SN74ALS09DR TI | Alldatasheet
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SN54ALS09, SN74ALS09 QUADRUPLE 2-INPUT POSITIVE-AND GATES WITH OPEN-COLLECTOR OUTPUTS SDAS084B – APRIL 1982 – REVISED DECEMBER 1994 Copyright 1994, Texas Instruments Incorporated 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
- Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs
description
These devices contain four independent 2-input positive-AND gates. They perform the Boolean functions Y = A • B or Y = A + B in positive logic. The open-collector outputs require pullup resistors to perform correctly. These outputs may be connected to other open-collector outputs to implement active-low wired-OR or active-high wired-AND functions. Open-collector devices are often used to generate higher V OH levels. The SN54ALS09 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ALS09 is characterized for operation from 0°C to 70°C. FUNCTION TABLE (each gate) INPUTS OUTPUT A B Y H H H L XL X L L logic symbol† logic diagram (positive logic) † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Pin numbers shown are for the D, J, and N packages. SN54ALS09 ...J PACKAGE SN74ALS09 ...D O R N PACKAGE (TOP VIEW) GND V CC SN54ALS09 . . . FK PACKAGE (TOP VIEW) 3 2 1 20 19 9 10 11 12 13 NC NC NC NC NC V NC CC NC – No internal connection GND PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
SN54ALS09, SN74ALS09 QUADRUPLE 2-INPUT POSITIVE-AND GATES WITH OPEN-COLLECTOR OUTPUTS SDAS084B – APRIL 1982 – REVISED DECEMBER 1994
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions SN54ALS09 SN74ALS09 UNIT MIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V VIH High-level input voltage 2 2 V VIL Low-level input voltage 0.7 0.8 V VOH High-level output voltage 5.5 5.5 V IOL Low-level output current 4 8 mA TA Operating free-air temperature –55 125 0 70 °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS SN54ALS09 SN74ALS09 UNITPARAMETER TEST CONDITIONS MIN TYP ‡ MAX MIN TYP ‡ MAX UNIT VIK VCC = 4.5 V, II = –18 mA –1.5 –1.5 V VOL VCC =45V IOL = 4 mA 0.25 0.4 0.25 0.4 VVOL VCC = 4.5 V IOL = 8 mA 0.35 0.5 V II VCC = 5.5 V, VI = 7 V 0.1 0.1 mA IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA IIL VCC = 5.5 V, VI = 0.4 V –0.1 –0.1 mA IOH VCC = 4.5 V, VOH = 5.5 V 0.1 0.1 mA ICCL VCC = 5.5 V, VI = 0 2.2 4 2.2 4 mA ‡ All typical values are at VCC = 5 V, TA = 25°C. switching characteristics (see Figure 1) PARAMETER FROM (INPUT ) TO (OUTPUT ) VCC = 4.5 V to 5.5 V, C L = 50 pF, R L = 2 kΩ , TA = MIN to MAX§ UNIT(INPUT) (OUTPUT) SN54ALS09 SN74ALS09 MIN MAX MIN MAX tPLH Ao rB Y 20 69 23 54 ns tPHL A or B Y 5 23 5 15 ns § For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTES: A. C L includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. When measuring propagation delay items of 3-state outputs, switch S1 is open. D. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf = 2 ns, duty cycle = 50%. E. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuits and Voltage Waveforms
www.ti.com 21-Mar-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples 84142012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 84142012A SNJ54ALS 09FK 8414201CA ACTIVE CDIP J 14 1 TBD Call TI Call TI -55 to 125 8414201CA SNJ54ALS09J SN54ALS09J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54ALS09J SN74ALS09D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS09 SN74ALS09DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS09 SN74ALS09DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS09 SN74ALS09DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS09 SN74ALS09DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS09 SN74ALS09DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 ALS09 SN74ALS09N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS09N SN74ALS09NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74ALS09N SN74ALS09NSR OBSOLETE SO NS 14 TBD Call TI Call TI 0 to 70 ALS09 SN74ALS09NSRE4 OBSOLETE SO NS 14 TBD Call TI Call TI 0 to 70 SN74ALS09NSRG4 OBSOLETE SO NS 14 TBD Call TI Call TI 0 to 70 SNJ54ALS09FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84142012A SNJ54ALS 09FK SNJ54ALS09J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8414201CA SNJ54ALS09J (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
www.ti.com 21-Mar-2013 Addendum-Page 2 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ALS09, SN74ALS09 :
- Catalog: SN74ALS09
- Military: SN54ALS09 NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
- Military - QML certified for Military and Defense Applications
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALS09DR SOIC D 14 2500 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 17-Aug-2012 Pack Materials-Page 2
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