. February 2, 2010: Added new section Absolute Maximum Voltage Rating with table. September 13, 2010: In Table 8, changed Buffer type for PCI Express from CML to PCIe differential and changed reference clocks to HCSL. March 30, 2011: In Table 13, added VddPETA to footnote #1. August 10, 2011: Added Industrial temperature to Table 15 and to Order page.

31 of 31 August 10, 2011 IDT 89HPES16T4G2 Data Sheet CORPORATE HEADQUARTERS

6024 Silver Creek Valley Road

San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com for Tech Support: email: ssdhelp@idt.com phone: 408-284-8208

Ordering Information

89HPES16T4G2ZABX 288-ball SBGA package, Commercial Temp. 89HPES16T4G2ZABXI 288-ball SBGA package, Industrial Temp. 89HPES16T4G2ZABXG 288-ball Green SBGA package, Commercial Temp. 89H PES16T4G2ZABXGI 288-ball Green SBG A package, Industrial Temp. 89HPES16T4G2ZBBX 288-ball SBGA package, Commercial Temp. 89HPES16T4G2ZBBXI 288-ball SBGA package, Industrial Temp. 89HPES16T4G2ZBBXG 288-ball Green SBGA package, Commercial Temp. 89H PES16T4G2ZBBXGI 288-ball Green SBG A package, Industrial Temp. NN A AAA NNAN AAA A Operating Voltage Device Family Product Package Temp Range H Blank Commercial Temperature (0°C to +70°C Ambient) Product Family

89 Serial Switching Product

16T4 16-lane, 4-port 1.0V +/- 0.1V Core Voltage Detail PCI Express SwitchPES Legend A = Alpha Character N = Numeric Character BXG288 288-ball SBGA, Green BXG AA Device Revision ZA ZA revision AN Generation Series G2 PCIe Gen 2 ZB ZB revision I Industrial Temperature (-40° C to +85° C Ambient)

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