84098012A

JM38510-65701B2A TI1 | Alldatasheet

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SN54HC04...J□OR□W□PACKAGE SN74HC04...D,□DB,□N,□NS,□OR□PW□PACKAGE (TOP VIEW) 1A VCC1 14 1Y 6A2 13 2A 6Y 3 12 2Y 5A4 11 3A 5Y5 10 3Y 4A6 9 GND 4Y7 8 SN54HC04...FK□PACKAGE (TOP VIEW) NC No□internal□connection– NC NC 5Y14 NC NC 3A 8 1 202 19 NCV CC 1A 6A1Y 139 12 4A3Y 4Y GNDNC 10 11 SN54HC04,SN74HC04 www.ti.com SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010 HEXINVERTERS Check forSamples: SN54HC04, SN74HC04 1FEATURES

• Wide OperatingVoltageRange of2 V to6 V
• Outputs Can DriveUp To 10 LSTTL Loads
• Low Power Consumption, 20-mA Max ICC
• Typicaltpd = 8 ns
• ±4-mA Output Driveat5 V
• Low InputCurrentof1 mA Max DESCRIPTION/ORDERING INFORMATION The ’HC04 devicescontainsixindependentinverters.They performtheBooleanfunctionY = A inpositivelogic.

ORDERING INFORMATION

TA PACKAGE (1) ODERABLE PART NUMBER TOP-SIDE MARKING PDIP – N Reelof1000 SN74HC04N SN74HC04N Reelof1000 SN74HC04DE4 SOIC – D Reelof2500 SN74HC04DRG3 HC04 Tube of250 SN74HC04DT SN74HC04NSR SOP – NS Reelof2000 HC04 –40°C to85°C SN74HC04NSRG4 SN74HC04DBR SSOP – DB Reelof2000 HC04 SN74HC04DBRE4 Tube of90 SN74HC04PW TSSOP – PW Reelof2000 SN74HC04PWR HC04 Tube of250 SN74HC04PWT CDIP – J Reelof1000 SNJ54HC04J –55°C to125°C CFP – W Reelof900 SNJ54HC04W LCCC –FK Reelof2200 SNJ54HC04FK (1) Package drawings,standardpackingquantities,thermaldata,symbolization,and PCB designguidelinesareavailableat www.ti.com/sc/package. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1982–2010,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SN54HC04,SN74HC04 SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010 www.ti.com Table1.FUNCTION TABLE (EACH INVERTER) INPUT OUTPUT A Y H L L H LOGIC DIAGRAM (POSITIVE LOGIC) AbsoluteMaximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC Supplyvoltagerange –0.5 7 V IIK Inputclamp current(2) VI< 0 orVI> VCC ±20 mA IOK Outputclamp current(2) VO < 0 ±20 mA IO Continuousoutputcurrent VO = 0 toVCC ±25 mA ContinuouscurrentthroughVCC orGND ±50 mA D package 86 N package 80 qJA Package thermalimpedance(3) °C/W NS package 76 PW package 113 Tstg Storagetemperaturerange –60 150 °C (1) Stressesbeyond thoselistedunder"absolutemaximum ratings"may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedunder"recommended operating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmay affectdevicereliability. (2) The inputand outputnegative-voltageratingsmay be exceeded iftheinputand outputclamp-currentratingsareobserved. (3) The package thermalimpedance iscalculatedinaccordancewithJESD 51-7. Recommended OperatingConditions(1) SN54HC04 SN74HC04 UNIT MIN NOM MAX MIN NOM MAX VCC Supplyvoltage 2 5 6 2 5 6 V VCC = 2 V 1.5 1.5 VIH High-levelinputvoltage VCC = 4.5V 3.15 3.15 V VCC = 6 V 4.2 4.2 VCC = 2 V 0.5 0.5 VIL Low-levelinputvoltage VCC = 4.5V 1.35 1.35 V VCC = 6 V 1.8 1.8 VI Inputvoltage 0 VCC 0 VCC V VO Outputvoltage 0 VCC 0 VCC V VCC = 2 V 1000 1000 Δt/Δv Inputtransitionriseorfallrate VCC = 4.5V 500 500 ns VCC = 6 V 400 400 TA Operatingfree-airtemperature –55 125 –40 85 °C (1) Allunused inputsofthedevicemust be heldatVCC orGND toensureproperdeviceoperation.RefertotheTIapplicationreport, ImplicationsofSlow orFloatingCMOS Inputs,literaturenumber SCBA004.

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ProductFolderLink(s):SN54HC04, SN74HC04

SN54HC04,SN74HC04 www.ti.com SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010 ElectricalCharacteristics overoperatingfree-airtemperaturerange(unlessotherwisenoted) TA = 25°C SN54HC04 SN74HC04 PARAMETER TEST CONDITIONS VCC UNIT MIN TYP MAX MIN MAX MIN MAX 2 V 1.9 1.998 1.9 1.9 VI= VIH orVOH 6 V 5.9 5.999 5.9 5.9 VVIL 2 V 0.002 0.1 0.1 0.1 VI= VIH orVOL 6 V 0.001 0.1 0.1 0.1 VVIL II VI= VCC or0 6 V ±0.1 ±100 ±1000 ±1000 nA ICC VI= VCC or0, IO = 0 6 V 2 40 20 mA C i 2 V to6 V 3 10 10 10 pF SwitchingCharacteristics overoperatingfree-airtemperaturerange,C L = 50 pF (unlessotherwisenoted)(seeFigure1) TA = 25°C SN54HC04 SN74HC04FROM TOPARAMETER VCC UNIT(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX

2 V 45 95 125 120

tpd A Y 4.5V 9 19 29 24 ns

6 V 8 16 25 20

2 V 38 75 110 95

tt Y 4.5V 8 15 22 19 ns

6 V 6 13 19 16

TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipationcapacitanceperinverter No load 20 pF Copyright© 1982–2010,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):SN54HC04, SN74HC04

NOTES: A. C includes□probe□and□test-fixture□capacitance. B. Phase□relationships□between□waveforms□were□chosen□arbitrarily. All□input□pulses□are□supplied□by□generators□having□the□following characteristics:□PRR 1□MHz,□Z =□50 ,□t =□6□ns,□t =□6□ns. C. The□outputs□are□measured□one□at□a□time□with□one□input□transition□per□measurement. D.□t and□t are□the□same□as□t . L O r f PLH PHL pd From□Output Under□Test C =□50□pF (see□Note A) L LOAD□CIRCUIT Test Point VOLTAGE□WAVEFORMS INPUT□RISE AND□FALL TIMES Input 90%90%50% 50% 10% 10% tftr 0□V VCC VOLTAGE□WAVEFORMS PROPAGATION□DELAY AND□OUTPUT□TRANSITION□TIMES tPLH tPLH tPHL tPHL Input In-Phase Output Out-of-Phase Output 90% 90% 90% 50% 10% 10% 10% 50% 50% 50% 50% tf tf tr 90% 10% 50% tr VCC VOL VOH VOH 0□V VOL SN54HC04,SN74HC04 SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010 www.ti.com PARAMETER MEASURMENT INFORMATION Figure1. Load Circuitand VoltageWaveforms

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ProductFolderLink(s):SN54HC04, SN74HC04

www.ti.com 24-Jan-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples 5962-8409801VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409801VC A SNV54HC04J 5962-8409801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8409801VD A SNV54HC04W 84098012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI -55 to 125 84098012A SNJ54HC 04FK 8409801CA ACTIVE CDIP J 14 1 TBD Call TI Call TI -55 to 125 8409801CA SNJ54HC04J 8409801DA ACTIVE CFP W 14 1 TBD Call TI Call TI -55 to 125 8409801DA SNJ54HC04W JM38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65701B2A JM38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BCA JM38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BDA M38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65701B2A M38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BCA M38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65701BDA SN54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC04J SN74HC04D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04

www.ti.com 24-Jan-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples SN74HC04DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DRG3 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC04N SN74HC04N3 OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 85 SN74HC04NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC04N SN74HC04NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI -40 to 85 SN74HC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04

www.ti.com 24-Jan-2013 Addendum-Page 3 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Top-Side Markings (4) Samples SN74HC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SN74HC04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC04 SNJ54HC04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84098012A SNJ54HC 04FK SNJ54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409801CA SNJ54HC04J SNJ54HC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8409801DA SNJ54HC04W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device.

www.ti.com 24-Jan-2013 Addendum-Page 4 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :

• Catalog: SN74HC04 , SN54HC04
• Automotive: SN74HC04-Q1 , SN74HC04-Q1
• Military: SN54HC04
• Space: SN54HC04-SP NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC04DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC04DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC04DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC04DRG4 SOIC D 14 2500 367.0 367.0 38.0 SN74HC04DRG4 SOIC D 14 2500 333.2 345.9 28.6 SN74HC04DT SOIC D 14 250 367.0 367.0 38.0 SN74HC04PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC04PWT TSSOP PW 14 250 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01

28 PINS SHOWN

8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150

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