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- 4 3 2 1 | lop foo bepeq}_—— sere par pr | |_| ¥ | Rewseo Per eco-i2-o11709 __z5uunzona] RW] SY | .145£.003 | D D -190+.030 ZONE 2 Ad ZX .000050 MIN THK NICKEL UNDERPLATE OVER ENTIRE CONTACT. .140 MIN ZX .000150 MIN BRIGHT TIN/LEAD OVER ENTIRE CONTACT. | ZONE 3 +40 MIN Z\\ .000100 MIN THK BRIGHT TIN/LEAD IN ZONE 1. SONE 1 ZX GOLD FLASH IN LOCALIZED GOLD PLATE AREA. (i AX 000015 MIN GOLD IN LOCALIZED GOLD PLATE AREA | ar A .000030 MIN GOLD IN LOCALIZED GOLD PLATE AREA I I -026 £.002 7. TO BE APPLIED PER AMP APPLICATION | SPEC 114-16015. 8. RECOMMENDED HOLE SIZE IS .031-.035 DIA. | lan SoS A\\ FOR SOLDERABILITY SEE AMP PRODUCT SPEC 108-9024. c apy CTLELELP B .000150 MIN TIN-LEAD IN ZONE 2. c | CE—T 1 Fer) ‘ove AN AREA TO BE UNPLATED (—9 ONLY). AN GOLD FLASH IN ZONE 1. | -2504.005 000150 MIN TIN IN ZONE 3. +375 REF VAN GOLD FLASH IN ZONE 1. | Ad GOLD PLATING MAY OR MAY NOT BE PRESENT ON THE BOTTOM OF THE CRIMP BARREL IN THIS AREA. .110 MIN | D LOCALIZED AA GOLD PLATE A\\ AREA | o Oo ive) oO B B ° | DAMN -88997-4 AAAMAN'-88997-3] DAMDAN1-88997-2 OBSOLETE ADK | 88997-9 | 8997-5 SUPERSEDED BY 88997—5 88997-3 88997-2 | SECTION D— D THIS DRAWING IS A CONTROLLED DOCUMENT. es . OT ERNE SSSR Pe vas weer OO | INCHES orc ae je CONTA SOLDER ® fins #- Pe oe_o2e | AB, FFC, .100¢ | HR ESE hes BpLicaTON SPEC thc Ee SEE CHE OE RAE WO = ao TATERAL NSH - rer [A 2 |00779\\Se88997 ~ PH. BRONZE .010 THK SEE TABLE 1471-9 (3/11)