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SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Copyright 1988, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988 3POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988
4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988 5POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988
6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS670, SN74LS670 4-BY-4 REGISTER FILES WITH 3-STATE OUTPUTS SDLS193 – MARCH 1974 – REVISED MARCH 1988 7POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
www.ti.com 25-Sep-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples 5962-7704201VEA ACTIVE CDIP J 16 25 TBD A42 N / A for Pkg Type -55 to 125 5962-7704201VE A SNV54LS670J 5962-7704201VFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type -55 to 125 5962-7704201VF A SNV54LS670W 5962-7704201VFA ACTIVE CFP W 16 25 TBD A42 N / A for Pkg Type -55 to 125 5962-7704201VF A SNV54LS670W 7704201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201EA SNJ54LS670J 7704201EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201EA SNJ54LS670J 7704201FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201FA SNJ54LS670W 7704201FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201FA SNJ54LS670W SN54LS670J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS670J SN54LS670J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS670J SN74LS670D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS670 SN74LS670D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS670 SN74LS670DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS670 SN74LS670DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS670 SN74LS670DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS670 SN74LS670DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS670 SN74LS670N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS670N
www.ti.com 25-Sep-2013 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples SN74LS670N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS670N SN74LS670N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS670N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS670NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS670N SN74LS670NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS670N SN74LS670NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS670 SN74LS670NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS670 SN74LS670NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS670 SN74LS670NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS670 SN74LS670NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS670 SN74LS670NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS670 SNJ54LS670FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 670FK SNJ54LS670FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 670FK SNJ54LS670J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201EA SNJ54LS670J SNJ54LS670J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201EA SNJ54LS670J SNJ54LS670W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201FA SNJ54LS670W SNJ54LS670W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7704201FA SNJ54LS670W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
www.ti.com 25-Sep-2013 Addendum-Page 3 PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54LS670, SN54LS670-SP, SN74LS670 :
- Catalog: SN74LS670 , SN54LS670
- Military: SN54LS670
- Space: SN54LS670-SP NOTE: Qualified Version Definitions:
- Catalog - TI's standard catalog product
www.ti.com 25-Sep-2013 Addendum-Page 4
- Military - QML certified for Military and Defense Applications
- Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS670NSR SO NS 16 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Pack Materials-Page 2
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No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. 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