8001 VECTOR | Alldatasheet

Document overview

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  • PDF pages: 4

Technical content

11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708 Products Web site: http://www.vectorelect.com ELECTRONIC COMPANY Toll-Free (800) 423-5659 Circuit Pattern: 3-Hole Solder Pad Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 20 Material: CEM-1 Solder Terminals: T42-1, K24C, K31C Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 12.86"/.062" Height: 4.00" Contacts: N/A 16-Pin DIP Capacity: 124 Material: FR4 Epoxy Glass Wire-Wrap Terminals: T44, T46, T49, T68, Solder Terminals: T42-1 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 8010 4.0" x 13.0"

  • Precision-Drilled, plated-thru holes
  • 0.080" diameter, isolated solder pad around each hole
  • Board size and surface area approxi- mate Macintosh II specifications
  • Unrestricted component placement VECTORBORD®Prototyping Boards (Circbord®) 8001 4.50" x 6.5"
  • Ideal for wire-wrap

applications

  • Power and ground buses etched onto wiring side only
  • Bus surfaces solder coated for user convenience
  • Mount components with 0.3", 0.6" and 0.9" lead spacing
  • I/O area with solder pads for mounting connector 8002 4.5" x 6.5" Circuit Pattern: Interleaved Buses Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 36 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 8003 4.5" x 6.5" Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 60 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46. T49. T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042"
  • Square solder pad etched around each hole on wiring side
  • Accommodates any type DIP IC device or discrete component
  • Circuit pattern etched onto wiring side only
  • Solder mount DIP sockets or IC devices with any lead spacing
  • 3-hole solder pads interconnecting multiple component leads

Specifications subject to change without notice. General Proto Products ELECTRONIC COMPANY VECTORBORD® Circuit Pattern: 3-Hole Solder Pad Contacts: N/A Width/Thick: 8.08"/.062" Height: 4.50" 16-Pin DIP Capacity: 21 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" Circuit Pattern: Ground Plane Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 50 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 8007 4.5" x 6.5" Circuit Pattern: Pad-Per-Hole/ Ground Plane Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 60 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042"

  • Pad-Per-Hole pattern on component side - overall Ground Plane pattern on wiring side
  • To commit wire-wrap pins to ground planes, use Vector T124 solder washers, available separately
  • 0.080" diameter, isolated solder pad around holes, component side
  • Accommodates any type DIP IC device or discrete component
  • Plane and pad surfaces solder- coated for user convenience 8004 4.5" x 6.5"
  • To commit wire-wrap pins to voltage and ground planes, use Vector T124 solder washers, available separately
  • 0.085" diameter clearance around holes
  • Etched overall ground plane on wiring side only
  • Plane surfaces solder-coated for user convenience
  • I/O area with solder pads for mounting connector
  • Unique circuit pattern features full voltage and ground planes on opposite sides with isolated, plated-thru holes
  • 0.080" diameter, isolated solder pad around holes, component side
  • Plane surfaces solder-coated for user convenience
  • SMD cap positions for discrete decoupling capacitors Circuit Pattern: Pads & Planes Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 70 Material: FR4 Epoxy Glass Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 8008 4.5" x 6.5"
  • Etched circuit pattern on wiring side only
  • 0.080" diameter, isolated solder pad around holes, both sides
  • 3-hole solder pads interconnecting multiple component leads
  • Pad and bus surfaces solder- coated for user convenience Prototyping Boards (Circbord®)

11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708 Products Web site: http://www.vectorelect.com ELECTRONIC COMPANY Toll-Free (800) 423-5659 Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 13.25"/.062" Height: 5.00" 16-Pin DIP Capacity: 154 Material: FR4 Epoxy Glass Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, 49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 45P80-1 4.5" x 8.08"

  • Isolated, square pads around each hole VECTORBORD®Prototyping Boards (Circbord®) Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 11.00"/.062" Height: 9.20" 16-Pin DIP Capacity: 283 Material: FR4 Epoxy Glass Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042"
  • Plated-thru holes
  • Approximates Eurocard (DIN) specifications: 6U x 280MM, can be sheared down to 6U x 220MM, or 160MM
  • 0.080" diameter, isolated solder pad around holes
  • Unrestricted component placement, extended area for high density applications 8006 5.0" x 13.25" 8012 9.2" x 11.0" Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 8.08"/.062" Height: 4.50" 16-Pin DIP Capacity: 80 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042"
  • Copper plated-thru holes
  • 0.080" diameter, isolated solder pad around holes, both sides
  • Unrestricted component place ment, extended area for high density applications
  • Board can be cut down into smaller units

Specifications subject to change without notice. General Proto Products ELECTRONIC COMPANY Circuit Pattern: Pad-Per-Hole & Ground Plane, 2 sides Contacts: N/A Width/Thick: 10.60"/.062" Height: 18.00 16-Pin DIP Capacity: 400 Material: FR4 Epoxy Glass Solder Terminals: T42 Wire-Wrap Terminals: T44, T46, T49,T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 10.60"/.062" Height: 10.60" 16-Pin DIP Capacity: 275 Material: FR4 Epoxy Glass Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 106P106-1 10.6" x 10.6"

  • Individual pads with plated-thru holes
  • Etched ground plane surrounds pads on both sides
  • 0.080" diameter, isolated solder pad around each hole, both sides 106P180-4 10.6" X 18.0" 106P70-4 7.0" x 10.6" Circuit Pattern: Pad-Per-Hole & Ground Plane Contacts: N/A Width/Thick: 7.0"/.062" Height: 10.60" 16-Pin DIP Capacity: 175 Material: FR4 Epoxy Glass 2 sides Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042"
  • Individual pads with plated-thru holes
  • Etched ground plane surrounds pads on both sides
  • 0.080" diameter, isolated solder pad around each hole, both sides Prototyping Boards (Circbord®)VECTORBORD® Ð Ð Ð
  • 0.080" diameter, isolated solder pad around each hole, both sides 10.6" Ð 18.0"