SN54HC08_07 TI | Alldatasheet
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SN54HC04...J□OR□W□PACKAGE SN74HC04...D,□DB,□N,□NS,□OR□PW□PACKAGE (TOP VIEW) 1A VCC1 14 1B 4B2 13 1Y 4A 3 12 2A 4Y4 11 2B 3B5 10 2Y 3A6 9 GND 3Y7 8 SN54HC04...FK□PACKAGE (TOP VIEW) NC No□internal□connection– NC NC NC NC 2B 8 1 202 19 NCV CC 1A 4B1B 139 12 3A2Y 3Y GNDNC 10 11 DESCRIPTION/ORDERING INFORMATION Y = A/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr• B or Y = A +B in positive logic. SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SCLS081F DECEMBER 1982 REVISED JANUARY 2007 Wide Operating Voltage Range of V to V Typical t pd ns Outputs Can Drive Up To LSTTL Loads 4-mA Output Drive at V Low Power Consumption, 20- µ A Max I CC Low Input Current of µ A Max The HC08 devices contain four independent 2-input AND gates. They perform the Boolean function ORDERING INFORMATION T A PACKAGE (1) ODERABLE PART NUMBER TOP-SIDE MARKING PDIP N Reel of 1000 SN74HC08N SN74HC08N Reel of 1000 SN74HC08DE4 SOIC D Reel of 2500 SN74HC08DR HC08 Tube of 250 SN74HC08DT SN74HC08NSR SOP NS Reel of 2000 HC08 C to C SN74HC08NSRG4 SN74HC08DBR SSOP DB Reel of 2000 HC08 SN74HC08DBRE4 Tube of SN74HC08PW TSSOP PW Reel of 2000 SN74HC08PWR HC08 Tube of 250 SN74HC08PWT CDIP J Reel of 1000 SNJ54HC08J SNJ54HC08J C to 125 C CFP W Reel of 900 SNJ54HC08W SNJ54HC08W LCCC FK Reel of 2200 SNJ54HC08FK SNJ54HC08JFK (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical
applications
sheet. PRODUCTION DATA information is current as of publication date. Copyright 1982 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com A B Y Absolute Maximum Ratings (1) SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SCLS081F DECEMBER 1982 REVISED JANUARY 2007 FUNCTION TABLE (EACH INVERTER) INPUTS OUTPUT Y A B H H H L X L X L L LOGIC DIAGRAM (POSITIVE LOGIC) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range 0.5 V I IK Input clamp current (2) V I or V I V CC mA I OK Output clamp current (2) V O mA I O Continuous output current V O to V CC mA Continuous current through V CC or GND mA D package DB package θ JA Package thermal impedance (3) N package C/W NS package PW package 113 T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed. (3) The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback
www.ti.com Recommended Operating Conditions (1) SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SCLS081F DECEMBER 1982 REVISED JANUARY 2007 SN54HC08 SN74HC08 UNIT MIN NOM MAX MIN NOM MAX V CC Supply voltage V V CC V 1.5 1.5 V IH High-level input voltage V CC 4.5 V 3.15 3.15 V V CC V 4.2 4.2 V CC V 0.5 0.5 V IL Low-level input voltage V CC 4.5 V 1.35 1.35 V V CC V 1.8 1.8 V I Input voltage V CC V CC V V O Output voltage V CC V CC V V CC V 1000 1000 Δ Δ v Input transition rise or fall rate V CC 4.5 V 500 500 ns V CC V 400 400 T A Operating free-air temperature 125 C (1) All unused inputs of the device must be held at V CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs literature number SCBA004. Submit Documentation Feedback
www.ti.com Electrical Characteristics Switching Characteristics Operating Characteristics SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SCLS081F DECEMBER 1982 REVISED JANUARY 2007 over operating free-air temperature range (unless otherwise noted) T A C SN54HC08 SN74HC08 PARAMETER TEST CONDITIONS V CC UNIT MIN TYP MAX MIN MAX MIN MAX V 1.9 1.998 1.9 1.9 I OH µ A 4.5 V 4.4 4.499 4.4 4.4 V OH V I V IH or V IL V 5.9 5.999 5.9 5.9 V I OH mA 4.5 V 3.98 4.3 3.7 3.84 I OH 5.2 mA V 5.48 5.8 5.2 5.34 V 0.002 0.1 0.1 0.1 I OL µ A 4.5 V 0.001 0.1 0.1 0.1 V OL V I V IH or V IL V 0.001 0.1 0.1 0.1 V I OL mA 4.5 V 0.17 0.26 0.4 0.33 I OL 5.2 mA V 0.15 0.26 0.4 0.33 I I V I V CC or V 0.1 100 1000 1000 nA I CC V I V CC or I O V µ A C i V to V pF over operating free-air temperature range, C L pF (unless otherwise noted) (see Figure T A C SN54HC08 SN74HC08 FROM TO PARAMETER V CC UNIT (INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX V 100 150 125 t pd A Y 4.5 V ns V V 110 t t Y 4.5 V ns V T A C PARAMETER TEST CONDITIONS TYP UNIT C pd Power dissipation capacitance per inverter No load pF Submit Documentation Feedback
www.ti.com PARAMETER MEASURMENT INFORMATION NOTES: A. C includes□probe□and□test-fixture□capacitance. B. Phase□relationships□between□waveforms□were□chosen□arbitrarily. All□input□pulses□are□supplied□by□generators□having□the□following characteristics:□PRR 1□MHz,□Z =□50 ,□t =□6□ns,□t =□6□ns. C. The□outputs□are□measured□one□at□a□time□with□one□input□transition□per□measurement. D.□t and□t are□the□same□as□t . L O r f PLH PHL pd ≤ Ω From□Output Under□Test C =□50□pF (see□Note A) L LOAD□CIRCUIT Test Point VOLTAGE□WAVEFORMS INPUT□RISE AND□FALL TIMES Input 90%90%50% 50% 10% 10% tftr 0□V VCC VOLTAGE□WAVEFORMS PROPAGATION□DELAY AND□OUTPUT□TRANSITION□TIMES tPLH tPLH tPHL tPHL Input In-Phase Output Out-of-Phase Output 90% 90% 90% 50% 10% 10% 10% 50% 50% 50% 50% tf tf tr 90% 10% 50% tr VCC VOL VOH VOH 0□V VOL SN54HC08, SN74HC08 QUADRUPLE 2-INPUT POSITIVE-AND GATES SCLS081F DECEMBER 1982 REVISED JANUARY 2007 Figure Load Circuit and Voltage Waveforms Submit Documentation Feedback
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 5962-8404701VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 5962-8404701VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type 84047012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type 8404701CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type 8404701DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type JM38510/65203B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type JM38510/65203BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type JM38510/65203BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SN54HC08J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SN74HC08D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC08N3 OBSOLETE PDIP N 14 TBD Call TI Call TI SN74HC08NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC08NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 23-Jan-2007 Addendum-Page 1
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) SN74HC08PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC08PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC08FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54HC08J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type SNJ54HC08W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type SNV54HC08J ACTIVE CDIP J 14 TBD Call TI Call TI SNV54HC08W ACTIVE CFP W 14 TBD Call TI Call TI (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 23-Jan-2007 Addendum-Page 2
MLCC006B – OCTOBER 1996 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 4040140/D 10/96
28 TERMINAL SHOWN
B 0.358 (9,09) MAX (11,63) 0.560 (14,22) 0.560 0.458 0.858 (21,8) 1.063 (27,0) (14,22) ANO. OF MINMAX 0.358 0.660 0.761 0.458 0.342 (8,69) MIN (11,23) (16,26) 0.640 0.739 0.442 (9,09) (11,63) (16,76) 0.962 1.165 (23,83) 0.938 (28,99) 1.141 (24,43) (29,59) (19,32)(18,78) 0.020 (0,51) TERMINALS 0.080 (2,03) 0.064 (1,63) (7,80) 0.307 (10,31) 0.406 (12,58) 0.495 (12,58) 0.495 (21,6) 0.850 (26,6) 1.047 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.035 (0,89) 0.010 (0,25) 121314151618 17 432 0.020 (0,51) 0.010 (0,25) 12826 27 B SQ A SQ 0.055 (1,40) 0.045 (1,14) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. This package can be hermetically sealed with a metal lid. D. The terminals are gold plated. E. Falls within JEDEC MS-004
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01
28 PINS SHOWN
8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
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