HD74LS152 RENESAS | Alldatasheet

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  • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS152FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement (Top view) GND C W W V CC 6D6 7D7 B AA C B Data Inputs Data Select Data Inputs Outputs Function Table Select inputs Output Select inputs Output C B A W C B A W L L L D0 H L L D4 L L H D1 H L H D5 L H L D2 H H L D6 L H H D3 H H H D7 Notes: D 0 to D7; the level of the D respective input H; high level L; low level

Rev.2.00, Feb.18.2005, page 2 of 5 Block Diagram Output W Data Select (Binary) Data Inputs D A B C Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage VCC 7 V Input voltage VIN 7 V Power dissipation PT 400 mW Storage temperature Tstg –65 to +150 °C Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Symbol Min Typ Max Unit Supply voltage VCC 4.75 5.00 5.25 V IOH — — –400 µA Output current IOL — — 8 mA Operating temperature Topr –20 25 75 °C

Rev.2.00, Feb.18.2005, page 3 of 5

Electrical Characteristics

(Ta = –20 to +75 °C) Item Symbol min. typ.* max. Unit Condition VIH 2.0 — — V Input voltage VIL — — 0.8 V VOH 2.7 — — V VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = –400 µA — — 0.4 I OL = 4 mA Output voltage VOL — — 0.5 V IOL = 8 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IIH — — 20 µA V CC = 5.25 V, VI = 2.7 V IIL — — –0.4 mA V CC = 5.25 V, VI = 0.4 V Input current II — — 0.1 mA V CC = 5.25 V, VI = 7 V Short-circuit output current IOS –20 — –100 mA V CC = 5.25 V Supply current** ICC — 6.0 10 mA V CC = 5.25 V Input clamp voltage V IK — — –1.5 V V CC = 4.75 V, IIN = –18 mA Notes: * V CC = 5 V, Ta = 25°C ** I CC is measured with all outputs open and all inputs at 4.5 V. Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Symbol Inputs Outputs min. typ. max. Unit Condition tPLH — 14 23 tPHL A, B, C W — 20 32 tPLH — 13 21 Propagation delay time tPHL Data W — 12 20 ns CL = 15 pF, RL = 2 kΩ

Rev.2.00, Feb.18.2005, page 4 of 5 Testing Method Test Circuit 4.5V W Output VCC RL CL Input P.G. Zout = 50Ω See Function Table A B C Notes: 1. C L includes probe and jig capacitance. 2. All diodes are 1S2074(H). Waveform tPLH tPHL VOH VOL 0 V 3 V VOH VOL tPHL tPLH 10% 90% 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 1.3 V 10% 90% Input In phase output Out of phase output tTLH tTHL Note: Input pulse; t TLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle 50%

Rev.2.00, Feb.18.2005, page 5 of 5 Package Dimensions 1.42 0.15 1.27 7.50 8.00 0.400.34p A 1 10.5 FP-14DAV RENESAS CodeJEITA Package Code Previous Code MaxNomMin Dimension in Millimeters Symbol Reference 2.20 0.900.700.50 5.50 0.200.100.00 0.46 0.250.200.15 7.80 8°0° 0.12 1.15 10.06 0.23g MASS[Typ.] E L Z H y x θ c b A E D b c e L A P-SOP14-5.5x10.06-1.27 PRSP0014DF-B Index mark E 14 8 F p M x y D E H Z b A p Terminal cross section ( Ni/Pd/Au plating ) b c Detail F L A θ NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. e

Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan http://www.renesas.com Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Renesas Technology Singapore Pte. Ltd.

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