82P33731

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Synchronous Equipment Timing Source for 10G/ 40G/ 100G Synchronous Ethernet 82P33731 DATA SHEET Version 5

Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance and to supply the best pos- sible product. IDT does not assume any res ponsibility for use of any circuitry described other than the circuitry embodied in a n IDT product. The Company makes no representations that circuitry described herein is free from patent infringement or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent, patent rights or other rights, of Integrated Device Technology, Inc. LIFE SUPPORT POLICY Integrated Device Technology's products are not authorized for use as critical components in life support devices or systems unless a specific written agreement pertaining to such intended use is exe- cuted between the manufacturer and an officer of IDT. 1. Life support devices or systems are devices or systems whic h (a) are intended for surgical implant into the body or (b) supp ort or sustain life and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any components of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

3©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

4©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

5©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 HIGHLIGHTS

• Synchronous Equipment Timing Source (SETS) for Synchronous Ethernet (SyncE) per ITU-T G.8264
• DPLL1 generates ITU-T G.8262 compli ant SyncE clocks, Telcordia GR-1244-CORE/GR-253-CORE, and ITU-T G.813 compliant SONET/SDH clocks
• DPLL2 performs rate conversions fo r synchronization interfaces or for other general purpose timing applications
• APLL3 is Voltage Controlled Crys tal Oscillator (VCXO) based and generates clocks with jitter <0.3 ps RMS (10 kHz to 20 MHz) for: 10GBASE-R, 10GBASE-W, 40GBASE-R and 100GBASE-R
• APLL1 and APLL2 generate clocks with jitter < 1 ps RMS (12 kHz to

20 MHz) for: 1000BASE-T and 1000BASE-X

• Fractional-N input dividers suppor t a wide range of reference fre- quencies
• Locks to 1 Pulse Per Second (PPS) references
• DPLLs, APLL1 and APLL2 can be configured from an external EEPROM after reset

FEATURES

• Composite clock inputs (IN1 and IN 2) accept 64 kHz synchronization interface signals per ITU-T G.703
• Differential reference inputs (IN3 to IN8) accept clock frequencies between 1 PPS and 650 MHz
• Single ended inputs (IN9 to IN14) accept reference clock frequencies between 1 PPS and 162.5 MHz
• Loss of Signal (LOS) pins (LOS0 to LOS3) can be assigned to any clock reference input
• Reference monitors qualify/disqua lify references depending on activ- ity, frequency and LOS pins
• Automatic reference selection state machines select the active refer- ence for each DPLL based on the reference monitors, priority tables, revertive and non-revertive settings and other programmable settings
• Fractional-N input dividers enable the DPLLs to lock to a wide range of reference clock frequencies including: 10/100/1000 Ethernet, 10G/ 40G/100G Ethernet, OTN, SONET/SDH, PDH, TDM, GSM, CPRI, and GNSS frequencies
• Any reference inputs (IN3 to IN14) can be designated as external sync pulse inputs (1 PPS, 2 kHz, 4 kHz or 8 kHz) associated with a selectable reference clock input
• FRSYNC_8K_1PPS and MFRSYNC_2K_1PPS output sync pulses that are aligned with the selected ex ternal input sync pulse input and frequency locked to the associated reference clock input
• DPLL1 can be configured with bandwidths between 0.09 mHz and 567 Hz
• DPLL1 locks to input references with frequencies between 1 PPS and

650 MHz

• DPLL2 locks to input references with frequencies between 8 kHz and
• DPLL1 complies with ITU-T G.8262 for Synchronous Ethernet Equip- ment Clock (EEC), and G.813 fo r Synchronous Equipment Clock (SEC); and Telcordia GR-253-CORE / GR-1244-CORE for Stratum 3 and SONET Minimum Clock (SMC)
• DPLL1 generates clocks with PDH, TDM, GSM, CPRI/OBSAI, 10/ 100/1000 Ethernet and GNSS frequencies; these clocks are directly available on OUT1
• DPLL2 generates N x 8 kHz clocks up to 100 MHz that are output on OUT9 and OUT10
• APLL1, APLL2 and APLL3 are connected to DPLL1
• APLL1 and APLL2 generate 10/100/1000 Ethernet, 10G Ethernet, or SONET/SDH frequencies
• APLL3 generates 10G/40G/100G Ethernet, WAN-PHY, and LAN- PHY frequencies
• Any of eight common TCXO/OCXO frequencies can be used for the System Clock: 10 MHz, 12.8 MHz, 13 MHz, 19.44 MHz, 20 MHz, 24.576 MHz, 25 MHz or 30.72 MHz
• The I2C slave interface can be used by a host processor to access the control and status registers
• The I2C master interface can aut omatically load a device configura- tion from an external EEPROM after reset; APLL3 must be config- ured via the I2C slave interface
• DPLLs can be connected to an internal composite clock generator that outputs its 64 kHz synchronization signal on OUT8
• Differential outputs OUT3 to OUT6 output clocks with frequencies between 1 PPS and 650 MHz
• Differential outputs OUT11 and OU T12 output clocks with frequen- cies up to 650 MHz
• Single ended outputs OUT1, OUT2 and OUT7 output clocks with fre- quencies between 1 PPS and 125 MHz
• Single ended outputs OUT9 and OUT10 output clocks N*8 kHz multi- ples up to 100 MHz
• DPLL1 supports independent programmable delays for each of IN3 to IN14; the delay for each input is programmable in steps of 0.61 ns with a range of ~±78 ns
• The input to output phase delay of DPLL1 is programmable in steps of 0.0745 ps with a total range of ±20 s
• The clock phase of each of the output dividers for OUT1 (from APLL1) to OUT7 is individually programmable in steps of ~200 ps with a total range of +/-180°
• 1149.1 JTAG Boundary Scan
• 144-pin CABGA green package

APPLICATIONS

• Access routers, edge routers, core routers
• Carrier Ethernet switches
• Multiservice access platforms
• P O N O L T
• LTE eNodeB
• ITU-T G.8264 Synchronous Equi pment Timing Source (SETS)
• ITU-T G.8262 Synchronous Ethernet Equipment Clock (EEC)
• ITU-T G.813 Synchronous Equipment Clock (SEC)
• Telcordia GR-253-CORE/GR1244-C ORE Stratum 3 Clock (S3) and SONET Minimum Clock (SMC) Synchronous Equipment Timing Source for 10G/ 40G/ 100G Synchronous Ethernet 82P33731 Datasheet

6©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

DESCRIPTION

The 82P33731 Synchronous Equipment Timing Source (SETS) for 10G Synchronous Ethernet (S yncE) provides tools to manage timing re fer- ences, clock generation and timing paths for SyncE based clocks, per ITU-T G.8264 and ITU-T G.8262. 82P33731 meets the requirem ents of ITU-T G.8262 for synchronous Ethernet Equipment Cl ocks (EECs) and ITU-T G.813 for Synchronous Equipment Clocks (SEC). The device outputs low-jit- ter clocks that can directly synchronize 100GBASE-R, 40GBASE-R, 10GBASE- R and 10GBASE-W and lower-rate Ethernet interfaces; as well as CPRI/OBSAI, SONET/SDH and PDH interfaces. The 82P33731 accepts six differential reference inputs and six si ngle ended reference inputs that can operate at common GNSS, E thernet, SONET/SDH and PDH frequencies that range from 1 Pulse Per Second (PPS) to 650 MHz. The device also provides two Alternate Mark Inversion (AMI) inputs for Composite Clock (CC) signal s bearing 64 kHz, 8 kHz and 0.4 kHz synchroni zation information. The references are continually moni- tored for loss of signal and for frequency offset per user programmed thresholds. All of the references are available to both Digital PLLs (DPLLs). The active reference for each DPLL is determined by forced selecti on or by automatic selection bas ed on user programmed priorities and locking allow- ances and based on the reference monitors and LOS inputs. The 82P33731 can accept a clock reference and an associated phase lock ed sync signal as a pair. DPLL1 can lock to the clock ref erence and align the frame sync and multi-frame sync outputs with the paired sync input. The device allows any of the differential or single ended reference inputs to be configured as sync inputs that can be associated with an y of the other differential or single ended reference inputs. The input sync signals can have a frequency of 1 PPS, 2 kHz, 4 kHz or 8 kHz. This feature enables DPLL1 to phase align its frame sync and multi-frame sync outputs with a sync input without the need use a low bandwidth setting to lock directly to the sync input. The DPLLs support three primary operating m odes: Free-Run, Locked and Holdover. In Free- Run mode the DPLLs synthesize clocks ba sed on the system clock alone. In Locked mode the DPLLs filter reference clock jitter with the selected bandwidth. In Locked mode, the long-term output fre- quency accuracy is the same as the long term frequency accuracy of the selected input reference. In Holdover mode, the DPLL use s frequency data acquired while in Locked mode to generate accurate frequencies when input references are not available. The 82P33731 requires a system clock for its re ference monitors and other digital circuitry. The fr equency accuracy of the syst em clock deter- mines the frequency accuracy of the DPLLs in Free-Run mode. The frequency stability of the system clock determines the frequenc y stability of the DPLLs in Free-Run mode and in Holdover mode; and it affects the wander generation of the DPLLs in Locked mode. When used with a suitable system clock, DPLL1 meets the frequenc y accuracy, pull-in, hold-in, pul lout, noise generation, noise tolerance, tran- sient response, and holdover performance requirements of the fo llowing applications: ITU-T G.8262/G.813 EEC/SEC options 1 and 2, Telcordia GR- 1244 Stratum 3 (S3), Telcordia GR-253-CORE S3 and SONET Minimum Clock (SMC). DPLL1 can be configured with a range of selectable filtering bandwidths from 0.09 mHz to 567 Hz. The 17 mHz bandwidth can be used to lock the DPLL directly to a 1 PPS reference. The 92 mHz bandwidth can be used for G.8262/G.813 Option 2, or Telcordia GR-253-CORE S3, or SMC applica- used for Telcordia GR-1244-CORE S3 applications. Bandwidths above 10 Hz can be used in jitter attenuation and rate conversion applications. DPLL2 is a wideband (BW > 25Hz) frequency translator that can be used, for example, to convert a recovered line clock to a 1.54 4 MHz or 2.048 MHz synchronization interface clock. For SETS applications per ITU-T G.8264, DPLL1 is configured as an EEC/SEC to output clocks for the T0 reference point and DPLL2 is used to output clocks for the T4 reference point. Clocks generated by DPLL1 can be passed thr ough APLL1 or APLL2 which are LC based jitter attenuating Analog PLLs (APLLs). The o utput clocks generated by APLL1 and APLL2 are suitable for serial GbE and lower rate interfaces. Clocks generated by DPLL1 can be passed through APLL3 which is a vo ltage controlled crystal oscillator (VCXO) based jitter atte nuating APLL. APLL3 can be provisioned with one or two sele ctable crystal resonators to support up to two base frequencies. The output clocks generated by APLL3 are suitable for multi-lane 100GBASE-R, 40GBASE-R and lower rate interfaces. The device provides an AMI output for a CC signal bearing 64 kHz, 8 kHz and 0.4 kHz sync hronization information. The CC output can be con- nected to either DPLL1 or DPLL3. All 82P33731 control and status registers are accessed through an I2C slave microprocesso r interface. For configuring the DPLLs , APLL1 and APLL2, the I2C master interface can automatically load a configur ation from an external EEPROM after reset. APLL3 must be configured via the I2C slave interface.

Figure 1. Functional Block Diagram

1 PIN ASSIGNMENT

Figure 2. Pin Assignment (Top View)

9©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

2 PIN DESCRIPTION

Table 1: Pin Description Pin No. Name I/O Type Description Global Control Signal E1 OSCI I CMOS OSCI: Crystal Oscillator System Clock A clock provided by a crystal oscillator is input on this pin. It is the system clock for the device. The oscillator frequency is selected via pins XO_FREQ0 ~ XO_FREQ2 K8 MS/SL I pull-up CMOS MS/SL: Master / Slave Selection This pin, together with the MS_SL_CTRL bit, controls whether the device is configured as the Master or as the Slave. The signal level on this pin is reflected by the MASTER_SLAVE bit. A11 SONET/SDH/ LOS3 I pull-down CMOS SONET/SDH: SONET / SDH Frequency Selection During reset, this pin determines the default value of the IN_SONET_SDH bit (b2, 09H): High: The default value of the IN_SONET_SDH bit is ‘1’ (SONET); Low: The default value of the IN_SONET_SDH bit is ‘0’ (SDH). After reset, this pin takes on the operation of LOS3 LOS3- This pin is used to disqualify input clocks. See input clocks section for more details. K6 RSTB I pull-up CMOS RSTB: Reset Refer to section 2.2 reset operation for detail. XO_FREQ0/ LOS0 XO_FREQ1/ LOS1 XO_FREQ2/ LOS2 I pull-down CMOS XO_FREQ0 ~ XO_FREQ2: These pins set the oscillator frequency. XO_FREQ[2:0] Oscillator Frequency (MHz) 000 10.000 001 12.800 010 13.000 011 19.440 100 20.000 101 24.576 110 25.000 111 30.720 LOS0 ~ LOS2 - These pins are used to disqualify input clocks. See input clocks section for more details. After reset, this pin takes on the operation of LOS0-LOS2 Input Clock and Frame Synchronization Input Signal K10 IN1 I AMI IN1: Input Clock 1 A 64 kHz + 8 kHz or 64 kHz + 8 kHz + 0.4 kHz composite clock is input on this pin. AMI input has internal 1k ohm to 1.5V termination. K9 IN2 I AMI IN2: Input Clock 2 A 64 kHz + 8 kHz or 64 kHz + 8 kHz + 0.4 kHz composite clock is input on this pin. AMI input has internal 1k ohm to 1.5V termination. M12 M11 IN3_POS IN3_NEG I PECL/LVDS IN3_POS / IN3_NEG: Positive / Negative Input Clock 3 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. L12 L11 IN4_POS IN4_NEG I PECL/LVDS IN4_POS / IN4_NEG: Positive / Negative Input Clock 4 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. K12 K11 IN5_POS IN5_NEG I PECL/LVDS IN5_POS / IN5_NEG: Positive / Negative Input Clock 5 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. J12 J11 IN6_POS IN6_NEG I PECL/LVDS IN6_POS / IN6_NEG: Positive / Negative Input Clock 6 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. G12 G11 IN7_POS IN7_NEG I PECL/LVDS IN7_POS / IN7_NEG: Positive / Negative Input Clock 7 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. F12 F11 IN8_POS IN8_NEG I PECL/LVDS IN8_POS / IN8_NEG: Positive / Negative Input Clock 8 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin.

10©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet J10 IN9 I pull-down CMOS IN9: Input Clock 9 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. H10 IN10 I pull-down CMOS IN10: Input Clock 10 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. G10 IN11 I pull-down CMOS IN11: Input Clock 11 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. F10 IN12 I pull-down CMOS IN12: Input Clock 12 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. E11 IN13 I pull-down CMOS IN13: Input Clock 13 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. E10 IN14 I pull-down CMOS IN14: Input Clock 14 A reference clock is input on this pin.This pin can also be used as a sync input, and in this case a 2 kHz, 4 kHz, 8 kHz, or 1PPS signal can be input on this pin. Output Frame Synchronization Signal E12 FRSYNC _8K_1PPS OC M O S FRSYNC_8K_1PPS: 8 kHz Frame Sync Output An 8 kHz signal or a 1PPS sync signal is output on this pin. C12 MFRSYNC _2K_1PPS OC M O S MFRSYNC_2K_1PPS: 2 kHz Multiframe Sync Output A 2 kHz signal or a 1PPS sync signal is output on this pin. Output Clock OUT1 OUT2 OC M O S OUT1 ~ OUT2: Output Clock 1 ~ 2 OUT3_POS OUT3_NEG O PECL/LVDS OUT3_POS / OUT3_NEG: Positive / Negative Output Clock 3 This output is set to LVDS by default. OUT4_POS OUT4_NEG O PECL/LVDS OUT4_POS / OUT4_NEG: Positive / Negative Output Clock 4 This output is set to LVDS by default. OUT5_POS OUT5_NEG O PECL/LVDS OUT5_POS / OUT5_NEG: Positive / Negative Output Clock 5 This output is set to LVDS by default. OUT6_POS OUT6_NEG O PECL/LVDS OUT6_POS / OUT6_NEG: Positive / Negative Output Clock 6 This output is set to LVDS by default. C4 OUT7 O CMOS OUT7: Output Clock 7 M10 OUT8_POS OUT8_NEG OA M I OUT8_POS / OUT8_NEG: Positive / Negative Output Composite Clock A 64 kHz + 8 kHz or 64 kHz + 8 kHz + 0.4 kHz composite clock is differentially output on this pair of pins. D12 OUT9 O CMOS OUT9: Output Clock 9 D11 OUT10 O CMOS OUT10: Output Clock 10 OUT11_POS OUT11_NEG O PECL/LVDS OUT11_POS / OUT11_NEG: Positive / Negative Output Clock 11 OUT12_POS OUT12_NEG O PECL/LVDS OUT12_POS / OUT12_NEG: Positive / Negative Output Clock 12 Miscellaneous C9, A9, D8 CAP1, CAP2, CAP3 CAP1, CAP2 and CAP3: Analog Power Filter Capacitor connection 1 to 3. These capacitors are be part of the power filtering. A12 XTAL1_IN I Analog Crystal oscillator 1 input. Determines first of two frequency families (Sonet/SDH, Ethernet or Ethernet*66/64) available for APLL3. Connect to ground if XTAL1 is not used. Table 1: Pin Description (Continued) Pin No. Name I/O Type Description

11©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet B12 XTAL1_OUT O Analog Crystal oscillator 1 output. Leave open if XTAL1 is not used. A10 XTAL2_IN I Analog Crystal oscillator 2 input. Determines first of two frequency families (chosen from Sonet/SDH, Ethernet or Ethernet*66/ 64) available for APLL3. Connect to ground if XTAL2 is not used B10 XTAL2_OUT O Analog Crystal oscillator 2 output. Leave open if XTAL2 is not used. Lock Signal E9 DPLL2_LOCK OC M O S DPLL2_LOCK This pin goes high when DPLL2 is locked H9 DPLL1_LOCK OC M O S DPLL1_LOCK This pin goes high when DPLL1 is locked Microprocessor Interface J9 INT_REQ O Tri-state CMOS INT_REQ: Interrupt Request This pin is used as an interrupt request. B11 C11 MPU_MODE1/ I2CM_SCL MPU_MODE0/ I2CM_SDA I/O pull-up CMOS/ Open Drain MPU_MODE[1:0]: Microprocessor Interface Mode Selection During reset, these pins determine the default value of the MPU_SEL_CNFG[1:0] bits as fol- lows: 00: I2C mode 01 ~ 10: Reserved 11: I2C master (EEPROM) mode I2CM_SCL: Serial Clock Line In I2C master mode, the serial clock is output on this pin. I2CM_SDA: Serial Data Input for I2C Master Mode In I2C master mode, this pin is used as the for the serial data. D9 I2C_AD2 I pull-down CMOS I2C_AD2: Device Address Bit 2 I2C_AD[2:1] pins are the address bus of the microprocessor interface. E5 I2C_AD1 I pull-down CMOS I2C_AD1: Device Address Bit 1 I2C_AD[2:1] pins are the address bus of the microprocessor interface. D10 I2C_SCL I CMOS I2C_SCL: Serial Clock Line The serial clock is input on this pin. C5 I2C_SDA I/O Open Drain I2C_SDA: Serial Data Input/Output This pin is used as the input/output for the serial data. JTAG (per IEEE 1149.1) F1 TMS I pull-up CMOS TMS: JTAG Test Mode Select The signal on this pin controls the JTAG test performance and is sampled on the rising edge of TCK. K3 TRSTB I pull-up CMOS TRSTB: JTAG Test Reset (Active Low) A low signal on this pin resets the JTAG test port. This pin should be connected to ground when JTAG is not used. G1 TCK I pull-down CMOS TCK: JTAG Test Clock The clock for the JTAG test is input on this pin. TDI and TMS are sampled on the rising edge of TCK and TDO is updated on the falling edge of TCK. If TCK is idle at a low level, all stored-state devices contained in the test logic will indefinitely retain their state. L3 TDI I pull-up CMOS TDI: JTAG Test Data Input The test data are input on this pin. They are clocked into the device on the rising edge of TCK. Table 1: Pin Description (Continued) Pin No. Name I/O Type Description

12©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

2.1 RECOMMENDATIONS FOR UNUSED INPUT

2.1.1 INPUTS

All control pins have internal pul l-ups or pull-downs; additional resis- tance is not required but can be added for additional protection. A 1k Ω resistor can be used. Single-Ended Clock Inputs For protection, unused single- ended clock inputs should be tied to ground. Differential Clock Inputs For applications not requiring the use of a differential input, both *_POS and *_NEG can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from _POS to ground. XTAL Inputs For applications not requiring the use of a crystal oscillator input, both _IN and _OUT can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from _IN to ground.

2.1.2 OUTPUTS

For applications not requiring the use of a status pin, we recommend bringing out to a test point for debugging purposes. Single-Ended Clock Outputs All unused single-ended clock outputs can be left floating, or can be brought out to a test point for debugging purposes. Differential Clock Outputs All unused differential outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. L5 TDO O tri-state CMOS TDO: JTAG Test Data Output The test data are output on this pin. They are clocked out of the device on the falling edge of TCK. TDO pin outputs a high impedance signal except during the process of data scanning. Power & Ground C1, C6, C7, D2, F2, F9, G2, H2, K1, K2 VDDA Power - VDDA: Analog Core Power - +3.3V DC nominal A5, A7, B2, B3, L4, M4 VDDAO Power VDDAO: Analog Output Power - +3.3V DC nominal E4, E6, L7, M8 VDDDO Power VDDDO: Digital Output Power - +3.3V DC nominal D5, F7 VDDD Power VDDD: Digital Core Power - +3.3V DC nominal L10, H12 VDDD_1_8 Power VDDD_1_8: Digital Core Power - +1.8V DC nominal B9, C2, D1, D6, D7, E2, E8, F3, F8, H3, L1, L2 VSSA Ground - VSSA: Ground B1, B4, B5, B7, K4, M3 VSSAO Ground VSSAO: Ground E7, F4, K7, M7 VSSDO Ground VSSDO: Ground D4, F6, H11, L9 VSSD Ground VSSD: Ground D3 VSSCOM Ground - VSSCOM: Ground C3, F5, G4, G5, G6, G8, H4, H5, H6, H7, H8, J3, J4, J5, J6, J7, J8 VSS Ground - VSS: Ground Other C8, C10, E3, G3, G7, G9, L6 IC - - IC: Internal Connection Internal Use. This pin must be left open for normal operation. Table 1: Pin Description (Continued) Pin No. Name I/O Type Description

2.2 RESET OPERATION

or pulsed low for at least 50us after this time. from RSTB de-assert to have stable clocks is 10ms. Figure 3. Reset timing diagram

3 FUNCTIONAL DESCRIPTION

3.1 SYNCHRONOUS ETHERN ET (SYNCE), SONET,

• ITU-T Recommendation G.8262, Ti ming characteristics of Syn- chronous Ethernet Equipment slave clock (EEC)
• ITU-T Recommendation G.8264, Di stribution of timing through packet networks
• ITU-T Recommendation G.812, Ti ming requirements of slave clocks suitable for use as node clocks in synchronization networks.
• ITU-T Recommendation G.813, Ti ming characteristics of SDH equipment slave clocks (SEC).
• GR-253-CORE - Telcordia Technol ogies Generic Requirements - Issue 5, October 2009
• GR-1244-CORE - Telcordia Technol ogies Generic Requirements - Issue 4, October 2009
• ATIS-0900101.2006 - T1.101 - Synchronization Interface Standard Figure 4 shows a single blade architecture that it is usually used in simple equipment. As an example, for a specific 10G PHY, the maximum jitter requirement is 0.3ps from 10 kHz to 20 MHz. The 82P33731 does meet this tight jitter requirement. Figure 5 shows an active/redundant architecture, as described before it is usually used in Telecom equipment that are designed to have a redundant timing card in case of primary timing card failure. The redundant timing card mimics the output of the active timing card, so in case of failure the system will still provide proper synchronization. Single Blade CDR SyncE/ SONET /SDH PHY SyncE-RxCK SyncE-TxCK Ethernet TCXO BITS/SSU SyncE (T0) A PL L LOS

Figure 4. SyncE/SONET/SDH single blade application

Figure 5. SyncE/SONET/SDH active/redundant application

16©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

3.2 HARDWARE FUNCTI ONAL DESCRIPTION

3.2.1 SYSTEM CLOCK

A crystal oscillator should be used as an input on the OSCI pin. This clock is provided for the device as a system clock. The system clock is used as a reference clock for all the internal circuits. The active edge of the system clock can be selected by the OSC_EDGE bit in xo_freq_cnfg register. Eight common oscillator frequencies can be used for the stable Sys- tem Clock. The oscillator frequency can be set by pins or by xo_fre- q_cnfg register as shown in Table 2. An offset from the nominal frequency may be compensated by set- ting the NOMINAL_FREQ_VALUE[23:0] bits. The calibration range is within ±741 ppm. The crystal oscillator should be c hosen accordingly to meet different applications and standard requirements. (See AN-807 Recommended Crystal Oscillators for NetSynchro WAN PLL).

3.2.2 MODES OF OPERATION

3.2.2.1 DPLL1 Operating Mode

The DPLL1 can operate in several different modes as shown in Table 3. The DPLL1 operating mode is controlled by the DPLL1_OPERAT- ING_MODE[4:0] bits When the operating mode is switched automatically, the operation of the internal state machine is shown in Figure 6. Whether the operating mode is under ex ternal control or is switched automatically, the current operating mode is always indicated by the DPLL1_DPLL_OPERATING_STS[4:0] bits. When the operating mode switches, the DPLL1_OPERATING_ STS bit will be set. If the DPLL1_OPERATING_STS bit is ‘1’, an interrupt will be generated if the corresponding mask bit is set to “1”, the mask bit is set to “0” by default. Table 2: Oscillator Frequencies xo_freq[2:0] pins xo_freq_cnfg[2:0] bits Oscillator Frequency (MHz) 000 10.000 001 12.800 010 13.000 011 19.440 100 20.000 101 24.576 110 25.000 111 30.720 Table 3: DPLL1 Operating Mode Control DPLL1_OPERATING_MODE[4:0] DPLL1 Operating Mode

00000 Automatic

00001 Forced - Free-Run

00010 Forced - Holdover

00011 Reserved

00100 Forced - Locked

00101 Forced - Pre-Locked2

00110 Forced - Pre-Locked

00111 Forced - Lost-Phase

01010 DCO write frequency

see Chapter 3.2.2.1.6) 10010 - 11111 Reserved 10011-11111 Reserved

Figure 6. DPLL Automatic Operating Mode

1. An input clock is selected.
2. The DPLL selected input clock is disqualified AND No qualified input clock is available.
3. The DPLL selected input clock is switched to another one.
4. The DPLL selected input clock is locked (the DPLL_LOCK bit is ‘1’).
5. The DPLL selected input clock is disqualified AND No qualified input clock is available.
6. The DPLL selected input clock is unlocked (the DPLL_LOCK bit is ‘0’).
7. The DPLL selected input clock is locked again (the DPLL_LOCK bit is ‘1’).
8. The DPLL selected input clock is switched to another one.
9. The DPLL selected input clock is locked (the DPLL_LOCK bit is ‘1’).
10. The DPLL selected input clock is disqualified AND No qualified input clock is available.
11. The DPLL selected input clock is switched to another one.
12. The DPLL selected input clock is disqualified AND No qualified input clock is available.
13. An input clock is selected.
14. The DPLL selected input clock is switched to another one.

18©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

3.2.2.1.1 Free-Run Mode

In Free-Run mode, the DPLL1 output refers to the system clock and is not affected by any input clock. The accuracy of the DPLL1 output is equal to that of the system clock.

3.2.2.1.2 Pre-Locked Mode

In Pre-Locked mode, the DPLL1 output attempts to track the selected input clock. The Pre-Locked mode is a secondary, temporary mode.

3.2.2.1.3 Locked Mode

In Locked mode, the DPLL1 is lock ed to the input clock. The phase and frequency offset of the DPLL1 output track those of the DPLL1 selected input clock. For a closed loop, different bandwidths and damping factors can be used depending on DPLL locking stages: starting, acquisition and locked. In the first two seconds when the DPLL1 attempts to lock to the selected input clock, the starting bandwidth and damping factor are used. They are set by the DPLL1_START_BW[4:0] bits and the DPLL1_START_DAMPING[2:0] bits respectively. During the acquisition, the acquisition bandwidth and damping factor are used. They are set by the DPLL1_ACQ_BW[4:0] bits and the DPLL1_ACQ_DAMPING[2:0] bits respectively. When the DPLL1 is locked, the locked bandwidth and damping factor are used. They are set by the DPLL1_LOCKED_BW[4:0] bits and the DPLL1_LOCKED_DAMPING[2:0] bits respectively. The corresponding bandwidth and damping factor are used when the DPLL1 operates in different locki ng stages: starting, acquisition and locked, as controlled by the device automatically. The locked bandwidth is selectable can be set as shown in Table 4.

19©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 4: DPLL1 Locked Bandwidth DPLL1_LOCKED_BW[4:0] BW Application 00000 0.090 mHz 00001 0.27 mHz 00010 0.90 mHz stratum 3E, BW<1mHz 00011 2.9 mHz G.812 Type I, BW< 3mHz 00100 4.3 mHz 00101 8.7 mHz 00110 17 mHz 00111 35 mHz 01000 69 mHz 01001 92 mHz GR-253 stratum 3, SMC and EEC- option, 2, BW < 0.1Hz 01010 277 mHz 01011 554 mHz 01100 1.1 Hz EEC-option 1, 1< BW <10 GR-1244 stratum 3, BW<3Hz 01101 2.2 Hz EEC-option 1, 1< BW <10 GR-1244 stratum 3, BW<3Hz 01110 4.4 Hz EEC-option 1, 1< BW <10 01111 8.9 Hz EEC-option 1, 1< BW <10 10000 18 Hz 10001 35 Hz 10010 71 Hz 10011 142 Hz 10100 283 Hz 10101 567 Hz 10110-11111 Reserved

3.2.2.1.4 Pre-Locked2 Mode

The Pre-Locked2 mode is a secondary, temporary mode.

3.2.2.1.5 Lost-Phase Mode

The Lost-Phase mode is a secondary, temporary mode.

3.2.2.1.6 DCO Control Modes

for details, see section 3.2.8.3 Output Phase control on page 34. Figure 7. DCO frequency offset control functional block diagram

21©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

3.2.2.1.7 Holdover Mode

In Holdover mode, the DPLL1 resorts to the stored frequency data acquired in Locked mode to control its output. The DPLL1 output is not phase locked to any input clock. The frequency offset acquiring method is selected by the man_holdover bit, auto_avg bit, the hist_mode [1:0] bits, and the avg_mode[1:0] bits in DPLL1_holdover_mode_cnfg regis- ters as shown in Table 5: The default value for holdover mode is set to current averaged value with holdover filter BW of ~1.5mHz. In this mode the initial frequency off- set is better than 1.1e-5ppm assuming that there is no in-band jitter/wan- der at the input just before enteri ng holdover state. The default mode is used for Telcordia GR-1244, Telcordia GR-253, ITU-T G.8262 and ITU-T G.813 to meet holdover requirements. In Manual Mode, the frequency offset is set by the DPLL1_hold- over_freq_cnfg[39:0] bits. The accuracy is1.686305041e-10 ppm, how- ever the resolution is affected by the frequency offset applied, so when writing the frequency offset, t he programming resolution is [(77760/ 1638400) * 2^-48] * (1 + offset-in-ppm / 1e6). The offset value, which is ac quired by the modes shown in Table 5, can be read from the holdover_freq_c nfg[39:0] bits by setting the read_avg bit to “1”. If read_avg bit is set to “0” then the value in hold- over_freq_cnfg[39:0] bits is the val ue written into it. The value is 2’s complement signed number, and the total range is +/- 92 ppm. The holdover frequency resolution is calculated as follows: Holdover Frequency resolution: HO_freq_res = (77760/1638400) * 2^-48 The Holdover value read from register bits holdover_freq_cnfg[[39:0] must be converted to decimal: HO_value_dec = holdover_freq_cnfg[39:0] value in decimal The frequency offset in ppm is calculated as follows: Holdover Frequency Offset (ppm) = (HO_freq_res * HO_value_dec)/ (1-((HO_freq_res * HO_value_dec)/1e6))

3.2.2.1.8 Hitless Reference Switching

Bit hitless_switch_en in DPLL1_m on_sw_pbo_cnfg register can be used to set hitless reference switch ing. When a Hitless Switching (HS) event is triggered, the phase offset of the selected input clock with respect to the DPLL1 output is measured. The device then automatically accounts for the measured phase offset and compensates for the appro- priate phase offset into the DPLL output so that the phase transients on the DPLL1 output are minimized. The input frequencies should be set to frequencies equal to 8kHz or higher. If hitless_switch_en is set to “1”, a HS event is triggered if any one of the following conditions occurs:

• DPLL1 selected input clock switches to a different reference
• DPLL1 exits from Holdover mode or Free-Run mode Table 5: Frequency Offset Control in Holdover Mode man_hold over auto_avg hist_mode [1:0] avg_mode[1 :0] Frequency Offset Acquiring Method 0 don’t-care don’t-care Averaged 0 0 Current averaged value with holdover filter BW of ~0.18mHz 0 1 Current averaged value with holdover filter BW of ~1.5mHz 1 0 Current averaged value with holdover filter BW of ~12mHz 1 1 Current averaged value with holdover filter BW of ~0.15Hz 0 0 Averaged value 1 second before with holdover filter BW of ~0.18mHz 0 1 Averaged value 1 second before with holdover filter BW of ~1.5mHz 1 0 Averaged value 1 second before with holdover filter BW of ~12mHz 1 1 Averaged value 1 second before with holdover filter BW of ~0.15Hz 0 0 Averaged value 8 seconds before with holdover filter BW of ~0.18mHz 0 1 Averaged value 8 seconds before with holdover filter BW of ~1.5mHz 1 0 Averaged value 8 seconds before with holdover filter BW of ~12mHz 1 1 Averaged value 8 seconds before with holdover filter BW of ~0.15Hz 0 0 Averaged value 64 seconds before with holdover filter BW of ~0.18mHz 0 1 Averaged value 64 seconds before with holdover filter BW of ~1.5mHz 1 0 Averaged value 64 seconds before with holdover filter BW of ~12mHz 1 1 Averaged value 64 seconds before with holdover filter BW of ~0.15Hz 1 don’t-care Manual - values is set by DPLL1_holdover_freq_cnfg register

and maintain the current phase offset.

3.2.2.1.9 Phase Slope Limit

options are shown in Table 6. mable limit is 1484.3614 us/s.

3.2.2.1.10 Frequency Offset Limit

limit (refer to Chapter 3.2.4.3).

3.2.2.2 DPLL2 Operating Mode

write “0” to bit DPLL2_dpll_pdn in pdn_conf register to enable it. Figure 8. DPLL2 Automatic Operating Mode

1. An input clock is selected.
2. An input clock is selected.
3. No input clock is selected.

3.2.2.2.1 Free-Run Mode

equal to that of the system clock.

3.2.2.2.2 Locked Mode

DPLL2 is a wide BW DPLL, with loop bandwidth higher than 25Hz.

3.2.2.2.3 Holdover Mode

value to meet different standards according to this table.

000 Automatic

001 Forced - Free-Run

010 Forced - Holdover

100 Forced - Locked

23©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet manually set to go into holdover, the initial frequency accuracy is 4.4X10-8 ppm. DPLL2_auto_avg = 1: averaged frequency value is used as holdover frequency. The holdover average bandwid th is about 1.5mHz. In this mode the initial frequency offset is 1.1e-5ppm assuming that there is no in-band jitter/wander at the input just before entering holdover state.

3.2.2.2.4 Frequency Offset Limit

The DPLL2 output is limited to be within the DPLL hard limit (refer to Chapter 3.2.4.3).

3.2.3 INPUT CLOCKS AND FRAME SYNC

The 82P33731 has 14 input clocks that can also be used for frame sync pulses. The 82P33731 supports Telecom and Ethernet frequencies from 1PPS up to 650 MHz. IN1 and IN2 support the AMI input signal only. The input clock is a 64 kHz + 8 kHz or 64 kHz + 8 kHz + 0.4 kHz composite clock. The 400hz_- sel bit should be set to match the input frequency. Any input violation that does not meet the standard composite clock structure will trigger an AMI violation. The AMI violation is indicated by the AMI1_VIOL/ AMI2_VIOLbit, which will trigger an in terrupt on INT_REQ pin if there is an AMI violation and the respective in terrupt mask bit is set. By default the interrupt mask bit is not set. Any of the input clocks can be used as a frame pulse or sync signal. The SYNC_sel[3:0] bits in INn_los_sync_cnfg (14 < n < 1) registers sets which pin is used as frame pulse or sync signal. IN3 to IN14 can be used for 2 kHz, 4 kHz or 8 kHz frame pulses or 1PPS sync signal.The input frequency should match the setting in the sync_freq[1:0] bits in DPLL1_input_mode_cnfg register.

3.2.3.1 Input Clock Pre-divider

Each input clock is assigned an inte rnal Pre-divider. The Pre-divider can be used to divide the clock frequency down to a convenient fre- quency, such as 8 kHz for the internal DPLL1. Note that T1 and E1 refer- ences can exhibit substantial jitter with frequencies above 4 kHz. These references should be applied to DPLL1 without being divided down to 8 kHz. For IN1 and IN2, the DPLL required frequency is fixed to 8 kHz (i.e., the corresponding IN_FREQ[3:0] bits are ‘0000’). The 8 kHz clock is extracted from the composite cloc k and the Pre-divider is bypassed automatically. For IN3 ~ IN14, the DPLL required frequency is set by the corre- sponding IN_FREQ[3:0] bits. Table 8: IN_FREQ[3:0] DPLL Frequency IN_FREQ[3:0] Bits DPLL Frequency 0000 8 kHz 0001 1.544 MHz/ 2.048 MHz (depends on SONET/ SDH bit) 0010 6.48 MHz 0011 19.44 MHz 0100 25.92 MHz 0101 38.88 MHz 0110 - 1000 Reserved 1001 2 kHz 1010 4 kHz 1011 1 PPS 1100 6.25 MHz

1101 Reserved

1111 Reserved

Each Pre-divider consists of an FEC divider and a DivN divider,. block diagram of the pre-dividers for an input clock. FREQ[3:0] bits should be set to match the input frequency. also associated with another reference input used as SYNC.

1. Write the lower eight bits of the division factor to the
2. Write the higher eight bits of the division factor to the

Figure 9. Pre-divider for an input clock

3.2.3.2 Input Clock Quality Monitoring

• LOS (loss of signal) (only for IN1 and IN2)
• Activity
• Frequency LOS monitoring is only conducted on IN1 and IN2. Activity and fre- quency monitoring are conducted on all the input clocks. The qualified clocks are available for selection for all 3 DPLLs.

3.2.3.2.1 Loss of Signal (LOS) Monitoring

when the amplitude rises higher than +1 Vp-p.

3.2.3.2.2 Activity Monitoring

Each input clock is assigned an internal leaky bucket accumulator. with respect to the system clock within a 128 ms period. There are four configurations (0 - 3) for a leaky bucket accumulator. INn_NO_ACTIVITY_ALARM bit (14  n  1). Figure 10. Input Clock Activity Monitoring

3.2.3.2.3 Frequency Monitoring

the output of DPLL1, as determined by the FREQ_MON_CLK bit. Accepting Threshold and Soft Alarm Rejecting Threshold.  n  1) in the same way as hard alarm.

1. Read the value in the IN_FREQ_VALUE[7:0] bits and calculate

Figure 11. Hysteresis Frequency Monitoring

3.2.3.3 Input Clock Selection

3.2.3.3.1 Forced Selection

3.2.3.3.2 Automatic Selection

process is shown in Figure 12. Figure 12. Qualified Input Clocks for Automatic Selection set for frequencies  8 kHz, by default it is set to ‘0’. clock to be valid; otherwise, it is invalid.

• No LOS (the AMI1_LOS / AMI2_LOS bit is ‘0’);
• No no-activity alarm (the INn_NO_ACTIVITY_ALARM bit is ‘0’);
• No frequency hard alarm (the INn_FREQ_HARD_ALARM bit is ‘0’);
• No phase lock alarm, i.e., the INn_PH_LOCK_ALARM bit is ‘0’;
• If the ULTR_FAST_SW bit is ‘1’, the DPLL selected input clock misses less than (<) 2 consecutive clock cycles; if the ULTR_- FAST_SW bit is ‘0’, this condition is ignored;
• LOS[3:0] are not set to disqualify the input clock For DPLL2, the following conditions must be satisfied for the input clock to be valid; otherwise, it is invalid.
• No LOS (the AMI1_LOS / AMI2_LOS bit is ‘0’);
• No no-activity alarm (the INn_NO_ACTIVITY_ALARM bit is ‘0’);
• No frequency hard alarm (the INn_FREQ_HARD_ALARM bit is ‘0’);
• LOS[3:0] are not set to disqualify the input clock The INn bit (14  n  1) indicates whether or not the clock is valid. When the input clock changes from ‘valid’ to ‘invalid’, or from ‘invalid’ to ‘valid), the INn bit will be set. If the INn bit is ‘1’, an interrupt will be gen- erated. When the DPLL selected input clock has failed, i.e., the selected input clock changes from ‘valid’ to ‘invalid’, the DPLL_MAIN_REF_- FAILED bit will be set. If the DPLL_MAIN_REF_FAILED bit is ‘1’, an interrupt will be generated. Table 9: Input Clock Selection for DPLL1 and DPLL2 DPLL1/2 _INPUT_SEL[3:0] Input Clock Selection

0000 Automatic selection

28©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet For DPLL1, Revertive and Non-Reve rtive switchings are supported, as selected by the REVERTIVE_MODE bit. For DPLL2, only Revertive switching is supported. GR-1244 defines Revertive and Non-Revertive Reference switching. In Non-Revertive switching, a switch to an alternate reference is main- tained even after the original refer ence has recovered from the failure that caused the switch. In Revertive switching, the clock switches back to the original reference after that reference recovers from the failure, independent of the condition of the alternate reference. In Non-Revertive switching, input clock switch is minimized. In Revertive switching, the selected input clock is switched when another qualified input clock with a higher priority than the current selected input clock is available. Therefore, if REVERTIVE_MODE bit is set to “1”, then the selected input clock is switched if any of the following is satisfied:

• the selected input clock is disqualified;
• another qualified input clock with a higher priority than the selected input clock is available. A qualified input clock with the highest priority is selected by revertive switching. If more than one qualified input clock INn is available, then it is important to set appropriate priori ties to the input clocks, two input clocks must not have the same priority. In Non-Revertive switching, the DPLL1 selected input clock is not switched when another qualified input clock with a higher priority than the current selected input clock becom es available. In this case, the selected input clock is switched and a qualified input clock with the high- est priority is selected only when t he DPLL1 selected input clock is dis- qualified. If more than one qualified input clock INn is available, then it is important to set appropriate prioriti es to the input clocks, two input clocks must not have the same priority.

3.2.3.3.3 Selected / Qualified Input Clocks Indication

The selected input clock is indi cated by the CURRENTLY_SELECT- ED_INPUT[3:0] bits. When the device is configured in Automatic selection and Revertive switching is enabled, the input clock indicated by the CURRENTLY_SE- LECTED_INPUT[3:0] bits is the same as the one indicated by the HIGH- EST_PRIORITY_VALIDATED[3:0] bits.

3.2.3.3.4 Input Clock Loss of Signal

There are 4 LOS input pins (LOS[3:0 ]) that can be used to disqualify the input clock. If they are set high, then the associated input clock is disqualified to be used as an input clock, and therefore the DPLLs will not lock to that particular input clock. The 4 LOS pins can be associated with any input clock by setting bits LOS_EN in INn_LOS_SYNC_CNFG (1<n <14) register. By default, the LOS pins are not associated with any input.

3.2.4 DPLL LOCKING PROCESS

The following events are always monitored for the DPLLs locking process:

• Fast Loss;
• Fine Phase Loss;
• Hard Limit Exceeding. For proper operation, COARSE_PH_LOS_LMT_EN must be set to 0.

3.2.4.1 Fast Loss

A fast loss is triggered when the selected input clock misses 3 con- secutive clock cycles. It is cleared once an active clock edge is detected. For all DPLL1 the occurrence of the fast loss will result in the DPLL to unlock if the FAST_LOS_SW bit is ‘1’. For DPLL2, the occurrence of the fast loss will result in the DPLL to unlock regardless of the FAST_LOS_SW bit.

3.2.4.2 Fine Phase Loss

The DPLL compares the selected input clock with the feedback sig- nal. If the phase-compared result exceeds the fine phase limit pro- grammed by the PH_LOS_FINE_LIMT[2:0] bits, a fine phase loss is triggered. It is cleared once the phase-co mpared result is within the fine phase limit. For greatest jitter and wander tolerance, set the PH_LOS_FINE_LIMT[2:0] to the largest value. The occurrence of the fine phase loss will result in DPLL to unlock if the FINE_PH_LOS_LIMT_EN bit is ‘1’.

3.2.4.3 Hard Limit Exceeding

Two limits are available for this monitoring. They are DPLL soft limit and DPLL hard limit. When the frequency of the DPLL output with respect to the system clock exceeds the DPLL soft / hard limit, a DPLL soft / hard alarm will be raised; the alarm is cleared once the frequency is within the corresponding limit. T he occurrence of the DPLL soft alarm does not affect the DPLL locking st atus. The DPLL soft alarm is indi- cated by the corresponding DPLL_SOFT_FREQ_ALARM bit. The occurrence of the DPLL hard alarm will result in the DPLL to unlock if the FREQ_LIMT_PH_LOS bit is ‘1’. The DPLL soft limit is set by the DPLL_FREQ_SOFT_LIMT[6:0] bits and can be calculated as follows: DPLL Soft Limit (ppm) = DPLL_FREQ_SOFT_LIMT[6:0] X 0.724 The DPLL hard limit is set by the DPLL_FREQ_HARD_LIMT[15:0] bits and can be calculated as follows: DPLL Hard Limit (ppm) = DPLL_FREQ_HARD_LIMT[15:0] X 0.0014

3.2.4.4 Locking Status

The DPLL locking status depends on the locking monitoring results. The DPLL is in locked state if none of the following events is triggered during 2 seconds; otherwise, the DPLL is unlocked.

• Fast Loss (the FAST_LOS_SW bit is ‘1’);
• Fine Phase Loss (the FINE_PH_LOS_LIMT_EN bit is ‘1’);
• DPLL Hard Alarm (the FREQ_LIMT_PH_LOS bit is ‘1’). If the FAST_LOS_SW bit, the COARSE_PH_LOS_LIMT_EN bit, the FINE_PH_LOS_LIMT_EN bit or the FR EQ_LIMT_PH_LOS bit is ‘0’, the DPLL locking status will not be affected even if the corresponding event is triggered. If all these bits are ‘0’, the DPLL will be in locked state in 2 seconds.

29©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet The DPLL locking status is indicated by the corresponding DPLL_LOCK bits and by the DPL_LOCK pins.

3.2.4.5 Phase Lock Alarm

DPLL1 have a phase lock alarm that will be raised when the selected input clock can not be locked in DP LL1 within a certain period. This period can be calculated as follows: Period (sec.) = TIME_OUT_VALUE[5:0] X MULTI_FACTOR[1:0] The phase lock alarm is indicated by the corresponding INn_PH_LOCK_ALARM bit (14  n  1). The phase lock alarm can be cleared, as selected by the PH_ALARM_TIMEOUT bit:

• It is cleared when a ‘1’ is written to the corresponding INn_PH_LOCK_ALARM bit;
• It is cleared after the period ( = TIME_OUT_VALUE[5:0] X MUL- TI_FACTOR[1:0] in second ) starting from the time the alarm is raised. The selected input clock with a phas e lock alarm is disqualified for the DPLL1 to lock. Note that phase lock alarm is not available for DPLL2.

3.2.5 APLL1 AND APLL2

APLL1 and APLL2 are provided for a better jitter and wander perfor- mance of the device output clocks. The bandwidth for APLL1 and APLL2 is internally set to 22 kHz (typical). The input of both APLLs can be derived from one of the DPLL1 out- puts, as selected by the apll1_path_freq_cnfg[2:0] and apll2_path_fre- q_cnfg[2:0] bits respectively as shown in Table 10. APLL2 is free- running by default, after reset APLL2 should be set to be connected to DPLL1 per Table 10. To following steps should be followed to set APLL1/APLL2 output to Ethernet LAN PHY frequencies. To initialize the device, write into the following registers: 1. Write 0x04F4F0 to bits apll1 /apll2_divn_frac_cnfg[20:0] of APLL1/APLL2 fractional feedback di vider configuration register to set the fractional part of feedback divider for APLL1/APLL2 2. Write 0x0051 to bits apll1/apll2_divn_den_cnfg[15:0] of APLL1/ APLL2 divisor denominator configur ation register to set the denominator part of feedback divider for APLL1/APLL2 3. Write 0x0010 to bits apll1 /apll2_divisor_num_cnfg[15:0] of APLL1/APLL2 divisor numerator confi guration register to set the numerator part of feedback divider for APLL1/APLL2 4. Write 0x21 to bits apll1/apll2_divisor_int_cnfg[5:0] of APLL1/ APLL2 divisor integer configuration register to set the integer part of feedback divider for APLL1/APLL2 5. Write 0x13356218 to bits apll1/apll2_fr_ratio_cnfg[28:0] of APLL1/APLL2 feedback divider configur ation register to set the feedback divider for APLL1/APLL2 After the device has been initialized according to the steps above, follow the following steps when setting APLL1/APLL2 path to 644.53125 MHz:

• Write 1’b1 to dsm_cnfg_en bit to enable the preset programma- ble feedback divider of APLL1/APLL2 configuration register
• Write the corresponding value in the apll1/apll2_path_fre- q_cnfg[2:0] bits according to Table 10. After the device has been initialized according to the steps 1 to 5 above, follow the following steps when setting APLL1/APLL2 path to 625MHz: or 622.08MHz
• Write 1’b0 to dsm_cnfg_en bit to disable the preset programma- ble feedback divider of APLL1/APLL2 configuration register
• Write the corresponding value in the apll1/apll2_path_fre- q_cnfg[2:0] bits according to Table 10. Table 10: APLL1/2 input selection apll1/apll2_path_freq_cnfg[2:0] APLL1/2 Input Selection 000 622.08 MHz from DPLL1 001 625 MHz from DPLL1 010 644.53125 MHz from DPLL1 011-1111 Reserved

30©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

3.2.6 APLL3

The APLL3 is provided for a better jitter and wander performance of the device differential output clocks OUT11 and OUT12. APLL3 supports 3 clock modes: SONET, Ethernet, and Ethernet LAN. The base frequency for the 3 clock modes are 622.08 MHz, 625 MHz, and 644.53125 MHz respectively. The clock mode selected is determined by the crystal used for the APLL. The APLL uses a crystal to generate the respective mode’s base fre- quency. The supported crystal fre quencies are 24.8832 MHz (SONET), 25 MHz (Ethernet) and 25.78125 MHz (Ethernet LAN). The APLL sup- ports up to two crystal connections , allowing the APLL to support up to two mode’s base frequencies. The input of both APLL3 can be derived from one of the DPLL1 out- puts by configuring internal registers as described in Table 11.

3.2.6.1 External Crystals

Suggestions for crystal options and best matching to APR require- ments, crystal tolerance consi derations and budgets, component place- ment and crystal wiring to achieve minimum capacity are fully detailed in IDT AN-861, “Recommended Crystals and Layout Guidelines for IDT’s VCXO-based Synchronization PLLs. Table 12 shows IDT (Fox) Crystals that can be used with APLL3. Table 11: APLL3 input selection Crystal APLL3 Input APLL3_mux_cnfg[3:0] APLL3_div1_cnfg[7:0 ] APLL3_div2_cnfg[26:0] APLL3_pd_sel[14:0] APLL3_pd_sel[14:0] 24.88320 8100 Hz from DPLL1 0x04 0x01 0x000012BF 0x0001 0x0C00 25.00000 8000 Hz from DPLL1 0x04 0x01 0x000012FB 0x0001 0x0C35 25.78125 7812.5 Hz from DPLL1 0x03 0x01 0x0000063F 0x0001 0x0CE4 Table 12: IDT(FOX) Crystals Fox Part Number Frequency (MHz) Model Number 495-24.8832-2 24.88320 FX532B 495-25-141 25.00000 FX532B 495-25.78125-2 25.78125 FX532B

3.2.7 OUTPUT CLOCKS & FRAME SYNC SIGNALS

3.2.7.1 Output Clocks

OUT2 ~ OUT4 can be derived from APLL1. OUT5 ~ OUT7 can be derived from APLL2. OUT1 to OUT7 have an output divi der associated with each output. can be programmed by writing into OUTn_DIV2_CNFG[26:0]. Figure 13. OUT1 output dividers Figure 14. OUT2 to OUT7 output dividers

• To set the feedback divider, program dpll2_fb_div_cnfg[13:0] bits of DPLL2 feedback divider register
• To set the fractional divider, pr ogram dpll2_divn_frac_cnfg[23:0] of DPLL2 fractional divider register
• To set the denominator of t he fractional divider, program dpll2_divn_den_cnfg[15:0] bits of DPLL2 fractional divider denominator register
• To set the numerator of t he fractional divider, program dpll2_divn_num_cnfg[15:0] bits of DPLL2 fractional divider numerator register
• To set the integer divider, program dpll2_int_cnfg[7:0]bits of DPLL2 integer divider register OUT11 and OUT12 are derived from APLL3, refer to Table 13 for the output frequency. Output Divider APLL1 DPLL1 Output Div1 (OUT1_DIV1_CNFG[4:0] OUT1_MUX_CNFG[3:0] Output Div2 (OUT1_DIV2_CNFG[26:0] DPLL2 OUT1 APLL_PATH Phase 1 Phase 2 Output Dividers APLL1 APLL2 DPLL1 Output Div1 (OUTn_DIV1_CNFG[4:0] 2<n<4 (from APLL1) 5<n<7 (from APLL2) Output Div2 (OUTn_DIV2_CNFG[26:0] 2<n<4 (from APLL1) 5<n<7 (from APLL2) DPLL2 APLL_PATH 2<n<4 (from APLL1) 5<n<7 (from APLL2)OUTn Phase 1 Phase 2

32©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet OUT1 to OUT10 output clocks c an be inverted by setting OUTn_IN- VERT bit (0: output not inverted, 1: output inverted) in OUTn_MUX- _CNFG register for (1 < n < 7), in OUT8_FREQ_CNFG register for OUT8, and in OUT9_CNFG and OUT 10_CNFG registers for OUT9 and OUT10 respectively. The output clocks can be squelched by setting OUT- n_SQUELCH[1:0] bits (0x: no squelch, 10: squelch to '0', 11: squelch to '1') in OUTn_MUX_CNFG register for (1 < n < 7), and in OUT9_CNFG and OUT10_CNFG registers for OUT1 to OUT7, and OUT9 and OUT10 respectively. OUT1 to OUT7 output clocks c an be individually powered down by setting OUTn_PDN bit to '1' in OUT n_MUX_CNFG register for (1 < n < OUT8 can be enabled or disabl ed by programming OUT8_PDN and DPLL2_INPUT_FAIL bits in OUT8_FREQ_CNFG register. OUT11 and OUT12 can be enabled or disabled by programming OUT11_ENABLE and OUT12_ENABLE in the OUT11 and OUT2 config- uration registers respectively. 82P33731 provides a variety of output frequencies from 1Hz to 650MHz. APLL1 is always enabled and the default frequency for OUT1, OUT2, and OUT3 is respectively 25 MH z, 125 MHz, and 156.25MHz. OUT4 is squelched by default. By default, OUT5 to OUT7 are squelched. Set the proper registers to set desired frequency values for OUT5 to OUT7. OUT8 is powered down by default. DPLL3 is disabled by default, and if it is enabled, then the default fre- quency for OUT9 and OUT10 is respectively 16.384 MHz and 2.048 MHz. APLL1, APLL2, and the DPLLs can be configured from an external EPROM after reset. It can be used to set specific start up frequency val- ues as needed by the application. OUT11 and OUT12 are powered down by default. APLL3 must be configured via the I2C slave interface to set OUT11 and OUT12 fre- quency values.

3.2.7.2 Frame Sync Signals

Either an 8 kHz or a 2 kHz frame sync, or a 1PPS sync signal are output on the FRSYNC_8K_1PPS and MFRSYNC_2K_1PPS pins if enabled by the 8K_1PPS_EN and 2K_1PPS EN bits respectively. They are CMOS outputs. The output sync frequencies are independent of the input sync fre- quency. The output FRSYNC_8K_1PPS and MFRSYNC_2K_1PPS fre- quencies are selected through the DPLL1_fr_mfr_sync_cnfg registers. Any supported clock frequency at the clock input can be associated with the sync signals. The frame sync output signals are derived from the DPLL1 and DPLL2 output and are aligned with the output clock. They are synchro- nized to the frame sync input si gnal. In DCO control modes (section 3.2.2.1.6), the output FRSYNC_8K_1PPS and MFRSYNC_2K_1PPS must not be used, a 1PPS output sync signal can be generated in any of the output clocks connected to the DCO being used. The frame/sync output signals align to the first edge of the associ- ated reference clock that occurs after the edge of the frame/sync input signal. The frequency of the associated reference clock must be lower or equal to the frequencies of the output clocks that requires to be aligned with the frame/sync pulse signal. Table 13: Outputs on OUT11~12 OUTn_ODSEL0/1[2:0] (Output Divider) Outputs on OUT11~121 SONET (XTALn =

24.8832 MHz)

(XTALn =

25 MHz)

ETHERNET * 66/64 (XTALn =

25.78125 MHz)

1 622.08 MHz 625 MHz 644.53125 MHz 2 311.04 MHz 312.5 MHz 322.265625 MHz 4 155.52 MHz 156.25 MHz 161.1328125 MHz 5 125 MHz 82 77.76 MHz 253 25 MHz (OUTn_ENABLE = 0) Output ‘n’ is disabled (OUTn_ENABLE = 1) Output ‘n’ is enabled Note: 1. The blank cell means the configuration is reserved. The proper XTAL must be populated for XTAL1~2 based on the selected mode. 2. OUT12 only 3. OUT11 only

33©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet If the frame sync input signal with respect to the DPLL1 selected input clock is above a limit set by the SYNC_MON_LIMT[2:0] bits, an external sync alarm will be raised and the frame/sync input signal is dis- abled to synchronize the frame/sync output signals. The external sync alarm is cleared once the frame/sync input signal with respect to the DPLL selected input clock is within the limit. If it is within the limit, whether frame/sync input signal is enabled to synchronize the frame sync output signal is determined by the AUTO_EXT_SYNC_EN bit and the EXT_SYNC_EN bit. When the frame/sync input signal is enabled to synchronize the frame/sync output signal, it is adjus ted to align itself with the DPLL selected input clock. By default, the falling edge of the fr ame/sync input signal is aligned with the rising edge of the DPLL1 selected input clock. The rising edge of frame/sync input signal can be set to be aligned with the rising edge of the DPLL1 selected input cloc k by setting sync_edge bit to “1” in DPLL1_sync_edge_cnfg register. The EX_SYNC_ALARM_MON bit i ndicates whether frame/sync input signal is in external sync alar m status. The external sync alarm is indicated by the EX_SYNC_ALARM bit. If the EX_SYNC_ALARM bit is ‘1’, the occurrence of the external sync alarm will trigger an interrupt. The 8 kHz frame pulse, the 2 kHz frame pulse, and the 1PPS sync signal can be inverted by setting the 8K_1PPS_INV and 2K_1PPS_INV bits of Frame Sync and Multiframe Sync Output Configuration Register. The 8 kHz and the 2 kHz frame sync outputs can be 50:50 duty cycle or pulsed, as determined by the 8K_P UL and 2K_PUL bits respectively. When they are pulsed, the pulse width derived from DPLL1 is defined by the period of OUT1. They are pulsed on the position of the falling or ris- ing edge of the standard 50:50 duty cycle, as selected by the 2K_8K_PUL_POSITION bit of Frame Sync and Multiframe Sync Output Configuration Register.

34©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

3.2.8 INPUT AND OUTPUT PHASE CONTROL

The device has several features to allow a tight control of the phase on the input and output clocks.

3.2.8.1 DPLL1 and DPL2 Phase offset control

The phase offset of the DPLL1 selected input clock with respect to the DPLL1 output can be adjusted. If the device is configured as the active PLL in a redundancy system, then the PH_OFFSET_EN bit deter- mines whether the input-to-output pha se offset is enabled. If the device is configured as the inactive PLL in a redundancy system, then the input-to-output phase offset is al ways enabled. If enabled, the input-to- output phase offset can be adjusted by setting the PH_OFF- SET_CNFG[28:0] bits in DPL1/2 phase offset configuration register. The register value is a 2's complement phase offset with a resolution of 0.0745ps and a total range of [20us, - 20us]. The input-to-output phase offset can be calculated as follows: Phase Offset (ps) = PH_OFFSET[28:0] X 0.0745

3.2.8.2 Input Phase control

All the inputs phase can be controll ed individually. They can be pro- grammed with a resolution of 0.61 ns and a range of [77.5 ns,-78.1ns] by setting INn_PHASE_OFFSET_CNFG[7:0] bits (3 < n < 14) in the input phase offset configuration register. T he register value is a 2's comple- ment phase offset, the default is ze ro. The programmed offset is auto- matically applied to the DPLL1 when a particular input is selected. If the manual DPLL1 phase offset control is used then the per-input phase off- set is not applied.

3.2.8.3 Output Phase control

The output phase can be controlled individually for outputs OUT1 to OUT7. There is the coarse phase control that allows the output phase to be adjusted as low as 1.6ns. Th ere is a fine phase adjustment that allows the output phase to be adjusted as low as 187.27 ps. The total range is +/-180 There are two registers associat ed with the coarse phase adjust- ment, the OUTn_PH1_CNFG (1 < n < 7) and the OUTn_PH2_CNFG (1 < n < 7) registers. The OUTn_PH1_ CNFG register is associated with output divider 1 as shown in Figure 13 and Figure 14, the phase can be adjusted by a step size that is equal to the period of the input of clock of the output Div1, the number set in the OUTn_PH1_CNFG register should not be larger than the number set in OUTn_DIV1_CNFG register. The OUTn_PH2_CNFG register is associated with output divider 2 as shown in Figure 13 and Figure 14, the phase can be adjusted by a step size that is equal to the period of the input of clock of the output Div2, the number set in the OUTn_PH2_CNFG r egister should not be larger than the number set in OUTn_DIV2_CNFG register. There is a register that is asso ciated with the fine phase adjustment, the OUTn_FINE_CNFG (1 < n < 7). For the fine phase adjustment, the output clocks must be output from the APLLs, The phase can be adjusted by a step size that is equal to the 1/2 of the period of the VCO. For Ethernet clocks the VCO frequenc y is 2.5GHz, for Ethernet LAN PHY the VCO frequency is 2.578125 GHz, and for SONET/SDH clocks the VCO frequency is 2.48832 GHz. OUT1 can be output from the DPLLs, and in that case the fine phase adjustment is not available, it is only available if the clocks are output from the APLLs. The output phase adjustments are not available for OUT8, OUT9, OUT10, OUT11, and OUT12.

35©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

4 POWER SUPPLY FILTERING TECHNIQUES

To achieve optimum jitter perform ance, power supply filtering is required to minimize s upply noise modulation of the output clocks. The common sources of power supply noi se are switch power supplies and the high switching noise from the outputs to the internal PLL. The 82P33731 provides separate VDDA and VDDAO power pins for the internal analog PLL, it also prov ides VDDD and VDDDO pins for the core logic as well as I/O driver circuits. The suggested power decoupling scheme is shown in Figure 15.

Figure 15. 82P33731 Power Decoupling Scheme

5 MICROPROCESS OR INTERFACE

registers in the device. The microprocessor interface supports I2C.

5.1 I2C SLAVE MODE

5.1.1 I2C DEVICE ADDRESS

5.1.2 I2C BUS TIMING

Figure 16 shows the definition of I2C bus timing. Figure 16. Definition of I2C Bus Timing

38©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 14: Timing Definition for Standard Mode and Fast Mode(1) Symbol Parameter Standard Mode Fast Mode Unit Min Max Min Max SCL Serial clock frequency 0 100 0 400 kHz tHD; STA Hold time (repeated) START condition. After this period, the first clock pulse is generated 4.0 - 0.5 - s tLOW LOW period of the SCL clock 4.7 - 1.3 - s tHIGH HIGH period of the SCL clock 4.0 - 0.6 - s tSU; STA Set-up time for a repeated START condition 4.7 - 0.6 - s tHD; DAT Data hold time: for CBUS compatible masters for I 2C-bus devices 5.0 0(2) 3.45(3) 0(2) 0.9(3) s tSU; DAT Data set-up time 250 - 100(4) -n s tr Rise time of both SDA and SCL signals - 1000 20 + 0.1Cb(5) 300 ns tf Fall time of both SDA and SCL signals - 300 20 + 0.1Cb(5) 300 ns tSU; STO Set-up time for STOP condition 4.0 - 0.6 - s tBUF Bus free time between a STOP and START condition 4.7 - 1.3 - s Cb Capacitive load for each bus line - 400 - 400 pF VnL Noise margin at the LOW level for each connected device (Including hysteresis) 0.1VDD - 0.1VDD - V VnH Noise margin at the HIGH level for each connected device (Including hysteresis) 0.2VDD - 0.2VDD - V tsp Pulse width of spikes which must be suppressed by the input filter 05 005 0 n s Note: 1. All values referred to VIHmin and VILmax levels (see Table 23) 2. A device must Internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the fall- ing edge of SCL. 3. The maximum tHD; DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal. 4. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tSU; DAT ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tSU; DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is released. 5. Cb = total capacitance of one bus line in pF. If mixed with Hs-mode device, faster fall-times according to Table 24 allowed. n/a = not applicable

5.1.3 SUPPORTED TRANSACTIONS

The supported types of transactions are shown below. Figure 17. I2C Slave Interface Supported Transactions reads and writes can be performed anywhere within that page. ing should be continuous and not be interrupted by any operation.

5.2 I2C MASTER MODE

available until the EEPROM reading process is completed.

• 8 kbit (1023 x 8) I2C EEPROM with device address 1010000 (for the base block)
• Sequential read (block read) of t he entire memory-map for device- excluding APLL3, from byte-address 0x000 to 0x39E
• 7-bit device address mode
• Validation of the EEPROM read data via CCITT-8 CRC check against value stored in memory-map address 0x39E
• Support for 100 kHz and 400 kHz operation with speed program- mability. If bit 7 is set at memory-map address 0x001, the 82P33731 will shift from 100 kHz operation to 400 kHz operation.
• 2-byte word-addressing (1-byte word addressing is supported by offsetting the memory-map upwards 1 address in the EEPROM)
• Read will abort with an alarm (RD_EEPROM_ERR interrupt status set) if any of the following conditions occur: Slave NACK, CRC fail- ure, Slave Response time-out Table 15: Description of I2C Slave Interface Supported Transactions Operation Description Current Read Reads a burst of data from an internal determined starting address, this starting address is equal to the last address accessed during the last read or write operation, incremented by one. If the address exceeds the address space, it will start from 0 again. Sequential Read Reads a burst of data from a specified address space. The starting address of the space is specified as offset a ddress. Sequential Write Writes a burst of data to a specified address space, the starting address of the space is specified as offset address. Current Read S Dev Addr + R A Data 0 A Data 1 A A Data n A P Sequential Read S Dev Addr + W A Data 0 A Data 1 A A Data n A PSr Dev Addr + R A Sequential Write S Dev Addr + W A Data 0 PA Data 1 A A Data n A from master to slave from slave to master S = start Sr= repeated start A = acknowledge A = not acknowledge P=s t o p Offset Addr A Offset Addr A

40©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet As the 82P33731 I2C master bus is meant only to read from a single EEPROM, it has the following restrictions:

• No support for Multi-master
• No support for Slave clock stretching
• No support for I2C Start Byte protocol
• No support for EEPROM Chaining
• No support for Writing to external I2C devices including the EEPROM used for booting

5.2.1 I2C BOOT-UP INITIALIZATION MODE

EEPROM mode is enabled via setting the MPU_MODE[1:0] pins high (through two separate pull-up resistors). Once the RSTB input has been asserted (low) and then de-asserted (high) and the device internal calibration has been completed, the 82P33731 will perform a short block read at 100 kHz to program the EPROM read speed (100 kHz or 400 kHz). The 82P33731 will then perform a block read to program all the device configuration registers, and check the CRC of the EEPROM data. During the boot-up EEPROM-reading process, the 82P33731 will not respond to microprocessor serial control port accesses. Once the initialization process is completed, the contents of any of the device con- figuration registers can be further altered by the microprocessor, if desired. The 82P33731 can work with EEPR OMs supporting 2-byte word- addresses or 1-byte word-addresses by using 2-byte word addressing for both. This works in the us ual manner for EEPROMs supporting 2- byte word addresses, and gives an address-to-address match between EEPROM and memory-map. For EEPROMs supporting only 1-byte word addresses, the second address byte will cause an addition incre- ment of the address counter, and the memory-map will be read at the next highest EEPROM address,.i.e memory-map (CSR) address 0x00 will be read from EEPROM address 0x01, and memory map address 0x39E will be read from EEPROM address 0x39F. If a NACK is received to any of the read cycles performed by the 82P33731 during the initialization process, or if the CRC does not match the one stored in memory-map addres s 0x39E, the boot process will be restarted. This restart can happen up to three times before an abort is declared and the RD_EEPROM_ERR interr upt status bit is set. Also on RD_EEPROM_ERR the MPU_MODE1/ I2CM_SCL and MPU_MODE0/ I2CM_SDA pins are both held low until the interrupt status bit is cleared or the device is reset. The sugges ted method for dealing with RD_EE- PROM_ERR is to externally set the MPU_MODE[1:0] pins to 00 and then reset the 82P33731 so that it will boot into I2C serial port mode. After a successful EEPROM boot, the 82P33731 will stop toggling the MPU_MODE1/ I2CM_SCL and MPU_MODE0/I2CM_SDA pins, returning them to static high values, and the RD_EEPROM_DONE inter- rupt status bit will be set. The I2C serial port will now respond to micro- processor reads and writes to the appropriate I2C device address.

5.2.2 EEPROM MEMORY MAP NOTES

The EEPROM memory-map is the same as the control and status register (CSR) map with the following additions and constraints: 1. For EEPROMs supporting 2-byte word-address, the memory-map addresses are the same as the EPPROM addresses; for EEPROMs supporting 1-byte word-address, the memory-map addresses will by mapped to the next address in the EEPROM, i.e. memory-map address 0x00 will be read from EEPROM address 0x01, and memory-map address 0x39E will be read from EEPROM address 0x39F. 2. Memory-map address 0x001, bit 7 is the EEPROM read speed (0 for 100 kps, 1 for 400 kbps) 3. Memory-map address 0x39E is the CRC-8 of the memory-map from 0x000 to 0x39D (the standard CC ITT CRC-8 with the data width and result width being 8; the polynomial is (0, 1, 2, 8) or "0x07"). NB: all memory-map addresses from 0x000 to 0x39d are included in the sequential calculation of CRC, including those not used in the CSR - it is recommend that data at unused addresses be set to 0x00. 4. Memory-map addresses 0x392 to 0x39D must be set to the default values shown in the CSR documentation. 5. The device address at memo ry-map address 0x00f must match the address set by the board. 6. Each memory-map address that is a multiple of 0x7F must contain the pointer to the next page of the CSR i.e 0x07f 0x01 0x0ff 0x02 0x17f 0x03 0x1ff 0x04 0x27f 0x05 0x2ff 0x06 0x37f 0x07

• The output boundary scan cells do not capture data from the core and the device does not support EXTEST instruction; The JTAG interface timing diagram is shown in Figure - 18.

Figure 18. JTAG Interface Timing Diagram

42©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

7 THERMAL MANAGEMENT

The device operates over the industry temperature range -40°C ~ +85°C. To ensure the functionality and reliability of the device, the maxi- mum junction temperature T jmax should not exceed 125°C. In some applications, the device will consume more power and a thermal solution should be provided to ensure the junction temperature T j does not exceed the Tjmax.

7.1 JUNCTION TEMPERATURE

Junction temperature Tj is the temperature of package typically at the geographical center of the chip where the device's electrical circuits are. It can be calculated as follows: Equation 1: Tj = TA + P X JA Where: JA = Junction-to-Ambient Thermal Resistance of the Package Tj = Junction Temperature TA = Ambient Temperature P = Device Power Consumption In order to calculate juncti on temperature, an appropriate JA must be used. The JA is shown in Table 17: Table 17 has the thermal results based on JEDEC standard condi- tions. It is industry practice and IDT practice to publish these results. If the PCB design differs from t he JEDEC standard conditions, then the thermal results will be different.

7.2 THERMAL RELEASE PATH

In order to maximize both the removal of heat from the package, electrical grounding from the package to the board can be done through thermal vias to effectively conduct fr om the surface of the PCB to the ground plane(s). The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are application specific and dependent upon the package power dissipation as well as electric al conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz cop- per via barrel plating. These re commendations are to be used as a guideline only. Table 17: Thermal Data Parameter Symbol CONDITIONS PKG Typ Values (C/W) Notes Thermal Resistance JC Junction to Case BAG144 6.8 JEDEC PCB (8x8 matrix) JB Junction to Base 16.2 JA1 Junction to Air, still air 34.8 JA2 Junction to Air, 1 m/s air flow 28.8 JA3 Junction to Air, 2 m/s air flow 26.7 JA4 Junction to Air, 3 m/s air flow 25.7

43©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

8 ELECTRICAL SPECIFICATIONS

8.1 ABSOLUTE MAXIMUM RATING

8.2 RECOMMENDED OPER ATION CONDITIONS

Table 18: Absolute Maximum Rating Symbol Parameter Min Max Unit VDDA, VDDAO, VDDDO,VDDD Supply Voltage VDDA, VDDAO, VDDDO,VDDD -0.5 3.6 V VDDD_1_8 Supply Voltage VDDD_1_8 -0.5 1.98 V VINCMOS Input Voltage (CMOS and Open drain pins) -0.5 5.5 V VINDIFF Input Voltage (Differential and AMI pins) -0.5 VDDD+ 0.5 V VINAN Input Voltage (Analog pins) -0.5 2.2 V IOUTCONT Output Current (Continuous current) 50 mA IOUTSURGE Output Current (Surge current) 100 mA TA Ambient Operating Temperature Range -40 85 °C TSTOR Storage Temperature -50 150 °C Note: CDM Classification - Class III (JESD22 - C101) HBM Classification - Class 2 (JS-001-2010) Table 19: Recommended Operation Conditions Symbol Parameter Min Typ Max Unit Test Condition VDDA, VDDAO, VDDDO,VDDD Power Supply (DC voltage) 3.135 3.3 3.465 V VDDD_1_8 Power Supply (DC voltage) VDDD_1_8 1.71 1.8 1.89 V TA Ambient Temperature Range -40 85 °C IDDA Analog Supply Current 480.8 548.48 mA IDDD Digital Supply Current (VDDD 41.90 62.05 mA IDDD_1_8 Digital Supply Current (VDDD_1_8) 81.09 89.49 mA IDDDO Digital Output Supply Current 45.18 64.77 mA All outputs enabled IDDAO Analog Output Supply Current 168.46 220.96 mA All outputs enabled, unloaded Analog Output Supply Current (loaded) 248.26 308.74 mA All outputs enabled,

6 LVPECL outputs

PTOT Total Power Dissipation 2.58 3.29 W All outputs enabled, excluding the loading

8.3 I/O SPECIFICATIONS

8.3.1 AMI INPUT / OUTPUT PORT

8.3.1.1 Structure

Figure 19. 64 kHz + 8 kHz Signal Structure Figure 20. 64 kHz + 8 kHz + 0.4 kHz Signal Structure

8.3.1.2 I/O Level

Figure 21. 64 kHz + 8 kHz / 64 kHz + 8 kHz + 0.4 kHz Figure 22. 64kHz + 8 kHz / 64 kHz + 8 kHz + 0.4 kHz

2 Vp-p

0 VIM

Figure 23. AMI Input / Output Port Line Termination (Recommended)

8.3.1.3 Over-Voltage Protection

according to ITU Recommendation K.41.

8.3.2 CMOS INPUT / OUTPUT PORT

to achieve the required 1 V pk-pk voltage level for the positive and negative pulses.

8.3.3 LVPECL / LVDS INPUT / OUTPUT PORT

8.3.3.1 PECL Input Port

Figure 24. Recommended PECL Input Port Line Termination

1 PPS

8.3.3.2 LVPECL Output Port

tionality. These outputs are designed to drive 50  transmission lines. circuit and clock component process variations. Figure 25. 3.3V LVPECL Output Termination Figure 26. 3.3V LVPECL Output Termination

1. Assuming a differential input voltage of at least 100 mV.
2. Unused differential input terminated to VDD-1.4 V.

8.3.4 LVDS INPUT / OUTPUT PORT

8.3.4.1 LVDS INPUT PORT

Figure 30. Recommended LVDS Input Port Line Termination

8.3.4.2 LVDS Output Port

input range should be verified for compatibility with the output. Figure 31. Recommended LVDS Output Port Line Termination

51©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

8.3.5 OUTPUT CLOCK DUTY CYCLE

Table 29: Output Clock Duty Cycle (OUT1 - OUT10) Clock Output Frequency Min Typ Max Unit Test Condition fOUT<570MHz 45 55 % fOUT>570MHz 35 65 % NOTE: Output Duty Cycle configured using APLL1 or APLL2. Table 30: Output Clock Duty Cycle (OUT11 to OUT12) Clock Output Frequency Min Typ Max Unit Test Condition fOUT<600MHz 47 53 % fOUT>600MHz 45 55 %

8.3.6 WIRING THE DIFFERENTIAL INPUT FOR SINGLE-

attenuate the signal in half. This can be done in one of two ways. impedance. For most 50 applications, R3 and R4 can be 100 . Figure 32. Recommended Schematic for Wiring a Differential Input to Accept Single-Ended Levels

53©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

8.4 JITTER PERFORMANCE

Table 31: Gigabit Ethernet Output Clock Jitter Generation (jitter measured on one differential output of APLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

25 MHz

0.26 0.32 2.5 kHz - 5 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 0.8 ns) 0.26 0.31 10 kHz - 5 MHz IDT Target Test Filter for 10GbE 0.19 0.24 637 kHz - 5 MHz IEEE 802.3-2008 limit 0.24 UI p-p /

0.0174 UI RMS

(1 UI = 0.8 ns) 0.20 0.23 10 kHz - 1 MHz 125MHz 0.24 0.30 2.5 kHz to 10 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 0.8 ns) 0.25 0.31 10 kHz - 20 MHz IDT Target Test Filter for 10GbE 0.15 0.19 637 kHz - 10 MHz IEEE 802.3-2008 limit 0.24 UI p-p / (1 UI = 0.8 ns) 0.22 0.39 1 kHz - 1 MHz 0.20 0.23 10 kHz - 1 MHz 156.25MHz 0.24 0.29 10 kHz - 20 MHz IDT Target Test Filter for 10GbE 0.25 0.30 20 kHz - 40 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 100.47 ps) 0.14 0.19 1 MHz - 30 MHz 0.10 0.12 1.875 MHz - 20 MHz IEEE 802.3-2008 limit 0.28 UI p-p /

0.0203 UI RMS

(1 UI = 100.47 ps) 0.22 0.39 1 kHz - 1 MHz 0.20 0.23 10 kHz - 1 MHz

54©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet 625MHz 0.233 0.28 10 kHz - 20 MHz IDT Target Test Filter for 10GbE 0.25 0.31 20 kHz - 80 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 100.47 ps) ITU-T G.8262 limit 1.2 UI p-p (1 UI = 38.79 ps) 0.12 0.16 1 MHz - 30 MHz 0.07 0.09 1.875 MHz - 20 MHz IEEE 802.3-2008 limit 0.28 UI p-p / (1 UI = 100.47 ps) 0.22 0.38 1 kHz - 1 MHz 0.21 0.24 10 kHz - 1 MHz NOTE 1: DPLL locked to input clock Table 31: Gigabit Ethernet Output Clock Jitter Generation (jitter measured on one differential output of APLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes Table 32: Gigabit Ethernet Output Clock Jitter Generation (jitter measured on one differential output of APLL1/2 with one differential output enabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes 0.71 1.31 2.5 kHz - 5 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 0.8 ns) 0.57 0.84 12 kHz - 5 MHz 0.28 0.42 637 kHz - 5 MHz IEEE 802.3-2008 limit 0.24 UI p-p / (1 UI = 0.8 ns) 125MHz 0.72 1.40 2.5 kHz to 10 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 0.8 ns) 0.58 0.86 12 kHz - 20 MHz 0.20 0.29 637 kHz - 10 MHz IEEE 802.3-2008 limit 0.24 UI p-p / (1 UI = 0.8 ns)

55©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet 156.25MHz 0.56 0.85 12 kHz - 20 MHz 0.52 0.99 20 kHz - 40 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 100.47 ps) 0.23 0.30 1 MHz - 30 MHz 0.16 0.22 1.875 MHz - 20 MHz IEEE 802.3-2008 limit 0.28 UI p-p / (1 UI = 100.47 ps) NOTE 1: DPLL locked to input clock Table 32: Gigabit Ethernet Output Clock Jitter Generation (jitter measured on one differential output of APLL1/2 with one differential output enabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes Table 33: Gigabit Ethernet Output Clock Jitter Generation (Jitter measured on one CMOS output of APLL1/2 with one CMOS output enabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes 0.71 1.26 2.5 kHz - 5 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 0.8 ns) 0.55 0.83 12 kHz - 5 MHz 0.23 0.30 637 kHz - 5 MHz IEEE 802.3-2008 limit 0.24 UI p-p / (1 UI = 0.8 ns) 125MHz 0.78 2.32 2.5 kHz to 10 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 0.8 ns) 0.62 0.94 12 kHz - 20 MHz 0.21 0.31 637 kHz - 10 MHz IEEE 802.3-2008 limit 0.24 UI p-p / (1 UI = 0.8 ns) NOTE 1: DPLL locked to input clock

56©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 34: Gigabit Ethernet LAN Output Clock Jitter Generation (jitter measured on one differential output of APLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

161.1328125 MHz

0.23 0.27 10 kHz - 20 MHz IDT Target Test Filter for 10GbE 0.25 0.29 20 kHz - 40 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 96.97 ps) 0.14 0.19 1 MHz - 30 MHz 0.09 0.12 1.875 MHz - 20 MHz IEEE 802.3-2008 limit 0.28 UI p-p / (1 UI = 96.97 ps) 0.20 0.22 10 kHz - 1 MHz

322.265625 MHz

0.23 0.26 10 kHz - 20 MHz IDT Target Test Filter for 10GbE 0.25 0.30 20 kHz - 80 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 96.97 ps) 0.13 0.16 1 MHz - 30 MHz 0.07 0.10 1.875 MHz - 20 MHz IEEE 802.3-2008 limit 0.28 UI p-p / (1 UI = 96.97 ps) 0.20 0.22 10 kHz - 1 MHz

644.53125 MHz

0.23 0.27 10 kHz - 20 MHz IDT Target Test Filter for 10GbE 0.24 0.28 20 kHz - 80 MHz ITU-T G.8262 limit 0.5 UI p-p (1 UI = 96.97 ps) 0.12 0.15 1 MHz - 30 MHz 0.07 0.09 1.875 MHz - 20 MHz IEEE 802.3-2008 limit 0.28 UI p-p / (1 UI = 96.97 ps) 0.20 0.23 10 kHz - 1 MHz NOTE 1: DPLL locked to input clock

57©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 35: SONET/SDH Output Clock Jitter Generation (jitter measured on one differential output of APLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

77.76 MHz

0.25 0.28 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p /

0.01 UI RMS

(STM-16: 1UI = 0.40 ns) 0.29 1.61 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.27 0.46 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.19 0.21 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.18 0.21 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 155.52MHz 0.23 0.26 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.29 1.90 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.27 0.38 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.24 0.28 5 kHz to 20 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-16: 1UI = 0.40 ns) 0.19 0.22 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.18 0.21 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.13 0.15 1 MHz to 20 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-16: 1UI = 0.40 ns)

58©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

311.04 MHz

0.23 0.26 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.26 0.30 20 kHz to 80 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.3 UI p-p (STM-64: 1 UI = 0.10 ns) ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-64: 1 UI = 0.10 ns) 0.14 0.19 4 MHz to 80 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p (STM-64: 1 UI = 0.10 ns) ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-64: 1 UI = 0.10 ns) 0.30 1.77 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.27 0.41 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.23 0.27 5 kHz to 20 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-16: 1UI = 0.40 ns) 0.19 0.22 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.18 0.21 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.11 0.14 1 MHz to 20 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-16: 1UI = 0.40 ns) Table 35: SONET/SDH Output Clock Jitter Generation (jitter measured on one differential output of APLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

59©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

622.08 MHz

0.23 0.26 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.25 0.29 20kHz to 80 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.3 UI p-p (STM-64: 1 UI = 0.10 ns) ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-64: 1 UI = 0.10 ns) 0.10 0.14 4 MHz to 80 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p (STM-64: 1 UI = 0.10 ns) ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-64: 1 UI = 0.10 ns) 0.30 1.41 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.28 0.51 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.23 0.28 5 kHz to 20 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-16: 1UI = 0.40 ns) 0.20 0.23 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.19 0.22 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.11 0.13 1 MHz to 20 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-16: 1UI = 0.40 ns) NOTE 1: DPLL locked to input clock Table 35: SONET/SDH Output Clock Jitter Generation (jitter measured on one differential output of APLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

60©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 36: SONET/SDH Output Clock Jitter Generation (jitter measured on one differential output of APLL1/2 with one differential output enabled Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

19.44 MHz

0.53 0.79 12 kHz to 1.3MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.62 0.90 12 kHz to 5MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.85 1.41 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.86 1.39 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.33 0.46 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.40 0.60 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.58 1.35 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.87 1.45 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.82 1.38 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.29 0.40 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.22 0.31 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns)

61©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet

155.52 MHz

0.55 0.82 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.87 1.52 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.81 1.43 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.65 1.03 5 kHz to 20 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-16: 1UI = 0.40 ns) 0.29 0.41 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.21 0.30 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.20 0.26 1 MHz to 20 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-16: 1UI = 0.40 ns) NOTE 1: DPLL locked to input clock Table 36: SONET/SDH Output Clock Jitter Generation (jitter measured on one differential output of APLL1/2 with one differential output enabled Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes

62©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 37: SONET/SDH Output Clock Jitter Generation (jitter measured on one CMOS output of APLL1/2 with one CMOS output enabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes 0.50 0.75 12 kHz to 1.3MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p / (STM-16: 1UI = 0.40 ns) 0.55 0.78 12 kHz to 5MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.83 2.31 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.80 2.27 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.29 0.54 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.28 0.40 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.58 0.91 12 kHz to 20 MHz GR-253-CORE and ITU-T G.813 Option 2 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) 0.87 2.39 500 Hz to 1.3 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-1: 1 UI = 6.43 ns) 0.82 2.10 1 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.5 UI p-p (STM-4: 1 UI = 1.61 ns) 0.29 0.42 65 kHz to 1.3 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-1: 1 UI = 6.43 ns) 0.22 0.37 250 kHz to 5 MHz ITU-T G.813 Option 1 limit 0.1 UI p-p (STM-4: 1 UI = 1.61 ns) NOTE 1: DPLL locked to input clock

63©2016 Integrated Device Technology, Inc. Revision 5, December 8, 2016 82P33731 Datasheet Table 38: DPLL1/DPLL2 Output Clock Jitter Generation (Jitter measured on one CMOS output of DPLL1/DPLL2 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes 10 MHz 100.11 619.64 100 Hz - 100 kHz N x 1.544 MHz (Note 2) 100.63 543.45 100 Hz - 40 kHz 16.06 39.94 8 kHz - 40 kHz ANSI T1.403 limit 0.07 UI p-p (DS1: 1 UI = 647 ns) N x 2.048 MHz (Note 3) 99.42 449.83 100 Hz - 100 kHz 10.66 26.44 18 kHz - 100 kHz ITU-T G.823 limit 0.2 UI p-p (E1: 1 UI = 488 ns)

34.368 MHz

101.67 202.75 100 Hz - 800 kHz 25.62 39.06 10 kHz - 800 kHz ITU-T G.751 limit 0.05 UI p-p (E3: 1 UI = 29.10 ns)

44.736 MHz

105.16 198.15 100 Hz - 400 kHz 20.77 27.44 30 kHz - 400 kHz NOTE 1:DPLL1/2 locked to input clock NOTE 2: Measured on 12.352 MHz output clock NOTE 3: Measured on 16.384 MHz output clock Table 39: DPLL3 Output Clock Jitter Generation (Jitter measured on one CMOS output of DPLL3 with all other outputs disabled) Output Frequency RMS Jitter Typ (ps) RM S Jitter Max (ps) Test Filter Notes N x 2.048 MHz Note 2 147.325 347.530 100 Hz - 100 kHz 8.02 17.24 18 kHz - 100 kHz ITU-T G.823 limit 0.2 UI p-p (E1: 1 UI = 488 ns) N x 1.544 MHz Note 3 133.88 303.43 100 Hz - 40 kHz 0.80 1.47 8 kHz - 40 kHz ANSI T1.403 limit 0.07 UI p-p (DS1: 1 UI = 647 ns) NOTE 1:DPLL3 locked to input clock NOTE 2: Measured on 12.288 MHz output clock NOTE 3: Measured on 12.352 MHz output clock

8.5 INPUT / OUTPUT CLOCK TIMING

The inputs and outputs are aligned ideally. But due to the circuit delays, there is delay between the inputs and outputs. Figure 33. Input / output clock timing

8.6 OUTPUT / OUTPUT CLOCK TIMING

Figure 34. Output / output clock timing NOTE 2. The measurements in the above table are over operational temperature, varying power supply and repeated power on/off cycle. NOTE 3. Measurements are taken using an ideal REF input and an ideal System clock to account for only internal delays in the device.

Figure 35. 144-Pin BAG Package Dimensions

Figure 36. 144-Pin BAG Package Recommended Land Pattern

DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This produ ct is intended for use in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recomme nded without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright ©2016 Integrated Device Technology, Inc. All rights reserved. Corporate Headquarters

6024 Silver Creek Valley Road

San Jose, CA 95138 USA Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com Tech Support email: clocks@idt.com

ORDERING INFORMATION

"G" after the two-letter package code denotes Pb-Free configuration, RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.

REVISION HISTORY

Table 42: Ordering Information Part/Order Number Package Temperature 82P33731ABAG 144-pin CABGA green package -40o to +85oC Rev. Date Description of Change 2 12/12/14 Page 50, Table 31 2 1/26/15 Pages 14, 35 2 1/5/15 Pages 38, 62 (Table 42), 65 (Table 44), 66 (Table 45) 2 4/21/15 Pages 62, 64, 66-68 2 5/13/15 Page 50 3 6/16/15 Pages 10, 14, 41 4 3/25/16 Page 32, 52 5 12/8/16 Pages 1, 5-6, 9- 11, 22-23, 28, 51-52, 64

DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This produ ct is intended for use in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recomme nded without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright ©2016 Integrated Device Technology, Inc. All rights reserved. Corporate Headquarters San Jose, CA 95138 USA Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com Tech Support email: clocks@idt.com