85505012A

SNJ54HCT240 TI | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 13

Technical content

SCLS174E − MARCH 1984 − REVISED AUGUST 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Operating Voltage Range of 4.5 V to 5.5 V High-Current Outputs Drive Up To 15 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 12 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max Inputs Are TTL-Voltage Compatible 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers description/ordering information These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HCT240 devices are organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

ORDERING INFORMATION

PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP − N Tube of 20 SN74HCT240N SN74HCT240N SOIC − DW Tube of 25 SN74HCT240DW HCT240 SOIC − DW Reel of 2000 SN74HCT240DWR HCT240 −40°C to 85°C SOP − NS Reel of 2000 SN74HCT240NSR HCT240 −40 C to 85 C Tube of 70 SN74HCT240PW TSSOP − PW Reel of 2000 SN74HCT240PWR HT240 TSSOP − PW Reel of 250 SN74HCT240PWT HT240 CDIP − J Tube of 20 SNJ54HCT240J SNJ54HCT240J −55°C to 125°C CFP − W Tube of 85 SNJ54HCT240W SNJ54HCT240W −55 C to 125 C LCCC − FK Tube of 55 SNJ54HCT240FK SNJ54HCT240FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 SN54HCT240 . . . J OR W PACKAGE SN74HCT240 . . . DW, N, NS, OR PW PACKAGE (TOP VIEW) 20 19 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 1A2 2Y3 1A3 2Y2 1A4 SN54HCT240 . . . FK PACKAGE (TOP VIEW) 2Y4 1A1 1OE 1Y4 2A2 2OE 2Y1 GND 2A1 VCC Copyright  2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. !"# $ %&' # "$ (&)*%"# +"#', +&%#$ % ! # $('% %"# '."$ $#&!' $#" +"+ /"" #0, +&%# %'$$ 1 + '%'$$"*0 %*&+' #'$# +&%#$ % !(*" # # *'$$ #-'/$' #'+, "** #-' ( +&%#$ +&%# %'$$ 1 + '%'$$"*0

SCLS174E − MARCH 1984 − REVISED AUGUST 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FUNCTION TABLE (each buffer/driver) INPUTS OUTPUT OE A OUTPUT Y L H L L L H H X Z logic diagram (positive logic) 1A1 1A2 1A3 1A4 1Y1 2A1 2A2 2A3 2A4 2Y1 1Y2 1Y3 1Y4 2Y2 2Y3 2Y4 1OE 2OE absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA Continuous output current, IO (VO = 0 to VCC) ±35 mA Continuous current through VCC or GND ±70 mA Package thermal impedance, θJA (see Note 2): DW package 58°C/W N package 69°C/W NS package 60°C/W PW package 83°C/W Storage temperature range, Tstg −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7.

SCLS174E − MARCH 1984 − REVISED AUGUST 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) SN54HCT240 SN74HCT240 UNIT MIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 4.5 5.5 4.5 5.5 V VIH High-level input voltage VCC = 4.5 V to 5.5 V V VIL Low-level input voltage VCC = 4.5 V to 5.5 V 0.8 0.8 V VI Input voltage VCC VCC V VO Output voltage VCC VCC V ∆t/∆v Input transition rise/fall time 500 500 ns TA Operating free-air temperature −55 125 −40 NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54HCT240 SN74HCT240 UNIT PARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT VOH VI = VIH or VIL IOH = −20 µA 4.5 V 4.4 4.499 4.4 4.4 V VOH VI = VIH or VIL IOH = −6 mA 4.5 V 3.98 4.3 3.7 3.84 V VOL VI = VIH or VIL IOL = 20 µA 4.5 V 0.001 0.1 0.1 0.1 V VOL VI = VIH or VIL IOL = 6 mA 4.5 V 0.17 0.26 0.4 0.33 V II VI = VCC or 0 5.5 V ±0.1 ±100 ±1000 ±1000 nA IOZ VO = VCC or 0, VI = VIH or VIL 5.5 V ±0.01 ±0.5 ±10 µA ICC VI = VCC or 0, IO = 0 5.5 V 160 µA ∆ICC† One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC 5.5 V 1.4 2.4 2.9 mA Ci 4.5 V to 5.5 V pF † This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HCT240 SN74HCT240 UNIT PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT tpd A Y 4.5 V ns tpd A Y 5.5 V ns ten OE Y 4.5 V ns ten OE Y 5.5 V ns tdis OE Y 4.5 V ns tdis OE Y 5.5 V ns tt Y 4.5 V ns tt Y 5.5 V ns

SCLS174E − MARCH 1984 − REVISED AUGUST 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HCT240 SN74HCT240 UNIT PARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT tpd A Y 4.5 V ns tpd A Y 5.5 V ns ten OE Y 4.5 V ns ten OE Y 5.5 V ns tt Y 4.5 V ns tt Y 5.5 V ns operating characteristics, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Cpd Power dissipation capacitance No load pF

CL includes probe and test-fixture capacitance. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. The outputs are measured one at a time with one input transition per measurement. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms

Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 85505012A ACTIVE LCCC FK None Call TI Level-NC-NC-NC 8550501RA ACTIVE CDIP J None Call TI Level-NC-NC-NC JM38510/65753BRA ACTIVE CDIP J None Call TI Level-NC-NC-NC SN54HCT240J ACTIVE CDIP J None Call TI Level-NC-NC-NC SN74HCT240DW ACTIVE SOIC DW Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74HCT240DWR ACTIVE SOIC DW 2000 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74HCT240N ACTIVE PDIP N Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74HCT240NSR ACTIVE SO NS 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74HCT240PW ACTIVE TSSOP PW Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74HCT240PWR ACTIVE TSSOP PW 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SN74HCT240PWT ACTIVE TSSOP PW 250 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM SNJ54HCT240FK ACTIVE LCCC FK None Call TI Level-NC-NC-NC SNJ54HCT240J ACTIVE CDIP J None Call TI Level-NC-NC-NC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 Addendum-Page 1

MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96

28 TERMINAL SHOWN

B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) A NO. OF MIN MAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32) (18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,65 M 0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products

Applications

amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright  2005, Texas Instruments Incorporated