SN54HC139 TI | Alldatasheet
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/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0051/C0057/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0051/C0057 /C0068/C0085/C0065/C0076 /C0050/C0262/C0076/C0073/C0078/C0069 /C0084/C0079 /C0052/C0262/C0076/C0073/C0078/C0069 /C0068/C0069/C0067/C0079/C0068/C0069/C0082/C0083/C0047/C0068/C0069/C0077/C0085/C0076/C0084/C0073/C0080/C0076/C0069/C0088/C0069/C0082/C0083 SCLS108D − DEC EMBER 1982 − REVISED SEPTEMBER 2003 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 /C0068Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems /C0068Wide Operating Voltage Range of 2 V to 6 V /C0068Outputs Can Drive Up To 10 LSTTL Loads /C0068Low Power Consumption, 80-µA Max ICC /C0068Typical tpd = 10 ns /C0068±4-mA Output Drive at 5 V /C0068Low Input Current of 1 µA Max /C0068Incorporate Two Enable Inputs to Simplify Cascading and/or Data Reception description/ordering information The ’HC139 devices are designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay time of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.
ORDERING INFORMATION
TA PACKAGE † PACKAGE † ORDERABLE PART NUMBER TOP-SIDE MARKING PDIP − N Tube of 25 SN74HC139N SN74HC139N Tube of 40 SN74HC139D SOIC − D Reel of 2500 SN74HC139DR HC139SOIC − D Reel of 250 SN74HC139DT HC139 −40°C to 85°C SOP − NS Reel of 2000 SN74HC139NSR HC139−40 C to 85C SSOP − DB Reel of 2000 SN74HC139DBR HC139 Tube of 90 SN74HC139PW TSSOP − PW Reel of 2000 SN74HC139PWR HC139TSSOP − PW Reel of 250 SN74HC139PWT HC139 CDIP − J Tube of 25 SNJ54HC139J SNJ54HC139J −55°C to 125°C CFP − W Tube of 150 SNJ54HC139W SNJ54HC139W−55 C to 125C LCCC − FK Tube of 55 SNJ54HC139FK SNJ54HC139FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 321 2 0 1 9 91 01 11 21 3 NC 2Y0 2Y1 1Y0 NC 1Y1 1Y2 NC 2Y3 2Y2 V 1Y3 GND NC SN54HC139 . . . FK PACKAGE (TOP VIEW) CC NC − No internal connection 1Y0 1Y1 1Y2 1Y3 GND V CC 2Y0 2Y1 2Y2 2Y3 SN54HC139 ...J O R W PACKAGE SN74HC139 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) Copyright 2003, Texas Instruments Incorporated/C0080/C0082/C0079/C0068/C0085/C0067/C0084/C0073/C0079/C0078 /C0068/C0065/C0084/C0065 /C0105/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 /C0105/C0115 /C0099/C0117/C0114/C0114/C0101/C0110/C0116 /C0097/C0115 /C0111/C0102 /C0112/C0117/C0098/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110 /C0100/C0097/C0116/C0101/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0110/C0102/C0111/C0114/C0109 /C0116/C0111 /C0115/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0112/C0101/C0114 /C0116/C0104/C0101 /C0116/C0101/C0114/C0109/C0115 /C0111/C0102 /C0084/C0101/C0120/C0097/C0115 /C0073/C0110/C0115/C0116/C0114/C0117/C0109/C0101/C0110/C0116/C0115 /C0115/C0116/C0097/C0110/C0100/C0097/C0114/C0100 /C0119/C0097/C0114/C0114/C0097/C0110/C0116/C0121/C0046 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046 /C0079/C0110 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115 /C0099/C0111/C0109/C0112/C0108/C0105/C0097/C0110/C0116 /C0116/C0111 /C0077/C0073/C0076/C0262/C0080/C0082/C0070/C0262/C0051/C0056/C0053/C0051/C0053/C0044 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115 /C0097/C0114/C0101 /C0116/C0101/C0115/C0116/C0101/C0100 /C0117/C0110/C0108/C0101/C0115/C0115 /C0111/C0116/C0104/C0101/C0114/C0119/C0105/C0115/C0101 /C0110/C0111/C0116/C0101/C0100/C0046 /C0079/C0110 /C0097/C0108/C0108 /C0111/C0116/C0104/C0101/C0114 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0115/C0044 /C0112/C0114/C0111/C0100/C0117/C0099/C0116/C0105/C0111/C0110 /C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0105/C0110/C0103 /C0100/C0111/C0101/C0115 /C0110/C0111/C0116 /C0110/C0101/C0099/C0101/C0115/C0115/C0097/C0114/C0105/C0108/C0121 /C0105/C0110/C0099/C0108/C0117/C0100/C0101 /C0116/C0101/C0115/C0116/C0105/C0110/C0103 /C0111/C0102 /C0097/C0108/C0108 /C0112/C0097/C0114/C0097/C0109/C0101/C0116/C0101/C0114/C0115/C0046
/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0051/C0057/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0051/C0057 /C0068/C0085/C0065/C0076 /C0050/C0262/C0076/C0073/C0078/C0069 /C0084/C0079 /C0052/C0262/C0076/C0073/C0078/C0069 /C0068/C0069/C0067/C0079/C0068/C0069/C0082/C0083/C0047/C0068/C0069/C0077/C0085/C0076/C0084/C0073/C0080/C0076/C0069/C0088/C0069/C0082/C0083 SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued) The ’HC139 devices comprise two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. These decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its driving circuit. FUNCTION TABLE INPUTS OUTPUTS G SELECT OUTPUTS G B A Y0 Y1 Y2 Y3 H X X H H H H L L LL HHH L L HH LHH L H LH HLH L H H H H H L logic diagram (positive logic) 1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0051/C0057/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0051/C0057 /C0068/C0085/C0065/C0076 /C0050/C0262/C0076/C0073/C0078/C0069 /C0084/C0079 /C0052/C0262/C0076/C0073/C0078/C0069 /C0068/C0069/C0067/C0079/C0068/C0069/C0082/C0083/C0047/C0068/C0069/C0077/C0085/C0076/C0084/C0073/C0080/C0076/C0069/C0088/C0069/C0082/C0083 SCLS108D − DEC EMBER 1982 − REVISED SEPTEMBER 2003 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC139 SN74HC139 UNITMIN NOM MAX MIN NOM MAX UNIT VCC Supply voltage 2 5 6 2 5 6 V VCC = 2 V 1.5 1.5 VIH High-level input voltage VCC = 4.5 V 3.15 3.15 VVIH High-level input voltage VCC = 6 V 4.2 4.2 V VCC = 2 V 0.5 0.5 VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 VVIL Low-level input voltage VCC = 6 V 1.8 1.8 V VI Input voltage 0 VCC 0 VCC V VO Output voltage 0 VCC 0 VCC V VCC = 2 V 1000 1000 ∆t/∆v Input transition rise/fall time VCC = 4.5 V 500 500 ns∆t/∆v Input transition rise/fall time VCC = 6 V 400 400 ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
/C0083/C0078/C0053/C0052/C0072/C0067/C0049/C0051/C0057/C0044 /C0083/C0078/C0055/C0052/C0072/C0067/C0049/C0051/C0057 /C0068/C0085/C0065/C0076 /C0050/C0262/C0076/C0073/C0078/C0069 /C0084/C0079 /C0052/C0262/C0076/C0073/C0078/C0069 /C0068/C0069/C0067/C0079/C0068/C0069/C0082/C0083/C0047/C0068/C0069/C0077/C0085/C0076/C0084/C0073/C0080/C0076/C0069/C0088/C0069/C0082/C0083 SCLS108D − DECEMBER 1982 − REVISED SEPTEMBER 2003
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC TA = 25°C SN54HC139 SN74HC139 UNITPARAMETER TEST CONDITIONS VCC MIN TYP MAX MIN MAX MIN MAX UNIT 2 V 1.9 1.998 1.9 1.9 VOH VI = VIH or VIL IOH = −20 µA 6 V 5.9 5.999 5.9 5.9 VVOH VI = VIH or VIL V 2 V 0.002 0.1 0.1 0.1 VOL VI = VIH or VIL IOL = 20 µA 6 V 0.001 0.1 0.1 0.1 VVOL VI = VIH or VIL V II VI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA C i 2 V to 6 V 3 10 10 10 pF switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM TO VCC TA = 25°C SN54HC139 SN74HC139 UNITPARAMETER FROM (INPUT) TO (OUTPUT) VCC MIN TYP MAX MIN MAX MIN MAX UNIT
2 V 47 175 255 220
A or B Y 4.5 V 14 35 51 44 tpd A or B Y
6 V 12 30 44 38
nstpd 2 V 39 175 255 220 ns G Y 4.5 V 11 35 51 44G Y
6 V 10 30 44 38
2 V 38 75 110 95
tt Y 4.5 V 8 15 22 19 nstt Y
6 V 6 13 19 16
operating characteristics, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance per decoder No load 25 pF
NOTES: A. C L includes probe and test-fixture capacitance. characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 84092012A ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC 8409201EA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC 8409201FA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC JM38510/65803BEA ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC JM38510/65803BFA ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC SN54HC139J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SN74HC139D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74HC139N3 OBSOLETE PDIP N 16 TBD Call TI Call TI SN74HC139NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI SN74HC139PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC139PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 Addendum-Page 1
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) SNJ54HC139FK ACTIVE LCCC FK 20 1 TBD Call TI Level-NC-NC-NC SNJ54HC139J ACTIVE CDIP J 16 1 TBD Call TI Level-NC-NC-NC SNJ54HC139W ACTIVE CFP W 16 1 TBD Call TI Level-NC-NC-NC (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2005 Addendum-Page 2
MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96
28 TERMINAL SHOWN
B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01
28 PINS SHOWN
8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
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