CD54HC7266 TI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Features
- Four Independent EXCLUSIVE NOR Gates
- Buffered Inputs and Outputs
- Logical Comparators
- Parity Generators and Checkers
- Adders/Subtracters
- Fanout (Over Temperature Range)
- Wide Operating Temperature Range . . . -55 oC to 125oC
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types - 2V to 6V Operation - High Noise Immunity: N IL= 30%, NIH = 30%of VCC at VCC = 5V
Description
The ’HC7266 contains four independent Exclusive NOR gates in one package. They provide the system designer with a means for implementation of the EXCLUSIVE NOR function. This device is functionally the same as the TTL226. They differ in that the ’HC7266 has active high and low outputs whereas the 226 has open collector outputs. Pinout CD54HC7266 (CERDIP) CD74HC7266 (PDIP, SOIC) TOP VIEW
Ordering Information
TEMP. RANGE (oC) PACKAGE CD54HC7266F3A -55 to 125 14 Ld CERDIP CD74HC7266E -55 to 125 14 Ld PDIP CD74HC7266M -55 to 125 14 Ld SOIC CD74HC7266MT -55 to 125 14 Ld SOIC CD74HC7266M96 -55 to 125 14 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. GND V CC August 1997 - Revised September 2003 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated CD54HC7266, CD74HC7266 High-Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate [ /Title (CD74H C 7266) /Subject (High Speed C MOS Logic Q uad 2- Input EXCLU- SIVE
H = High Voltage Level, L = Low Voltage Level GND = 7 V CC = 14 nA nB nY CD54HC7266, CD74HC7266
Absolute Maximum Ratings Thermal Information DC Input Diode Current, IIK DC Output Diode Current, IOK DC Output Source or Sink Current per Output Pin, IO Operating Conditions Supply Voltage Range, VCC DC Input or Output Voltage, V Input Rise and Fall Time Thermal Resistance (Typical, Note 1) θ JA (oC/W) (SOIC - Lead Tips Only) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. PARAMETER SYMBOL TEST CONDITIONS VCC (V) 25oC -40 oC TO 85oC -55 oC TO 125oC UNITSVI(V) I O (mA) MIN TYP MAX MIN MAX MIN MAX HC TYPES High Level Input Voltage V Low Level Input Voltage High Level Output Voltage CMOS Loads V OH VIH or VIL -0.02 2 1.9 - - 1.9 - 1.9 - V High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads V OL VIH or VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V Low Level Output Voltage TTL Loads CD54HC7266, CD74HC7266
- CPD is used to determine the dynamic power consumption per gate, PD =V CC 2 fi(CPD +C L) where fi= Input Frequency, CL = Output
Load Capacitance, VCC = Supply Voltage. FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) 8404302CA ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC CD54HC7266F3A ACTIVE CDIP J 14 1 TBD Call TI Level-NC-NC-NC CD74HC7266E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC7266EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD74HC7266M ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC7266M96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC7266M96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC7266ME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC7266MT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC7266MTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 Addendum-Page 1
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2005, Texas Instruments Incorporated