74LX1G07_08 STMICROELECTRONICS | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 20
Technical content
Datasheet sections
- 1 Pin connection
- 2 Maximum rating
- 2.1 Recommended operating conditions
- 3 Electrical characteristics
- 4 Package mechanical data
- 5 Revision history
Features
■ 5 V tolerant inputs ■ High speed: tPD = 4.2 ns (max.) at VCC = 3.3 V ■ Low power dissipation: –I CC =1 μA (max.) at TA =2 5° C ■ Power down protection on inputs and outputs ■ Operating voltage range: CC (opr) = 1.65 to 5.5 V ■ Latch-up performance exceeds 300 mA (JESD 17) ■ ESD performance – 2000-V human body model (JESD 22 A114-A) – 200-V machine model (JESD 22 A115-A) – 1000-V charge device model (JESD 22 C101)
Applications
■ Mobile phones
Description
The 74LX1G07 is a low voltage CMOS single buffer/driver (open drain) fabricated with sub- micron silicon gate and double-layer metal wiring C 2MOS technology. The internal circuit composed of 2 stages including buffer output, provides high noise immunity and stable output. Power down protection is provided on input and 0 to 7 V can be accepted on input with no regards to the supply voltage. This device can be used to i n t e r f a c e 5t o3V . SOT23-5L SOT323-5L Flip-chip 4 Table 1. Device summary
1 Pin connection
Figure 1. Pin connection and IEC symbols Table 2. Pin assignments Table 3. Truth table
Figure 2. Input and output equivalent circuit
2 Maximum rating
Program and other relevant quality documents. Table 4. Absolute maximum ratings
2.1 Recommended operating conditions
Table 5. Recommended operating conditions
3 Electrical characteristics
Table 6. DC specifications
5.5 V ±10
Table 7. AC electrical characteristics Table 8. Capacitive characteristics
- C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the
4 Package mechanical data
conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. SOT23-5L package outline Table 10. SOT23-5L mechanical data
Figure 6. SOT323-5L package outline Table 11. SOT323-5L mechanical data
Figure 7. Flip-chip 4 package outline
Table 12. Flip-chip 4 mechanical data
Figure 8. Flip-chip 4 recommended footprint
Figure 9. SOT23-xL tape and reel Table 13. SOT23-xL tape and reel mechanical data
Figure 10. SOT323-xL tape and reel Table 14. SOT323-xL tape and reel mechanical data
5 Revision history
Table 15. Document revision history 04-Sept-2004 4 Document change. 03-May-2006 5 Data reel updating. 17-Jan-2008 6 Document restructured and converted to new ST template. Added 74LX1G07BJR and related package information. 23-Apr-2008 9 Modified: Table 12 on page 13 and Figure 13 on page 18.