78ST105 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 5
Technical content
For assistance or to order, call (800) 531-5782 Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com2 Revised 6/30/98 Standard Application C1 = Optional 1µF ceramic C2 = Required 100µF electrolytic Pin-Out Information Pin Function 1V in
2 GND
Ordering Information
33 = 3.3 Volts 36 = 3.6 Volts 05 = 5.0 Volts 51 = 5.1 Volts 65 = 6.5 Volts 07 = 7.0 Volts 08 = 8.0 Volts 09 = 9.0 Volts 12 = 12.0 Volts Package Suffix V = Vertical Mount S = Surface Mount H = Horizontal Mount
1.5 AMP POSITIVE STEP-DOWN
INTEGRATED SWITCHING REGULATOR
- Very Small Footprint
- High Efficiency > 85%
- Self-Contained Inductor
- Internal Short-Circuit Protection
- Over-T emperature Protection
- Fast T ransient Response
- Wide Input Range The 78ST100 is a series of wide input voltage, 3-terminal Integrated Switching Regulators (ISRs). These ISRs have a maxi- mum output current of 1.5A and an output voltage that is laser trimmed to a variety of industry standard voltages. These 78 series regulators have excellent line and load regulation with internal short- circuit and over-temperature protection, are very flexible, and may be used in a wide variety of applications. 78ST100 Series Output Voltage Specifications Characteristics 78ST100 SERIES (Ta = 25°C unless noted) Symbols Conditions Min Typ Max Units Output Current I o Over Vin range 0.1* — 1.5 A Short Circuit Current I sc Vin = Vin min — 3.5 — Apk Input Voltage Range V in 0.1 £ Io £ 1.5A V o= 3.3V 7 — 26 V Vo= 5V 7 — 30 V Vo= 12V 14.5 — 30 V Output Voltage Tolerance DVo Over Vin range, Io=1.5A — ±1.0 ±2.0 %V oTa = 0°C to +60°C Line Regulation Reg line Over Vin range — ±0.2 ±0.4 %V o Load Regulation Reg load 0.1 £ Io £ 1.5A — ±0.1 ±0.2 %V o Vo Ripple/Noise V n Vin= 9V, Io= 1.5A V o= 5V — 65 — mV pp Vin= 16V, Io= 1.5A V o= 12V 90 mV pp Transient Response t tr 50% load change — 100 — µSec (with 100µF output cap) V o over/undershoot — 5 — %V o Efficiency h Vin= 10V, Io= 1A V o= 3.3V — 80 — % Vin= 10V, Io= 1A V o= 5V — 85 — % Vin= 17V, Io= 1A V o= 12V — 90 — % Switching Frequency ƒ o Over Vin range, Io=1.5A 600 650 700 kHz Absolute Maximum T a — -40 — +85 °COperating T emperature Range Recommended Operating T a Free Air Convection, (40-60LFM) Temperature Range At V in= 24V, Io=1.0A -40 — +80** °C Thermal Resistance qja Free Air Convection, (40-60LFM) — 45 — °C/W Storage Temperature T s — -40 — +125 °C Mechanical Shock — Per Mil-STD-883D, Method 2002.3 — 500 — G’s Mechanical Vibration — Per Mil-STD-883D, Method 2007.2, —5 — G’s20-2000 Hz, soldered in a PC board Weight — — — 6.5 — grams *ISR will operate down to no load with reduced specifications. **See Thermal Derating chart. Note: The 78ST100 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications. 78ST100 Vout GNDGND Vin Pkg Style 500
For assistance or to order, call (800) 531-5782 Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.powertrends.com 3 DATA SHEETS CHARACTERISTIC DATA 0.2 0.4 0.6 0.8 1.2 1.4 1.6 9 1 31 72 12 5 0.2 0.4 0.6 0.8 1.2 1.4 1.6 9 1 21 51 82 12 42 73 03 33 63 9 0.2 0.4 0.6 0.8 1.2 1.4 1.6 16 19 22 25 28 31 34 37 40 78ST133_ 3.3 VDC (See Note 1) 78ST105_ 5.0 VDC (See Note 1) 78ST112_ 12.0 VDC (See Note 1) Efficiency vs Output Current Ripple vs Output Current Thermal Derating (T a) (See Note 2) Power Dissipation vs Output Current Efficiency (%)Ripple (mV)Iout (A)Pd (Watts) Efficiency (%) Efficiency (%) Ripple (mV) Ripple (mV)Iout (A) Iout (A) Pd (Watts) Pd (Watts) Iout (A) Iout (A) Iout (A) Iout (A) Iout (A) Iout (A) Iout (A) Iout (A) Iout (A) Vin (Volts) Vin (Volts)Vin (Volts) 85°C 60°C 70°C 85°C 85°C 70°C Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR. Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Notes.) 60°C 70°C 78ST100 Series Efficiency vs Output Current Efficiency vs Output Current Ripple vs Output Current Ripple vs Output Current Thermal Derating (T a) (See Note 2) Thermal Derating (Ta) (See Note 2) Power Dissipation vs Output Current Power Dissipation vs Output Current 100 0.0 0.5 1.0 1.5 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Vin 0.0 0.5 1.0 1.5 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Vin 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.5 1.0 1.5 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Vin 100 0.0 0.5 1.0 1.5 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Vin 0.0 0.5 1.0 1.5 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Vin 60°C 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 0.5 1.0 1.5 7.0V 10.0V 15.0V 20.0V 25.0V 30.0V Vin 100 0.0 0.5 1.0 1.5 14.0V 20.0V 25.0V 30.0V 35.0V Vin 100 120 140 0.0 0.5 1.0 1.5 14.0V 20.0V 25.0V 30.0V 35.0V Vin 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0.5 1.0 1.5 14.0V 20.0V 25.0V 30.0V 35.0V Vin
www.ti.com 23-Aug-2012 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 78ST105HC NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST105SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM 78ST105SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST105VC NRND SIP MODULE EFD 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST107HC OBSOLETE SIP MODULE EFA 3 TBD Call TI Call TI 78ST107SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST107SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST107VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI 78ST108HC OBSOLETE SIP MODULE EFA 3 TBD Call TI Call TI 78ST108SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST108SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST108VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI 78ST109SC NRND SIP MODULE EFC 3 TBD Call TI Call TI 78ST109SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST109TC OBSOLETE SIP MODULE EFT 3 TBD Call TI Call TI 78ST112HC NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST112SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM 78ST112SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST112TC OBSOLETE SIP MODULE EFT 3 TBD Call TI Call TI 78ST112VC NRND SIP MODULE EFD 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST133HC NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST133SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM 78ST133SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST133VC NRND SIP MODULE EFD 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST136SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST136SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST136VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI 78ST151HC OBSOLETE SIP MODULE EFA 3 TBD Call TI Call TI 78ST151SC OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST151SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI
www.ti.com 23-Aug-2012 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 78ST151VC OBSOLETE SIP MODULE EFD 3 TBD Call TI Call TI 78ST165HC NRND SIP MODULE EFA 3 25 Pb-Free (RoHS) Call TI N / A for Pkg Type 78ST165SC NRND SIP MODULE EFC 3 25 Pb-Free (RoHS) Call TI Level-1-215C-UNLIM 78ST165SCT OBSOLETE SIP MODULE EFC 3 TBD Call TI Call TI 78ST165VC NRND SIP MODULE EFD 3 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46C and todiscontinueany productorserviceperJESD48B. Buyersshould obtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.All semiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsalesuppliedatthetime oforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. ReproductionofsignificantportionsofTIinformationinTIdatabooks ordatasheetsispermissibleonlyifreproductioniswithoutalteration and isaccompaniedby allassociatedwarranties,conditions,limitations,and notices.TIisnotresponsibleorliableforsuch altered documentation.Informationofthirdpartiesmay be subjecttoadditionalrestrictions. ResaleofTIcomponents orserviceswithstatementsdifferentfromorbeyond theparametersstatedby TIforthatcomponent orservice voidsallexpressand any impliedwarrantiesfortheassociatedTIcomponent orserviceand isan unfairand deceptivebusinesspractice. TIisnotresponsibleorliableforany such statements. Buyeracknowledgesand agreesthatitissolelyresponsibleforcompliancewithalllegal,regulatoryand safety-relatedrequirements concerningitsproducts,and any use ofTIcomponents initsapplications,notwithstandingany applications-relatedinformationorsupport thatmay be providedby TI.Buyerrepresentsand agreesthatithas allthenecessaryexpertisetocreateand implementsafeguardswhich anticipatedangerousconsequencesoffailures,monitorfailuresand theirconsequences,lessenthelikelihoodoffailuresthatmightcause harm and takeappropriateremedialactions.BuyerwillfullyindemnifyTIand itsrepresentativesagainstany damages arisingoutoftheuse ofany TIcomponents insafety-criticalapplications. Insome cases,TIcomponents may be promotedspecificallytofacilitatesafety-relatedapplications.Withsuch components,TI’s goalisto helpenablecustomerstodesignand createtheirown end-productsolutionsthatmeet applicablefunctionalsafetystandardsand requirements.Nonetheless,such components aresubjecttotheseterms. No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents whichmeet ISO/TS16949 requirements,mainlyforautomotiveuse.Components which have notbeen so designatedareneitherdesignednorintendedforautomotiveuse;and TIwillnotbe responsibleforany failureofsuch components tomeet such requirements. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP MobileProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2012,Texas InstrumentsIncorporated