7700801DA

LM139-MIL TI | Alldatasheet

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Technical content

IN− OUT Product Folder Order Now T echnical Documents Tools & Software Support & Community An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. LM139-MIL SLCS160 – JUNE 2017 LM139-MILQuadDifferentialComparators

1 Features

1• Wide Supply Ranges – Single Supply: 2 V to 36 V (Tested to 30 V) – Dual Supplies: ±1 V to ±18 V (Tested to ±15 V)

• Low Supply-Current Drain Independent of Supply Voltage: 0.8 mA (Typical)
• Low Input Bias Current: 25 nA (Typical)
• Low Input Offset Current: 3 nA (Typical)
• Low Input Offset Voltage: 2 mV (Typical)
• Common-Mode Input Voltage Range Includes Ground
• Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage: ±36 V
• Low Output Saturation Voltage
• Output Compatible With TTL, MOS, and CMOS
• On Products Compliant to MIL-PRF-38535, All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.

2 Applications

• Industrial
• Automotive – Infotainment and Clusters – Body Control Modules
• Power Supervision
• Oscillators
• Peak Detectors
• Logic Voltage Translation

3 Description

The LM139-MIL device consists of four independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible, as long as the difference between the two supplies is 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. The LM139-MIL device is characterized for operation over the full military temperature range of –55°C to +125°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LM139-MIL CDIP (14) 21.30 mm × 7.60 mm LCCC (20) 8.90 mm × 8.90 mm CFP (14) 9.20 mm × 6.29 mm SOIC (14) 8.70 mm × 3.90 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic

SLCS160 – JUNE 2017 www.ti.com Product Folder Links: LM139-MIL Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Table of Contents

11.1 Receiving Notification of Documentation Updates 11

12 Mechanical, Packaging, and Orderable

4 Revision History

June 2017 * Initial release.

4IN− VC C NC 2IN− NC 2IN+ 2OUT 1OUT NC 3IN−3IN+ 3OUT 4OUT 1IN−1IN+NC 1OUT 2OUT VC C 2IN− 2IN+ 1IN− 1IN+ OUT3 OUT4 GND 4IN+ 4IN− 3IN+ 3IN− LM139-MIL www.ti.com SLCS160 – JUNE 2017 Product Folder Links: LM139-MIL Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

5 Pin Configuration and Functions

D, J, or W Package SOIC, CDIP, or CFP Top View 20-Pin LCCC Top View NC = no internal connection. (1) I = Input, O = Output Pin Functions PIN I/O(1) DESCRIPTION NAME D, J, W FK 1IN+ 7 10 I Positive input pin of the comparator 1 1IN– 6 9 I Negative input pin of the comparator 1 1OUT 1 2 O Output pin of the comparator 1 2IN+ 5 8 I Positive input pin of the comparator 2 2IN– 4 6 I Negative input pin of the comparator 2 2OUT 2 3 O Output pin of the comparator 2 3IN+ 9 13 I Positive input pin of the comparator 3 3IN– 8 12 I Negative input pin of the comparator 3 3OUT 14 20 O Output pin of the comparator 3 4IN+ 11 16 I Positive input pin of the comparator 4 4IN– 10 14 I Negative input pin of the comparator 4 4OUT 13 19 O Output pin of the comparator 4 GND 12 18 — Ground VCC 3 4 — Supply pin NC — — No connect (no internal connection)

SLCS160 – JUNE 2017 www.ti.com Product Folder Links: LM139-MIL Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential voltages, are with respect to network ground. (3) Differential voltages are at xIN+ with respect to xIN–. (4) Input current flows through parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output to be incorrect. Normal operation resumes when input is removed. (5) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VCC Supply voltage(2) 36 V VID Differential input voltage(3) ±36 V VI Input voltage range (either input) –0.3 36 V IK Input current(4) –50 mA VO Output voltage 36 V IO Output current 20 mA Duration of output short circuit to ground(5) Unlimited TJ Operating virtual-junction temperature 150 °C Case temperature for 60 s FK package 260 °C Lead temperature 1.6 mm (1/16 in) from case for 60 s J package 300 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage 2 30 V TJ Junction temperature –55 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.4 Thermal Information

THERMAL METRIC(1) LM139-MIL UNIT D (SOIC) J (CDIP) W (CFP) FK (LCCC) RθJA Junction-to-ambient thermal resistance 98.8 89.5 156.2 82.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 64.3 46.1 86.7 60.7 °C/W RθJB Junction-to-board thermal resistance 59.7 78.7 154.6 59.4 °C/W ψJT Junction-to-top characterization parameter 25.7 3 56.5 53 °C/W ψJB Junction-to-board characterization parameter 59.3 71.8 133.5 58.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 24.2 14.3 9.7 °C/W

www.ti.com SLCS160 – JUNE 2017 Product Folder Links: LM139-MIL Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated (1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified. (2) The voltage at either input or common-mode must not be allowed to go negative by more than 0.3 V. The upper end of the common- mode voltage range is VCC+ – 1.5 V; however, one input can exceed VCC, and the comparator will provide a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to 30 V without damage.

6.5 Electrical Characteristics

at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT VIO Input offset voltage VCC = 5 V to 30 V, VIC = VICR min, VO = 1.4 V TA = 25°C 2 5 mVTA = –55°C to +125°C 9 IIO Input offset current VO = 1.4 V TA = 25°C 3 25 nATA = –55°C to +125°C 100 IIB Input bias current VO = 1.4 V TA = 25°C –25 –100 nATA = –55°C to +125°C –300 VICR Common-mode input-voltage range(2) TA = 25°C 0 to VCC – 1.5 V TA = –55°C to +125°C 0 to VCC – 2 AVD Large-signal differential-voltage amplification VCC+ = ±7.5 V, VO = –5 V to +5 V TA = 25°C 200 V/mV IOH High-level output current VID = 1 V VOH = 5 V TA = 25°C 0.1 nA VOH = 30 V TA = –55°C to +125°C 1 μA VOL Low-level output voltage VID = –1 V, IOL = 4 mA TA = 25°C 150 400 mVTA = –55°C to +125°C 700 IOL Low-level output current VID = –1 V, VOL = 1.5 V TA = 25°C 6 16 mA ICC Supply current (four comparators) VO = 2.5 V, No load TA = 25°C 0.8 2 mA (1) CL includes probe and jig capacitance. (2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.

6.6 Switching Characteristics

VCC = 5 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT Response time RL connected to 5 V through 5.1 kΩ, CL = 15 pF(1)(2) 100-mV input step with 5-mV overdrive 1.3 μs TTL-level input step 0.3

6.7 Typical Characteristics

Figure 1. Supply Current vs Supply Voltage Figure 2. Input Bias Current vs Supply Voltage Figure 3. Output Saturation Voltage Figure 4. Response Time for Various Overdrives Figure 5. Response Time for Various Overdrives

7 Detailed Description

7.1 Overview

due to very wide supply voltages range (2 V up to 32 V), low Iq, and fast response of the device. to be used in AND functionality.

7.2 Functional Block Diagram

Figure 6. Schematic (Each Comparator)

7.3 Feature Description

input. Allow for (VCC – 2 V) at cold temperature.

7.4 Device Functional Modes

7.4.1 Voltage Comparison

8 Application and Implementation

the design implementation to confirm system functionality.

8.1 Application Information

shifting to a higher or lower voltage.

8.2 Typical Application

Figure 7. Single-Ended and Differential Comparator Configurations

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters

8.2.2 Detailed Design Procedure

• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time

8.2.2.1 Input Voltage Range

www.ti.com SLCS160 – JUNE 2017 Product Folder Links: LM139-MIL Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated The following list describes the outcomes of some input voltage situations.

• When both IN– and IN+ are both within the common-mode range: – If IN– is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current – If IN– is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting
• When IN– is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current
• When IN+ is higher than common mode and IN– is within common mode, the output is high impedance and the output transistor is not conducting
• When IN– and IN+ are both higher than common mode, the output is low and the output transistor is sinking current

8.2.2.2 Minimum Overdrive Voltage

Overdrive voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (VIO). To make an accurate comparison, the overdrive voltage (VOD) must be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 8 and Figure 9 show positive and negative response times with respect to overdrive voltage.

8.2.2.3 Output and Drive Current

Output current is determined by the load and pullup resistance and logic and pullup voltage. The output current produces a low-level output voltage (VOL) from the comparator, where VOL is proportional to the output current. The output current can also effect the transient response.

8.2.2.4 Response Time

Response time is a function of input over-drive. See the Typical Characteristics graphs for typical response times. The rise and fall times can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and equivalent collector-emitter resistance (RCE).

• The rise time (τR) is approximately τR~ RPULLUP × CL
• The fall time (τF) is approximately τF ~ RCE × CL – RCE can be determined by taking the slope of Figure 3 in its linear region at the desired temperature, or by dividing the VOL by IOUT

3 GND

8.2.3 Application Curves

Figure 8 and Figure 9 were generated with scope probe parasitic capacitance of 50 pF. Figure 8. Response Time vs Output Voltage Figure 9. Response Time vs Output Voltage

9 Power Supply Recommendations

input and create an inaccurate comparison.

10 Layout

10.1 Layout Guidelines

supply and negative supply (if available). the device and system ground.

10.2 Layout Example

Figure 10. LM139-MIL Layout Example

www.ti.com SLCS160 – JUNE 2017 Product Folder Links: LM139-MIL Submit Documentation FeedbackCopyright © 2017, Texas Instruments Incorporated

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation.

www.ti.com 29-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) 77008012A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 77008012A LM139FKB 7700801CA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7700801CA LM139JB 7700801DA Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7700801DA LM139WB JM38510/11201BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510 /11201BCA JM38510/11201BCA.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510 /11201BCA LM139FK Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM139FK LM139FK.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM139FK LM139FKB Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 77008012A LM139FKB LM139FKB.A Active Production LCCC (FK) | 20 55 | TUBE No SNPB N/A for Pkg Type -55 to 125 77008012A LM139FKB LM139J Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM139J LM139J.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM139J LM139JB Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7700801CA LM139JB LM139JB.A Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7700801CA LM139JB LM139W Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM139W LM139W.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 LM139W LM139WB Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7700801DA LM139WB LM139WB.A Active Production CFP (W) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 7700801DA LM139WB M38510/11201BCA Active Production CDIP (J) | 14 25 | TUBE No SNPB N/A for Pkg Type -55 to 125 JM38510 /11201BCA (1) Status: For more details on status, see our product life cycle. Addendum-Page 1

www.ti.com 29-May-2025 (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM139-MIL :

• Space : LM139-SP NOTE: Qualified Version Definitions:
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-May-2025 TUBE L - Tube length T - Tube height W - Tube width B - Alignment groove width *All dimensions are nominal Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm) 77008012A FK LCCC 20 55 506.98 12.06 2030 NA 7700801DA W CFP 14 25 506.98 26.16 6220 NA LM139FK FK LCCC 20 55 506.98 12.06 2030 NA LM139FK.A FK LCCC 20 55 506.98 12.06 2030 NA LM139FKB FK LCCC 20 55 506.98 12.06 2030 NA LM139FKB.A FK LCCC 20 55 506.98 12.06 2030 NA LM139W W CFP 14 25 506.98 26.16 6220 NA LM139W.A W CFP 14 25 506.98 26.16 6220 NA LM139WB W CFP 14 25 506.98 26.16 6220 NA LM139WB.A W CFP 14 25 506.98 26.16 6220 NA Pack Materials-Page 1

www.ti.com GENERIC PACKAGE VIEW This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. LCCC - 2.03 mm max heightFK 20 LEADLESS CERAMIC CHIP CARRIER8.89 x 8.89, 1.27 mm pitch 4229370\\/A\\

www.ti.com PACKAGE OUTLINE C 14X .008-.014 [0.2-0.36]TYP -150 AT GAGE PLANE -.314 .308 -7.97 7.83 [ ] 14X -.026 .014 -1.65 1.15 [ ] .2 MAX TYP [5.08] .13 MIN TYP [3.3] TYP-.060 .015 -1.52 0.38 [ ] 4X .005 MIN [0.13] 12X .100 [2.54] .015 GAGE PLANE [0.38] A -.785 .754 -19.9419.15 [ ] B -.283 .245 -7.19 6.22 [ ] CDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGE 4214771/A 05/2017 NOTES: 1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only. 5. Falls within MIL-STD-1835 and GDIP1-T14. 7 8 PIN 1 ID (OPTIONAL) SCALE 0.900 SEATING PLANE .010 [0.25] C A B

www.ti.com EXAMPLE BOARD LAYOUT ALL AROUND [0.05] MAX .002 .002 MAX [0.05] ALL AROUND SOLDER MASK OPENING METAL (.063) [1.6] (R.002 ) TYP [0.05] 14X ( .039) [1] ( .063) [1.6] 12X (.100 ) [2.54] (.300 ) TYP [7.62] CDIP - 5.08 mm max heightJ0014A CERAMIC DUAL IN LINE PACKAGE 4214771/A 05/2017 LAND PATTERN EXAMPLE NON-SOLDER MASK DEFINED SCALE: 5X SEE DETAIL A SEE DETAIL B SYMM SYMM 7 8 DETAIL A SCALE: 15X SOLDER MASK OPENING METAL DETAIL B 13X, SCALE: 15X

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