850 MILL-MAX | Alldatasheet
Document overview
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Technical content
.050” Grid Headers and Sockets Single and Double Row www.mill-max.com /telephonesolid/telephonesolid516-922-600066 Series 850, 851 852, 853 (Number of Pins X .050”) + .015” (Number of Pins X .050”/2) + .015” (Number of Pins X .050”) + .015” (Number of Pins X .050”/2) + .015” Fig. 1 Fig. 2 (Number of Pins X .050”) + .040”
Ordering Information
Single Row .087” Profile Pin Header Double Row .075” Profile Pin Header Single Row .161” Profile Socket Double Row .161” Profile Socket Single Row .185” Profile Socket Fig. 3 Fig. 4 Fig. 5 Specify # of pins 01-50 Specify # of pins 002-100 Specify # of pins 01-50 Specify # of pins 002-100 Specify # of pins 01-77 Fig. 1 Fig. 2 Fig. 4 Fig. 5 Fig. 3 SPECIFY PLA TING CODE XX= 13 /rhombopen/rhombopen91 93 99 41 /rhombopen/rhombopen43 /rhombopen/rhombopen44 /rhombopen/rhombopen Sleeve (Pin) Contact (Clip) 10µ” Au 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn 200µ”Sn 30µ” Au 10µ” Au 30µ” Au 200µ” Sn/Pb 10µ” Au 30µ” Au 200µ”Sn Pin Plating 10μ” Au 200μ” Sn/Pb 200μ”S n SPECIFY PLATING CODE XX= 10 /rhombopen/rhombopen90 40 /rhombopen/rhombopen
- Series 850 single and double row interconnects have .050” pin spacing & permit board stacking as low as .248”.
- Pin headers have .016” dia. pins ( MM #4006-0 ). See page 175 for details.
- MM #0467 and MM #4890 receptacles use Hi-Rel, 3-finger BeCu #11 contacts rated at 3 amps. ( #11 contact accepts pin diameters from .015”-.020” ). See pages 129 and 131 for details.
- Insulators are high temp. thermoplastic, suitable for all soldering operations. RoHS 2002/95/EC XX=Plating Code See Below For Electrical, Mechanical & Enviromental Data, See pg. 4 For RoHS compliance select /rhombopen/rhombopenplating code. XX=Plating Code See Below For Electrical, Mechanical & Enviromental Data, See pg. 4 For RoHS compliance select /rhombopen/rhombopenplating code.