74LS283

54LS283 NSC | Alldatasheet

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Y Full-carry look-ahead across the four bits Y Systems achieve partial look-ahead performance with the economy of ripple carry Y Typical add times Two 8-bit words 25 ns Two 16-bit words 45 ns Y Typical power dissipation per 4-bit adder 95 mW Y Alternate Military/Aerospace device (54LS283) is avail- able. Contact a National Semiconductor Sales Office/ Distributor for specifications. Connection Diagram Dual-In-Line Package TL/F/6421–1 Order Number 54LS283DMQB, 54LS283FMQB, 54LS283LMQB, DM54LS283J, DM54LS283W, DM74LS283M or DM74LS283N See NS Package Number E20A, J16A, M16A, N16E or W16A C1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.

Absolute Maximum Ratings (Note) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Supply Voltage 7V Input Voltage 7V Operating Free Air Temperature Range DM54LS and 54LS b55§Ct o a125§C DM74LS 0 §Ct o a70§C Storage Temperature Range b65§Ct o a150§C Note: The ‘‘Absolute Maximum Ratings’’ are those values beyond which the safety of the device cannot be guaran- teed. The device should not be operated at these limits. The parametric values defined in the ‘‘Electrical Characteristics’’ table are not guaranteed at the absolute maximum ratings. The ‘‘Recommended Operating Conditions’’ table will define the conditions for actual device operation. Recommended Operating Conditions Symbol Parameter DM54LS283 DM74LS283 Units Min Nom Max Min Nom Max VCC Supply Voltage 4.5 5 5.5 4.75 5 5.25 V VIH High Level Input Voltage 2 2 V VIL Low Level Input Voltage 0.7 0.8 V IOH High Level Output Current b0.4 b0.4 mA IOL Low Level Output Current 4 8 mA TA Free Air Operating Temperature b55 125 0 70 §C Electrical Characteristics over recommended operating free air temperature range (unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units(Note 1) VI Input Clamp Voltage V CC e Min, I I eb 18 mA b1.5 V VOH High Level Output V CC e Min, I OH e Max DM54 2.5 3.4 VVoltage V IL e Max, V IH e Min DM74 2.7 3.4 VOL Low Level Output V CC e Min, I OL e Max DM54 0.25 0.4 Voltage V IL e Max, V IH e Min DM74 0.35 0.5 V IOL e 4 mA, V CC e Min DM74 0.25 0.4 II Input Current @ Max V CC e Max A, B 0.2 mAInput Voltage V I e 7V C0 0.1 IIH High Level Input V CC e Max A, B 40 mACurrent V I e 2.7V C0 20 IIL Low Level Input V CC e Max A, B b0.8 mACurrent V I e 0.4V C0 b0.4 IOS Short Circuit V CC e Max DM54 b20 b100 mAOutput Current (Note 2) DM74 b20 b100 ICC1 Supply Current V CC e Max (Note 3) 19 34 mA ICC2 Supply Current V CC e Max (Note 4) 22 39 mA Note 1: All typicals are at V CC e 5V, T A e 25§C. Note 2: Not more than one output should be shorted at a time, and the duration should not exceed one second. Note 3: ICC1 is measured with all outputs open, all B inputs low and all other inputs at 4.5V, or all inputs at 4.5V. Note 4: ICC2 is measured with all outputs open and all inputs grounded.

Switching Characteristics at V CC e 5V and T A e 25§C (See Section 1 for Test Waveforms and Output Load) From (Input) RL e 2k X Symbol Parameter To (Output) CL e 15 pF C L e 50 pF Units Min Max Min Max tPLH Propagation Delay Time C0 to 24 28 nsLow to High Level Output R1, R2 tPHL Propagation Delay Time C0 to 24 30 nsHigh to Low Level Output R1, R2 tPLH Propagation Delay Time C0 to 24 28 nsLow to High Level Output R3 tPHL Propagation Delay Time C0 to 24 30 nsHigh to Low Level Output R3 tPLH Propagation Delay Time C0 to 24 28 nsLow to High Level Output R4 tPHL Propagation Delay Time C0 to 24 30 nsHigh to Low Level Output R4 tPLH Propagation Delay Time A i or B i 24 28 nsLow to High Level Output to Ri tPHL Propagation Delay Time A i or B i 24 30 nsHigh to Low Level Output to Ri tPLH Propagation Delay Time C0 to 17 24 nsLow to High Level Output C4 tPHL Propagation Delay Time C0 to 17 25 nsHigh to Low Level Output C4 tPLH Propagation Delay Time A i or B i 17 24 nsLow to High Level Output to C4 tPHL Propagation Delay Time A i or B i 17 26 nsHigh to Low Level Output to C4 Function Table TL/F/6421–3 H e High Level, L e Low Level Note: Input conditions at A1, B1, A2, B2, and C0 are used to determine outputs R1 and R2 and the value of the internal carry C2. The values at C2, A3, B3, A4, and B4 are then used to determine outputs R3, R4, and C4.

TL/F/6421–2

Physical Dimensions inches (millimeters) Ceramic Leadless Chip Carrier Package (E) Order Number 54LS283LMQB 16-Lead Ceramic Dual-In-Line Package (J) Order Number 54LS283DMQB or DM54LS283J

Physical Dimensions inches (millimeters) (Continued) 16-Lead Small Outline Molded Package (M) Order Number DM74LS283M 16-Lead Molded Dual-In-Line Package (N) Order Number DM74LS283N

54LS283/DM54LS283/DM74LS283 4-Bit Binary Adders with Fast Carry Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Flat Package (W) Order Number 54LS283FMQB or DM54LS283W LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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