SN54HC244 TI | Alldatasheet
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SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068 Wide Operating Voltage Range of 2 V to 6 V /C0068 High-Current Outputs Drive Up To
15 LSTTL Loads
/C0068 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers /C0068 Low Power Consumption, 80-µA Max ICC /C0068 Typical tpd = 11 ns /C0068 ±6-mA Output Drive at 5 V /C0068 Low Input Current of 1 µA Max 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND V CC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 SN54HC244 ...J O R W PACKAGE SN74HC244 . . . DB, DW, N, NS, OR PW PACKAGE (TOP VIEW) 3212 0 1 9 91 0 1 1 1 2 1 3 1Y1 2A4 1Y2 2A3 1Y3 1A2 2Y3 1A3 2Y2 1A4 SN54HC244 . . . FK PACKAGE (TOP VIEW)2Y4 1A1 1OE 1Y4 2A2 2OE 2Y1 GND 2A1 VCC description/ordering information These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HC244 devices are organized as two 4-bit buffers/drivers with separate output-enable (OE ) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
ORDERING INFORMATION
TA PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING –40 C to 85C PDIP – N Tube of 20 SN74HC244N SN74HC244N –40 C to 85C SOIC – DW Tube of 25 SN74HC244DW HC244 –40 C to 85C SOIC – DW Reel of 2000 SN74HC244DWR HC244 –40°C to 85°C SOP – NS Reel of 2000 SN74HC244NSR HC244 –40°C to 85°C SSOP – DB Reel of 2000 SN74HC244DBR HC244 TSSOP – PW Tube of 70 SN74HC244PW HC244TSSOP – PW Reel of 2000 SN74HC244PWR HC244 Reel of 250 SN74HC244PWT –55 C to 125C CDIP – J Tube of 20 SNJ54HC244J SNJ54HC244J –55°C to 125°C CFP – W Tube of 85 SNJ54HC244W SNJ54HC244W LCCC – FK Tube of 55 SNJ54HC244FK SNJ54HC244FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
(each buffer/driver) INPUTS OUTPUT OE A OUTPUT Y L H H L LL H X Z logic diagram (positive logic) 17 3 18 1Y1 2Y1 1Y2 1Y3 1Y4 2Y2 2Y3 2Y4 2OE1OE 2A1 2A2 2A3 2A4 1A1 1A2 1A3 1A4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.
SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 recommended operating conditions (see Note 3) SN54HC244 SN74HC244 UNIT MIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 2 5 6 2 5 6 V V High-level input voltage VCC = 2 V 1.5 1.5 VVIH High-level input voltage VCC = 4.5 V 3.15 3.15 VIH VCC = 6 V 4.2 4.2 V Low-level input voltage VCC = 2 V 0.5 0.5 VVIL Low-level input voltage VCC = 4.5 V 1.35 1.35 VIL VCC = 6 V 1.8 1.8 VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V t/v Input transition rise/fall time VCC = 2 V 1000 1000 ns∆t/∆v Input transition rise/fall time VCC = 4.5 V 500 500 ns VCC = 6 V 400 400 TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54HC244 SN74HC244 UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT V V = V or V I = –20 A 2 V 1.9 1.998 1.9 1.9 VV V = V or V VVOH VI = VIH or VIL OH 6 V 5.9 5.999 5.9 5.9 VOH II H I L V V = V or V I = 20 A 2 V 0.002 0.1 0.1 0.1 VV V = V or V VVOL VI = VIH or VIL OL 6 V 0.001 0.1 0.1 0.1 VOL II H I L II VI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA IOZ VO = VCC or 0, VI = VIH or VIL 6 V ±0.01 ±0.5 ±10 ±5 µA ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA C i 2 V to 6 V 3 10 10 10 pF
SN54HC244, SN74HC244 OCTAL BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS SCLS130D – DECEMBER 1982 – REVISED AUGUST 2003
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HC244 SN74HC244 UNITPARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT t A Y
2 V 40 115 170 145
nstpd A Y 4.5 V 13 23 34 29 nspd
6 V 11 20 29 25
2 V 75 150 225 190
nsten OE Y 4.5 V 15 30 45 38 nsen
6 V 13 26 38 32
nstdis OE Y 4.5 V 15 30 45 38 nsdis
2 V 28 60 90 75
nstt Y 4.5 V 8 12 18 15 nst
6 V 6 10 15 13
switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HC244 SN74HC244 UNITPARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT t A Y
2 V 56 165 245 210
nstpd A Y 4.5 V 18 33 49 42 nspd
6 V 15 28 42 35
2 V 100 200 300 250
nsten OE Y 4.5 V 20 40 60 50 nsen
6 V 17 34 51 43
2 V 45 210 315 265
nstt Y 4.5 V 17 42 63 53 nst
6 V 13 36 53 45
operating characteristics, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance per buffer/driver No load 35 pF
NOTES: A. C L includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 5962-8409601VRA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC 5962-8409601VSA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC 84096012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 8409601RA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC 8409601SA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC JM38510/65705B2A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC JM38510/65705BRA ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC JM38510/65705BSA ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC SN54HC244J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SN74HC244ADBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI SN74HC244APWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI SN74HC244DBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI SN74HC244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74HC244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74HC244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74HC244NSG4 ACTIVE SO NS 20 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244PWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI SN74HC244PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 1
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) no Sb/Br) SN74HC244PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244PWT ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC244PWTE4 ACTIVE TSSOP PW 20 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC244FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54HC244J ACTIVE CDIP J 20 1 TBD Call TI Level-NC-NC-NC SNJ54HC244W ACTIVE CFP W 20 1 TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 2
MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96
28 TERMINAL SHOWN
B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01
28 PINS SHOWN
8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
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