74VCX16244 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
Features
- Designed for Low V oltage Operation: VCC = 1.65 V − 3.6 V
- 3.6 V Tolerant Inputs and Outputs
- High Speed Operation: 2.5 ns max for 3.0 V to 3.6 V 3.0 ns max for 2.3 V to 2.7 V 6.0 ns max for 1.65 V to 1.95 V
- Static Drive:±24 mA Drive at 3.0 V ±18 mA Drive at 2.3 V ±6 mA Drive at 1.65 V
- Supports Live Insertion and Withdrawal
- IOFF Specification Guarantees High Impedance When VCC = 0 V
- Near Zero Static Supply Current in All Three Logic States (20 A) Substantially Reduces System Power Requirements
- Latchup Performance Exceeds ±250 mA @ 125 °C
- ESD Performance: Human Body Model >2000 V; Machine Model >200 V
- All Devices in Package TSSOP are Inherently Pb−Free* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MARKING DIAGRAM A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week TSSOP−48 DT SUFFIX CASE 1201 VCX16244 AWLYYWW Device Package Shipping †
ORDERING INFORMATION
(Pb−Free) 39 / Rail 74VCX16244DTR TSSOP (Pb−Free) 2500 / Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com
481 OE2OE1
472 D0O0
463 D1O1
454 GNDGND
445 D2O2
436 D3O3
427 VCCVCC
418 D4O4
409 D5O5
3910 GNDGND
3811 D6O6
3712 D7O7
3613 D8O8
3514 D9O9
3415 GNDGND
3316 D10O10
3217 D11O11
3118 VCCVCC
3019 D12O12
2920 D13O13
2821 GNDGND
2722 D14O14
2623 D15O15
2524 OE3OE4
Figure 1. 48−Lead Pinout Figure 2. Logic Diagram Figure 3. IEC Logic Diagram Table 1. PIN NAMES
http://onsemi.com ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +4.6 V VI DC Input Voltage −0.5 ≤ VI ≤ +4.6 V VO DC Output Voltage −0.5 ≤ VO ≤ +4.6 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Note 1; Outputs Active V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. I O absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit VCC Supply Voltage Operating Data Retention Only 1.65 1.2 3.3 3.3 3.6 3.6 V VI Input Voltage −0.3 3.6 V VO Output Voltage (Active State) (3−State) VCC 3.6 V IOH HIGH Level Output Current, VCC = 3.0 V − 3.6 V −24 mA IOL LOW Level Output Current, VCC = 3.0 V − 3.6 V 24 mA IOH HIGH Level Output Current, VCC = 2.3 V − 2.7 V −18 mA IOL LOW Level Output Current, VCC = 2.3 V − 2.7 V 18 mA IOH HIGH Level Output Current, VCC = 1.65 V − 1.95 V −6 mA IOL LOW Level Output Current, VCC = 1.65 V − 1.95 V 6 mA TA Operating Free−Air Temperature −40 +85 °C t/V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V
http://onsemi.com DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol Characteristic Condition Min Max Unit VIH HIGH Level Input Voltage (Note 2) 1.65 V ≤ VCC < 2.3 V 0.65 x VCC V 2.3 V ≤ VCC ≤ 2.7 V 1.6 2.7 V < VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 1.65 V ≤ VCC < 2.3 V 0.35 x VCC V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V < VCC ≤ 3.6 V 0.8 VOH HIGH Level Output Voltage 1.65 V ≤ VCC ≤ 3.6 V; IOH = −100 A VCC − 0.2 V VCC = 1.65 V; IOH = −6 mA 1.25 VCC = 2.3 V; IOH = −6 mA 2.0 VCC = 2.3 V; IOH = −12 mA 1.8 VCC = 2.3 V; IOH = −18 mA 1.7 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 1.65 V ≤ VCC ≤ 3.6 V; IOL = 100 A 0.2 V VCC = 1.65 V; IOL = 6 mA 0.3 VCC = 2.3 V; IOL = 12 mA 0.4 VCC = 2.3 V; IOL = 18 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 18 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 II Input Leakage Current 1.65 V ≤ VCC ≤ 3.6 V; 0 V ≤ VI ≤ 3.6 V ±5.0 A IOZ 3−State Output Current 1.65 V ≤ VCC ≤ 3.6 V; 0 V ≤ VO ≤ 3.6 V; VI = VIH or VIL ±10 A IOFF Power−Off Leakage Current VCC = 0 V; VI or VO = 3.6 V 10 A ICC Quiescent Supply Current (Note 3) 1.65 V ≤ VCC ≤ 3.6 V; VI = GND or VCC 20 A 1.65 V ≤ VCC ≤ 3.6 V; 3.6 V ≤ VI, VO ≤ 3.6 V ±20 A ICC Increase in ICC per Input 2.7 V < VCC ≤ 3.6 V; VIH = VCC − 0.6 V 750 A 2. These values of VI are used to test DC electrical characteristics only. 3. Outputs disabled or 3−state only.
http://onsemi.com AC CHARACTERISTICS (Note 4; tR = tF = 2.0 ns; CL = 30 pF; RL = 500 ) TA = −40°C to +85°C Symbol Parameter Waveform Min Max Min Max Min Max Unit tPLH tPHL Propagation Delay Input−to−Output 1 0.8 0.8 2.5 2.5 1.0 1.0 3.0 3.0 1.5 1.5 6.0 6.0 ns tPZH tPZL Output Enable Time to High and Low Level 2 0.8 0.8 3.5 3.5 1.0 1.0 4.1 4.1 1.5 1.5 8.2 8.2 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 0.8 0.8 3.5 3.5 1.0 1.0 3.8 3.8 1.5 1.5 6.8 6.8 ns tOSHL tOSLH Output−to−Output Skew (Note 5) 0.5 0.5 0.5 0.5 0.75 0.75 ns 4. For CL = 50 pF, add approximately 300 ps to the AC maximum specification. 5. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL ) or LOW−to−HIGH (tOSLH ); parameter guaranteed by design. AC CHARACTERISTICS (tR = tF = 2.0 ns; CL = 50 pF; RL = 500 ) TA = −40C to +85C VCC = 3.0 V to 3.6 V VCC = 2.7 V Symbol Parameter Waveform Min Max Min Max Unit tPLH tPHL Propagation Delay Input−to−Output 3 1.0 1.0 3.0 3.0 3.6 3.6 ns tPZH tPZL Output Enable Time to High and Low Level 4 1.0 1.0 4.4 4.4 5.4 5.4 ns tPHZ tPLZ Output Disable Time From High and Low Level 4 1.0 1.0 4.1 4.1 4.6 4.6 ns tOSHL tOSLH Output−to−Output Skew (Note 6) 0.5 0.5 0.5 0.5 ns 6. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL ) or LOW−to−HIGH (tOSLH ); parameter guaranteed by design.
http://onsemi.com DYNAMIC SWITCHING CHARACTERISTICS Symbol Characteristic Condition Typical (TA = +25°C) Unit VOLP Dynamic LOW Peak Voltage (Note 7) VCC = 1.8 V, CL = 30 pF, VIH = VCC , VIL = 0 V 0.25 V (Note 7) VCC = 2.5 V, CL = 30 pF, VIH = VCC , VIL = 0 V 0.6 VCC = 3.3 V, CL = 30 pF, VIH = VCC , VIL = 0 V 0.8 VOLV Dynamic LOW Valley Voltage (Note 7) VCC = 1.8 V, CL = 30 pF, VIH = VCC , VIL = 0 V −0.25 V (Note 7) VCC = 2.5 V, CL = 30 pF, VIH = VCC , VIL = 0 V −0.6 VCC = 3.3 V, CL = 30 pF, VIH = VCC , VIL = 0 V −0.8 VOHV Dynamic HIGH Valley Voltage (Note 8) VCC = 1.8 V, CL = 30 pF, VIH = VCC , VIL = 0 V 1.5 V (Note 8) VCC = 2.5 V, CL = 30 pF, VIH = VCC , VIL = 0 V 1.9 VCC = 3.3 V, CL = 30 pF, VIH = VCC , VIL = 0 V 2.2 7. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. 8. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the HIGH state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit C IN Input Capacitance Note 9 6 pF C OUT Output Capacitance Note 9 7 pF C PD Power Dissipation Capacitance Note 9, 10MHz 20 pF
Figure 4. AC Waveforms Table 2. AC WAVEFORMS
6 V or VCC × 2
Figure 5. Test Circuit Table 3. TEST CIRCUIT
http://onsemi.com PACKAGE DIMENSIONS TSSOP DT SUFFIX CASE 1201−01 ISSUE A ÇÇÇ ÇÇÇ SUM0.12 (0.005) V ST SUM0.254 (0.010) T −V− B A L K −U− 48X REF PIN 1 IDENT. 12 4 2548 0.076 (0.003) SEATING D −T− PLANE DIM MIN MAX MIN MAX INCHESMILLIMETERS A 12.40 12.60 0.488 0.496 B 6.00 6.20 0.236 0.244 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.50 BSC 0.0197 BSC J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.17 0.27 0.007 0.011 K1 0.17 0.23 0.007 0.009 L 7.95 8.25 0.313 0.325 M 0 8 0 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. ÉÉÉ ÉÉÉ C G H −W− DETAIL E J K SECTION N−N M 0.25 (0.010) F DETAIL E N N
http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone : 81−3−5773−3850 74VCX16244/D LITERATURE FULFILLMENT : Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone : 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.